Abstract: A sliding mode observer and fractional-order phase-locked loop (FO-PLL) method is proposed for the sensorless speed control of a permanent magnet synchronous motor (PMSM).The saturation function is adopted in order to reduce the chattering phenomenon caused by the sliding mode observer. In this proposed FO-PLL, method, a regulable fractional order r is involved, which means that the FO-PLL provides an extra degree of freedom. In fact, the conventional phase-locked loop (PLL) applied in sensorless PMSM control can be seen as a special case of the proposed FO-PLL. By selecting a proper fractional order r a better performance may be achieved. The computer simulation results demonstrate the effectiveness of the proposed method.Key words: fractional calculus; fractional order phase-locked loop; sensorless control; sliding mode observer; permanent magnet synchronous motor; speed controll
標(biāo)簽： 滑模觀測(cè)器 傳感器 pmsm 矢量控制
上傳時(shí)間： 2022-06-18
上傳用戶：
電力電子技術(shù)的發(fā)展使電機(jī)驅(qū)動(dòng)系統(tǒng)擺脫了常規(guī)兩電平逆變器拓?fù)涞南拗疲姍C(jī)驅(qū)動(dòng)系統(tǒng)與多電平逆變器的結(jié)合成了新的思路。多電平逆變器的輸出電平數(shù)多，因此其輸出波形更好，在大容量交流調(diào)速系統(tǒng)中優(yōu)勢(shì)明顯。作為多電平逆變器的研究基礎(chǔ)，三電平逆變器應(yīng)用最為廣泛，而其中首選的是二極管鉗位型三電平逆變器。因此采用二極管鉗位型三電平逆變器驅(qū)動(dòng)PMSM的模型預(yù)測(cè)控制系統(tǒng)作為研究對(duì)象。在PMSM驅(qū)動(dòng)系統(tǒng)中，位置與轉(zhuǎn)速的檢測(cè)是非常重要的，一般采用的方法是通過機(jī)械傳感器來進(jìn)行測(cè)量，但這種測(cè)量方法在實(shí)際應(yīng)用中有很多缺陷，會(huì)降低電機(jī)系統(tǒng)的穩(wěn)定性和可靠性，同時(shí)會(huì)增加成本。而無速度傳感器技術(shù)是通過檢測(cè)電機(jī)中的電流或電壓，來對(duì)電機(jī)的實(shí)際轉(zhuǎn)速和位置信息進(jìn)行估計(jì)，這種技術(shù)省略了常規(guī)使用的機(jī)械傳感器，能夠?qū)崿F(xiàn)電機(jī)系統(tǒng)的高精度、高動(dòng)態(tài)性能的控制。因此PMSM的無速度傳感器控制技術(shù)成為了近些年的研究熱點(diǎn)。主要研究內(nèi)容分為以下幾個(gè)方面：（1）基于同一Pl轉(zhuǎn)速調(diào)節(jié)器，設(shè)計(jì)三電平逆變器驅(qū)動(dòng)PMSM模型預(yù)測(cè)轉(zhuǎn)矩控制系統(tǒng)，與兩電平逆變器驅(qū)動(dòng)PMSMMPTC系統(tǒng)對(duì)比，并對(duì)兩個(gè)系統(tǒng)的運(yùn)行性能進(jìn)行對(duì)比分析。（2）為進(jìn)一步提高系統(tǒng)響應(yīng)性能，克服未知負(fù)載轉(zhuǎn)矩?cái)_動(dòng)、增強(qiáng)系統(tǒng)魯棒性，設(shè)計(jì)擴(kuò)張狀態(tài)負(fù)載轉(zhuǎn)矩觀測(cè)器，進(jìn)而得到將負(fù)載轉(zhuǎn)矩觀測(cè)器和基于冪函數(shù)滑模轉(zhuǎn)速調(diào)節(jié)器相結(jié)合的復(fù)合控制器。（3）設(shè)計(jì)基于分?jǐn)?shù)階滑模觀測(cè)器的PMSMMPCC系統(tǒng)，實(shí)現(xiàn)對(duì)電機(jī)轉(zhuǎn)速的快速準(zhǔn)確估計(jì)。
標(biāo)簽： 逆變器 驅(qū)動(dòng) pmsm
上傳時(shí)間： 2022-06-24
上傳用戶：xsr1983
eeworm.com VIP專區(qū) 單片機(jī)源碼系列 55資源包含以下內(nèi)容：1. 初學(xué)單片機(jī)幾個(gè)不易掌握的概念.pdf2. 單片機(jī)應(yīng)用編程技巧(FAQ).pdf3. 單片機(jī)課程設(shè)計(jì)的項(xiàng)目選取與教學(xué)改革.pdf4. 采用XC164CS的CAN系統(tǒng)解決方案.pdf5. DS18B20中文手冊(cè).pdf6. 《單片機(jī)原理與應(yīng)用》教學(xué)大綱--周美娟.pdf7. 采用TMS320F2812的CAN系統(tǒng)解決方案.pdf8. 基于ATmega8515L的舞蹈機(jī)器人控制系統(tǒng)設(shè)計(jì)與研究.pdf9. 單片機(jī)原理與應(yīng)用（李精華）.pdf10. 基于AT89C2051單片機(jī)的防盜自動(dòng)報(bào)警電子密碼鎖系統(tǒng)的設(shè).pdf11. 基于80C196KC的直流電機(jī)PWM調(diào)速控制器的設(shè)計(jì)與應(yīng)用.pdf12. 《單片機(jī)及可編程控制器》課程實(shí)驗(yàn)教學(xué)大綱.pdf13. 觸摸屏的基本指令演示.pdf14. 單片機(jī)實(shí)現(xiàn)的LED點(diǎn)陣圖文顯示系統(tǒng)設(shè)計(jì).pdf15. 普通單片機(jī)讀寫U盤使用指南.pdf16. 基于單片機(jī)高速高精度步進(jìn)電機(jī)控制系統(tǒng)的設(shè)計(jì).pdf17. 單片機(jī)電話遠(yuǎn)程通信系統(tǒng).pdf18. 單片機(jī)程序掩膜.pdf19. 多CPU單片機(jī)系統(tǒng)設(shè)計(jì)在社區(qū)安防系統(tǒng)中的應(yīng)用.pdf20. MCS-51單片機(jī)的系統(tǒng)擴(kuò)展技術(shù)（一）.pdf21. 倚天版編程試驗(yàn)一體化自學(xué)8051單片機(jī)開發(fā)套件.pdf22. 基于PIC16F877單片機(jī)的空調(diào)車檢測(cè)儀設(shè)計(jì).pdf23. 交流伺服電機(jī)的單片機(jī)控制及其應(yīng)用.pdf24. uC/GUI在單片機(jī)系統(tǒng)上的移植.pdf25. 應(yīng)用PCI 9656的數(shù)據(jù)接收卡設(shè)計(jì).pdf26. 特殊功能集成電路.pdf27. 基于MC8051軟核的星載智能1394終端.pdf28. 單片機(jī)快速進(jìn)階-C8051F02X系列單片機(jī)基本應(yīng)用指導(dǎo)系統(tǒng).pdf29. 應(yīng)用8098單片機(jī)實(shí)現(xiàn)直流伺服電機(jī)PWM調(diào)速控制.pdf30. 單片機(jī)演示實(shí)驗(yàn).pdf31. 單片機(jī)在木材干燥中的應(yīng)用.pdf32. 可編程控制器應(yīng)用.PPT33. LG-32K單片機(jī)仿真機(jī)使用說明.pdf34. 多功能51系列實(shí)驗(yàn)板.pdf35. USB全自動(dòng)在線編程STC單片機(jī)實(shí)驗(yàn)板簡(jiǎn)介.pdf36. 單片機(jī)開發(fā)板使用手冊(cè).pdf37. SH69P8XX系列單片機(jī)定時(shí)/計(jì)數(shù)器使用指南.pdf38. 《單片機(jī)原理與應(yīng)用》實(shí)訓(xùn)教學(xué)大綱.pdf39. SUPER-08三星單片機(jī)學(xué)習(xí)板介紹.pdf40. Study 51單片機(jī)仿真機(jī)說明書.pdf41. 宏晶STC90C58AD系列單片機(jī)器件手冊(cè).pdf42. HT48RA0-3/HT48CA0-3遙控型八位單片機(jī).pdf43. STC89C52芯片的編程.pdf44. 手把手教你學(xué)單片機(jī)的C語言程序設(shè)計(jì)--編譯預(yù)算處理.pdf45. 基于MC9S12NE64型單片機(jī)的嵌入式以太網(wǎng)連接.pdf46. STC8051系列單片機(jī)器件手冊(cè).pdf47. 單片機(jī)原理與應(yīng)用（曾屹）.pdf48. ISD1420/ISD1110高級(jí)語音合成編程拷貝機(jī)-QL1.pdf49. STC12C5A60AD/STC12C5201AD系列單片機(jī).pdf50. SPCE061A單片機(jī)在USB通訊中的應(yīng)用.pdf51. QL310多功能識(shí)別主人電話遙控報(bào)警芯片用戶手冊(cè).pdf52. SPMC65P2404A在電動(dòng)自行車中的應(yīng)用.pdf53. 基于STM32微控制器的MP3播放器設(shè)計(jì).pdf54. ISD系列語音錄放芯片的內(nèi)容復(fù)制.pdf55. 普通單片機(jī)讀寫U盤開發(fā)板.pdf56. 基于單片機(jī)控制的智能搬運(yùn)機(jī)器人設(shè)計(jì)與開發(fā).pdf57. 基于ispPAC和單片機(jī)的熱電偶實(shí)驗(yàn)儀.pdf58. AVR高檔性能低檔價(jià)格的單片機(jī)ATmega8的開發(fā)與應(yīng)用.pdf59. 用HC08GR8單片機(jī)實(shí)現(xiàn)的網(wǎng)絡(luò)家電控制器.pdf60. 鍵盤顯示驅(qū)動(dòng)芯片HD7279A及其應(yīng)用.pdf61. SL-AVRL AVR單片機(jī)下載線使用說明.pdf62. SUNPLUSIT編程工具Q-Writer使用說明書.pdf63. 無線收發(fā)模塊nRF401在礦山中的應(yīng)用.pdf64. SinoWealth 4-bit單片機(jī)基本介紹.pdf65. SPMC65系列單片機(jī)編程工具Q-Writer使用說明書.pdf66. ADS7852在雙目測(cè)距中的應(yīng)用.pdf67. QTH單片機(jī)仿真開發(fā)系統(tǒng)V2003.1概述.pdf68. 基于NRF9E5射頻無線遙控系統(tǒng)的設(shè)計(jì).pdf69. ATR2406在無線音頻傳輸系統(tǒng)中的應(yīng)用.pdf70. 來電解碼器及其在客戶關(guān)系管理中的應(yīng)用.pdf71. 會(huì)議芯片M34116聲音產(chǎn)生功能的應(yīng)用.pdf72. 基于ADE7753的電力機(jī)車能耗監(jiān)測(cè)終端設(shè)計(jì).pdf73. V6155的原理和應(yīng)用.pdf74. P87LPC762/P87LPC764 OTP單片機(jī)原理.pdf75. 基于DS18B20的自動(dòng)調(diào)溫光療系統(tǒng)設(shè)計(jì).pdf76. P87C51RA2/P87C51RB2/P87C51RC2/.pdf77. 基于SPCE061A的SPLC501液晶顯示模塊的應(yīng)用設(shè)計(jì).pdf78. 基于單片機(jī)多譜勒效應(yīng)實(shí)驗(yàn)儀的設(shè)計(jì).pdf79. 瑞薩QzROM單片機(jī)應(yīng)用于家電及消費(fèi)類電子的解決方案.pdf80. NS8C15步進(jìn)電機(jī)驅(qū)動(dòng)器.pdf81. PIC系列單片機(jī)簡(jiǎn)介.pdf82. 單片機(jī)通過CH375讀寫U盤時(shí)的注意事項(xiàng).pdf83. Microchip PIC18家族指令集.doc84. MICROCONTROL MSP430系列單片機(jī)的指令系統(tǒng).pdf85. P87LPC768 OTP單片機(jī)原理.pdf86. MPTZ100-24E1無線單片機(jī)標(biāo)準(zhǔn)模組.pdf87. PC機(jī)與多單片機(jī)之間串口通訊的設(shè)計(jì)方法.pdf88. MPTZ100-9E5無線單片機(jī)標(biāo)準(zhǔn)模組.pdf89. Mini Isp Box單片機(jī)下載盒產(chǎn)品使用說明書.pdf90. ME-3200單片機(jī)仿真器使用手冊(cè).pdf91. MDT20xx系列OTP單片機(jī).pdf92. AGV及其滑模變結(jié)構(gòu)控制器設(shè)計(jì).pdf93. MDT10P21A OTP單片機(jī).pdf94. 單片機(jī)的發(fā)展暨SPCE061A單片機(jī)的介紹.ppt95. 基于單片機(jī)的注塑機(jī)節(jié)能控制技術(shù)研究.pdf96. 單片機(jī)基礎(chǔ)知識(shí).ppt97. 凌陽單片機(jī)應(yīng)用實(shí)驗(yàn)教學(xué)大綱.pdf98. ADuC831/MCS-51單片機(jī)實(shí)驗(yàn)--擴(kuò)展存儲(chǔ)器讀寫實(shí)驗(yàn).pdf99. 單片機(jī)應(yīng)用“做中學(xué)”--“單片機(jī)應(yīng)用”課程教學(xué)方式探討.pdf100. 單片機(jī)與PC機(jī)通信中的糾錯(cuò)編碼.pdf
上傳時(shí)間： 2013-04-15
上傳用戶：eeworm
現(xiàn)代的電子設(shè)計(jì)和芯片制造技術(shù)正在飛速發(fā)展，電子產(chǎn)品的復(fù)雜度、時(shí)鐘和總線頻率等等都呈快速上升趨勢(shì)，但系統(tǒng)的電壓卻不斷在減小，所有的這一切加上產(chǎn)品投放市場(chǎng)的時(shí)間要求給設(shè)計(jì)師帶來了前所未有的巨大壓力。要想保證產(chǎn)品的一次性成功就必須能預(yù)見設(shè)計(jì)中可能出現(xiàn)的各種問題，并及時(shí)給出合理的解決方案，對(duì)于高速的數(shù)字電路來說，最令人頭大的莫過于如何確保瞬時(shí)跳變的數(shù)字信號(hào)通過較長的一段傳輸線，還能完整地被接收，并保證良好的電磁兼容性，這就是目前頗受關(guān)注的信號(hào)完整性（SI）問題。本章就是圍繞信號(hào)完整性的問題，讓大家對(duì)高速電路有個(gè)基本的認(rèn)識(shí)，并介紹一些相關(guān)的基本概念。 第一章 高速數(shù)字電路概述.....................................................................................51.1 何為高速電路...............................................................................................51.2 高速帶來的問題及設(shè)計(jì)流程剖析...............................................................61.3 相關(guān)的一些基本概念...................................................................................8第二章 傳輸線理論...............................................................................................122.1 分布式系統(tǒng)和集總電路.............................................................................122.2 傳輸線的RLCG 模型和電報(bào)方程...............................................................132.3 傳輸線的特征阻抗.....................................................................................142.3.1 特性阻抗的本質(zhì).................................................................................142.3.2 特征阻抗相關(guān)計(jì)算.............................................................................152.3.3 特性阻抗對(duì)信號(hào)完整性的影響.........................................................172.4 傳輸線電報(bào)方程及推導(dǎo).............................................................................182.5 趨膚效應(yīng)和集束效應(yīng).................................................................................232.6 信號(hào)的反射.................................................................................................252.6.1 反射機(jī)理和電報(bào)方程.........................................................................252.6.2 反射導(dǎo)致信號(hào)的失真問題.................................................................302.6.2.1 過沖和下沖.....................................................................................302.6.2.2 振蕩：.............................................................................................312.6.3 反射的抑制和匹配.............................................................................342.6.3.1 串行匹配.........................................................................................352.6.3.1 并行匹配.........................................................................................362.6.3.3 差分線的匹配.................................................................................392.6.3.4 多負(fù)載的匹配.................................................................................41第三章 串?dāng)_的分析...............................................................................................423.1 串?dāng)_的基本概念.........................................................................................423.2 前向串?dāng)_和后向串?dāng)_.................................................................................433.3 后向串?dāng)_的反射.........................................................................................463.4 后向串?dāng)_的飽和.........................................................................................463.5 共模和差模電流對(duì)串?dāng)_的影響.................................................................483.6 連接器的串?dāng)_問題.....................................................................................513.7 串?dāng)_的具體計(jì)算.........................................................................................543.8 避免串?dāng)_的措施.........................................................................................57第四章 EMI 抑制....................................................................................................604.1 EMI/EMC 的基本概念..................................................................................604.2 EMI 的產(chǎn)生..................................................................................................614.2.1 電壓瞬變.............................................................................................614.2.2 信號(hào)的回流.........................................................................................624.2.3 共模和差摸EMI ..................................................................................634.3 EMI 的控制..................................................................................................654.3.1 屏蔽.....................................................................................................654.3.1.1 電場(chǎng)屏蔽.........................................................................................654.3.1.2 磁場(chǎng)屏蔽.........................................................................................674.3.1.3 電磁場(chǎng)屏蔽.....................................................................................674.3.1.4 電磁屏蔽體和屏蔽效率.................................................................684.3.2 濾波.....................................................................................................714.3.2.1 去耦電容.........................................................................................714.3.2.3 磁性元件.........................................................................................734.3.3 接地.....................................................................................................744.4 PCB 設(shè)計(jì)中的EMI.......................................................................................754.4.1 傳輸線RLC 參數(shù)和EMI ........................................................................764.4.2 疊層設(shè)計(jì)抑制EMI ..............................................................................774.4.3 電容和接地過孔對(duì)回流的作用.........................................................784.4.4 布局和走線規(guī)則.................................................................................79第五章 電源完整性理論基礎(chǔ)...............................................................................825.1 電源噪聲的起因及危害.............................................................................825.2 電源阻抗設(shè)計(jì).............................................................................................855.3 同步開關(guān)噪聲分析.....................................................................................875.3.1 芯片內(nèi)部開關(guān)噪聲.............................................................................885.3.2 芯片外部開關(guān)噪聲.............................................................................895.3.3 等效電感衡量SSN ..............................................................................905.4 旁路電容的特性和應(yīng)用.............................................................................925.4.1 電容的頻率特性.................................................................................935.4.3 電容的介質(zhì)和封裝影響.....................................................................955.4.3 電容并聯(lián)特性及反諧振.....................................................................955.4.4 如何選擇電容.....................................................................................975.4.5 電容的擺放及Layout ........................................................................99第六章 系統(tǒng)時(shí)序.................................................................................................1006.1 普通時(shí)序系統(tǒng)...........................................................................................1006.1.1 時(shí)序參數(shù)的確定...............................................................................1016.1.2 時(shí)序約束條件...................................................................................1066.2 源同步時(shí)序系統(tǒng).......................................................................................1086.2.1 源同步系統(tǒng)的基本結(jié)構(gòu)...................................................................1096.2.2 源同步時(shí)序要求...............................................................................110第七章 IBIS 模型................................................................................................1137.1 IBIS 模型的由來...................................................................................... 1137.2 IBIS 與SPICE 的比較.............................................................................. 1137.3 IBIS 模型的構(gòu)成...................................................................................... 1157.4 建立IBIS 模型......................................................................................... 1187.4 使用IBIS 模型......................................................................................... 1197.5 IBIS 相關(guān)工具及鏈接..............................................................................120第八章 高速設(shè)計(jì)理論在實(shí)際中的運(yùn)用.............................................................1228.1 疊層設(shè)計(jì)方案...........................................................................................1228.2 過孔對(duì)信號(hào)傳輸?shù)挠绊?..........................................................................1278.3 一般布局規(guī)則...........................................................................................1298.4 接地技術(shù)...................................................................................................1308.5 PCB 走線策略............................................................................................134
標(biāo)簽： 信號(hào)完整性
上傳時(shí)間： 2014-05-15
上傳用戶：dudu1210004
第一部分 信號(hào)完整性知識(shí)基礎(chǔ).................................................................................5第一章 高速數(shù)字電路概述.....................................................................................51.1 何為高速電路...............................................................................................51.2 高速帶來的問題及設(shè)計(jì)流程剖析...............................................................61.3 相關(guān)的一些基本概念...................................................................................8第二章 傳輸線理論...............................................................................................122.1 分布式系統(tǒng)和集總電路.............................................................................122.2 傳輸線的RLCG 模型和電報(bào)方程...............................................................132.3 傳輸線的特征阻抗.....................................................................................142.3.1 特性阻抗的本質(zhì).................................................................................142.3.2 特征阻抗相關(guān)計(jì)算.............................................................................152.3.3 特性阻抗對(duì)信號(hào)完整性的影響.........................................................172.4 傳輸線電報(bào)方程及推導(dǎo).............................................................................182.5 趨膚效應(yīng)和集束效應(yīng).................................................................................232.6 信號(hào)的反射.................................................................................................252.6.1 反射機(jī)理和電報(bào)方程.........................................................................252.6.2 反射導(dǎo)致信號(hào)的失真問題.................................................................302.6.2.1 過沖和下沖.....................................................................................302.6.2.2 振蕩：.............................................................................................312.6.3 反射的抑制和匹配.............................................................................342.6.3.1 串行匹配.........................................................................................352.6.3.1 并行匹配.........................................................................................362.6.3.3 差分線的匹配.................................................................................392.6.3.4 多負(fù)載的匹配.................................................................................41第三章 串?dāng)_的分析...............................................................................................423.1 串?dāng)_的基本概念.........................................................................................423.2 前向串?dāng)_和后向串?dāng)_.................................................................................433.3 后向串?dāng)_的反射.........................................................................................463.4 后向串?dāng)_的飽和.........................................................................................463.5 共模和差模電流對(duì)串?dāng)_的影響.................................................................483.6 連接器的串?dāng)_問題.....................................................................................513.7 串?dāng)_的具體計(jì)算.........................................................................................543.8 避免串?dāng)_的措施.........................................................................................57第四章 EMI 抑制....................................................................................................604.1 EMI/EMC 的基本概念..................................................................................604.2 EMI 的產(chǎn)生..................................................................................................614.2.1 電壓瞬變.............................................................................................614.2.2 信號(hào)的回流.........................................................................................624.2.3 共模和差摸EMI ..................................................................................634.3 EMI 的控制..................................................................................................654.3.1 屏蔽.....................................................................................................654.3.1.1 電場(chǎng)屏蔽.........................................................................................654.3.1.2 磁場(chǎng)屏蔽.........................................................................................674.3.1.3 電磁場(chǎng)屏蔽.....................................................................................674.3.1.4 電磁屏蔽體和屏蔽效率.................................................................684.3.2 濾波.....................................................................................................714.3.2.1 去耦電容.........................................................................................714.3.2.3 磁性元件.........................................................................................734.3.3 接地.....................................................................................................744.4 PCB 設(shè)計(jì)中的EMI.......................................................................................754.4.1 傳輸線RLC 參數(shù)和EMI ........................................................................764.4.2 疊層設(shè)計(jì)抑制EMI ..............................................................................774.4.3 電容和接地過孔對(duì)回流的作用.........................................................784.4.4 布局和走線規(guī)則.................................................................................79第五章 電源完整性理論基礎(chǔ)...............................................................................825.1 電源噪聲的起因及危害.............................................................................825.2 電源阻抗設(shè)計(jì).............................................................................................855.3 同步開關(guān)噪聲分析.....................................................................................875.3.1 芯片內(nèi)部開關(guān)噪聲.............................................................................885.3.2 芯片外部開關(guān)噪聲.............................................................................895.3.3 等效電感衡量SSN ..............................................................................905.4 旁路電容的特性和應(yīng)用.............................................................................925.4.1 電容的頻率特性.................................................................................935.4.3 電容的介質(zhì)和封裝影響.....................................................................955.4.3 電容并聯(lián)特性及反諧振.....................................................................955.4.4 如何選擇電容.....................................................................................975.4.5 電容的擺放及Layout ........................................................................99第六章 系統(tǒng)時(shí)序.................................................................................................1006.1 普通時(shí)序系統(tǒng)...........................................................................................1006.1.1 時(shí)序參數(shù)的確定...............................................................................1016.1.2 時(shí)序約束條件...................................................................................1063.2 高速設(shè)計(jì)的問題.......................................................................................2093.3 SPECCTRAQuest SI Expert 的組件.......................................................2103.3.1 SPECCTRAQuest Model Integrity .................................................2103.3.2 SPECCTRAQuest Floorplanner/Editor .........................................2153.3.3 Constraint Manager .......................................................................2163.3.4 SigXplorer Expert Topology Development Environment .......2233.3.5 SigNoise 仿真子系統(tǒng)......................................................................2253.3.6 EMControl .........................................................................................2303.3.7 SPECCTRA Expert 自動(dòng)布線器.......................................................2303.4 高速設(shè)計(jì)的大致流程...............................................................................2303.4.1 拓?fù)浣Y(jié)構(gòu)的探索...............................................................................2313.4.2 空間解決方案的探索.......................................................................2313.4.3 使用拓?fù)淠０弪?qū)動(dòng)設(shè)計(jì)...................................................................2313.4.4 時(shí)序驅(qū)動(dòng)布局...................................................................................2323.4.5 以約束條件驅(qū)動(dòng)設(shè)計(jì).......................................................................2323.4.6 設(shè)計(jì)后分析.......................................................................................233第四章 SPECCTRAQUEST SIGNAL EXPLORER 的進(jìn)階運(yùn)用..........................................2344.1 SPECCTRAQuest Signal Explorer 的功能包括：................................2344.2 圖形化的拓?fù)浣Y(jié)構(gòu)探索...........................................................................2344.3 全面的信號(hào)完整性(Signal Integrity)分析.......................................2344.4 完全兼容 IBIS 模型...............................................................................2344.5 PCB 設(shè)計(jì)前和設(shè)計(jì)的拓?fù)浣Y(jié)構(gòu)提取.......................................................2354.6 仿真設(shè)置顧問...........................................................................................2354.7 改變?cè)O(shè)計(jì)的管理.......................................................................................2354.8 關(guān)鍵技術(shù)特點(diǎn)...........................................................................................2364.8.1 拓?fù)浣Y(jié)構(gòu)探索...................................................................................2364.8.2 SigWave 波形顯示器........................................................................2364.8.3 集成化的在線分析(Integration and In-process Analysis) .236第五章 部分特殊的運(yùn)用...............................................................................2375.1 Script 指令的使用..................................................................................2375.2 差分信號(hào)的仿真.......................................................................................2435.3 眼圖模式的使用.......................................................................................249第四部分：HYPERLYNX 仿真工具使用指南............................................................251第一章 使用LINESIM 進(jìn)行前仿真.......................................................................2511.1 用LineSim 進(jìn)行仿真工作的基本方法...................................................2511.2 處理信號(hào)完整性原理圖的具體問題.......................................................2591.3 在LineSim 中如何對(duì)傳輸線進(jìn)行設(shè)置...................................................2601.4 在LineSim 中模擬IC 元件.....................................................................2631.5 在LineSim 中進(jìn)行串?dāng)_仿真...................................................................268第二章 使用BOARDSIM 進(jìn)行后仿真......................................................................2732.1 用BOARDSIM 進(jìn)行后仿真工作的基本方法...................................................2732.2 BoardSim 的進(jìn)一步介紹..........................................................................2922.3 BoardSim 中的串?dāng)_仿真..........................................................................309
標(biāo)簽： PCB 內(nèi)存 仿真技術(shù)
上傳時(shí)間： 2014-04-18
上傳用戶：wpt
現(xiàn)代的電子設(shè)計(jì)和芯片制造技術(shù)正在飛速發(fā)展，電子產(chǎn)品的復(fù)雜度、時(shí)鐘和總線頻率等等都呈快速上升趨勢(shì)，但系統(tǒng)的電壓卻不斷在減小，所有的這一切加上產(chǎn)品投放市場(chǎng)的時(shí)間要求給設(shè)計(jì)師帶來了前所未有的巨大壓力。要想保證產(chǎn)品的一次性成功就必須能預(yù)見設(shè)計(jì)中可能出現(xiàn)的各種問題，并及時(shí)給出合理的解決方案，對(duì)于高速的數(shù)字電路來說，最令人頭大的莫過于如何確保瞬時(shí)跳變的數(shù)字信號(hào)通過較長的一段傳輸線，還能完整地被接收，并保證良好的電磁兼容性，這就是目前頗受關(guān)注的信號(hào)完整性（SI）問題。本章就是圍繞信號(hào)完整性的問題，讓大家對(duì)高速電路有個(gè)基本的認(rèn)識(shí)，并介紹一些相關(guān)的基本概念。 第一章 高速數(shù)字電路概述.....................................................................................51.1 何為高速電路...............................................................................................51.2 高速帶來的問題及設(shè)計(jì)流程剖析...............................................................61.3 相關(guān)的一些基本概念...................................................................................8第二章 傳輸線理論...............................................................................................122.1 分布式系統(tǒng)和集總電路.............................................................................122.2 傳輸線的RLCG 模型和電報(bào)方程...............................................................132.3 傳輸線的特征阻抗.....................................................................................142.3.1 特性阻抗的本質(zhì).................................................................................142.3.2 特征阻抗相關(guān)計(jì)算.............................................................................152.3.3 特性阻抗對(duì)信號(hào)完整性的影響.........................................................172.4 傳輸線電報(bào)方程及推導(dǎo).............................................................................182.5 趨膚效應(yīng)和集束效應(yīng).................................................................................232.6 信號(hào)的反射.................................................................................................252.6.1 反射機(jī)理和電報(bào)方程.........................................................................252.6.2 反射導(dǎo)致信號(hào)的失真問題.................................................................302.6.2.1 過沖和下沖.....................................................................................302.6.2.2 振蕩：.............................................................................................312.6.3 反射的抑制和匹配.............................................................................342.6.3.1 串行匹配.........................................................................................352.6.3.1 并行匹配.........................................................................................362.6.3.3 差分線的匹配.................................................................................392.6.3.4 多負(fù)載的匹配.................................................................................41第三章 串?dāng)_的分析...............................................................................................423.1 串?dāng)_的基本概念.........................................................................................423.2 前向串?dāng)_和后向串?dāng)_.................................................................................433.3 后向串?dāng)_的反射.........................................................................................463.4 后向串?dāng)_的飽和.........................................................................................463.5 共模和差模電流對(duì)串?dāng)_的影響.................................................................483.6 連接器的串?dāng)_問題.....................................................................................513.7 串?dāng)_的具體計(jì)算.........................................................................................543.8 避免串?dāng)_的措施.........................................................................................57第四章 EMI 抑制....................................................................................................604.1 EMI/EMC 的基本概念..................................................................................604.2 EMI 的產(chǎn)生..................................................................................................614.2.1 電壓瞬變.............................................................................................614.2.2 信號(hào)的回流.........................................................................................624.2.3 共模和差摸EMI ..................................................................................634.3 EMI 的控制..................................................................................................654.3.1 屏蔽.....................................................................................................654.3.1.1 電場(chǎng)屏蔽.........................................................................................654.3.1.2 磁場(chǎng)屏蔽.........................................................................................674.3.1.3 電磁場(chǎng)屏蔽.....................................................................................674.3.1.4 電磁屏蔽體和屏蔽效率.................................................................684.3.2 濾波.....................................................................................................714.3.2.1 去耦電容.........................................................................................714.3.2.3 磁性元件.........................................................................................734.3.3 接地.....................................................................................................744.4 PCB 設(shè)計(jì)中的EMI.......................................................................................754.4.1 傳輸線RLC 參數(shù)和EMI ........................................................................764.4.2 疊層設(shè)計(jì)抑制EMI ..............................................................................774.4.3 電容和接地過孔對(duì)回流的作用.........................................................784.4.4 布局和走線規(guī)則.................................................................................79第五章 電源完整性理論基礎(chǔ)...............................................................................825.1 電源噪聲的起因及危害.............................................................................825.2 電源阻抗設(shè)計(jì).............................................................................................855.3 同步開關(guān)噪聲分析.....................................................................................875.3.1 芯片內(nèi)部開關(guān)噪聲.............................................................................885.3.2 芯片外部開關(guān)噪聲.............................................................................895.3.3 等效電感衡量SSN ..............................................................................905.4 旁路電容的特性和應(yīng)用.............................................................................925.4.1 電容的頻率特性.................................................................................935.4.3 電容的介質(zhì)和封裝影響.....................................................................955.4.3 電容并聯(lián)特性及反諧振.....................................................................955.4.4 如何選擇電容.....................................................................................975.4.5 電容的擺放及Layout ........................................................................99第六章 系統(tǒng)時(shí)序.................................................................................................1006.1 普通時(shí)序系統(tǒng)...........................................................................................1006.1.1 時(shí)序參數(shù)的確定...............................................................................1016.1.2 時(shí)序約束條件...................................................................................1066.2 源同步時(shí)序系統(tǒng).......................................................................................1086.2.1 源同步系統(tǒng)的基本結(jié)構(gòu)...................................................................1096.2.2 源同步時(shí)序要求...............................................................................110第七章 IBIS 模型................................................................................................1137.1 IBIS 模型的由來...................................................................................... 1137.2 IBIS 與SPICE 的比較.............................................................................. 1137.3 IBIS 模型的構(gòu)成...................................................................................... 1157.4 建立IBIS 模型......................................................................................... 1187.4 使用IBIS 模型......................................................................................... 1197.5 IBIS 相關(guān)工具及鏈接..............................................................................120第八章 高速設(shè)計(jì)理論在實(shí)際中的運(yùn)用.............................................................1228.1 疊層設(shè)計(jì)方案...........................................................................................1228.2 過孔對(duì)信號(hào)傳輸?shù)挠绊?..........................................................................1278.3 一般布局規(guī)則...........................................................................................1298.4 接地技術(shù)...................................................................................................1308.5 PCB 走線策略............................................................................................134
標(biāo)簽： 信號(hào)完整性
上傳時(shí)間： 2013-11-01
上傳用戶：xitai
第一部分 信號(hào)完整性知識(shí)基礎(chǔ).................................................................................5第一章 高速數(shù)字電路概述.....................................................................................51.1 何為高速電路...............................................................................................51.2 高速帶來的問題及設(shè)計(jì)流程剖析...............................................................61.3 相關(guān)的一些基本概念...................................................................................8第二章 傳輸線理論...............................................................................................122.1 分布式系統(tǒng)和集總電路.............................................................................122.2 傳輸線的RLCG 模型和電報(bào)方程...............................................................132.3 傳輸線的特征阻抗.....................................................................................142.3.1 特性阻抗的本質(zhì).................................................................................142.3.2 特征阻抗相關(guān)計(jì)算.............................................................................152.3.3 特性阻抗對(duì)信號(hào)完整性的影響.........................................................172.4 傳輸線電報(bào)方程及推導(dǎo).............................................................................182.5 趨膚效應(yīng)和集束效應(yīng).................................................................................232.6 信號(hào)的反射.................................................................................................252.6.1 反射機(jī)理和電報(bào)方程.........................................................................252.6.2 反射導(dǎo)致信號(hào)的失真問題.................................................................302.6.2.1 過沖和下沖.....................................................................................302.6.2.2 振蕩：.............................................................................................312.6.3 反射的抑制和匹配.............................................................................342.6.3.1 串行匹配.........................................................................................352.6.3.1 并行匹配.........................................................................................362.6.3.3 差分線的匹配.................................................................................392.6.3.4 多負(fù)載的匹配.................................................................................41第三章 串?dāng)_的分析...............................................................................................423.1 串?dāng)_的基本概念.........................................................................................423.2 前向串?dāng)_和后向串?dāng)_.................................................................................433.3 后向串?dāng)_的反射.........................................................................................463.4 后向串?dāng)_的飽和.........................................................................................463.5 共模和差模電流對(duì)串?dāng)_的影響.................................................................483.6 連接器的串?dāng)_問題.....................................................................................513.7 串?dāng)_的具體計(jì)算.........................................................................................543.8 避免串?dāng)_的措施.........................................................................................57第四章 EMI 抑制....................................................................................................604.1 EMI/EMC 的基本概念..................................................................................604.2 EMI 的產(chǎn)生..................................................................................................614.2.1 電壓瞬變.............................................................................................614.2.2 信號(hào)的回流.........................................................................................624.2.3 共模和差摸EMI ..................................................................................634.3 EMI 的控制..................................................................................................654.3.1 屏蔽.....................................................................................................654.3.1.1 電場(chǎng)屏蔽.........................................................................................654.3.1.2 磁場(chǎng)屏蔽.........................................................................................674.3.1.3 電磁場(chǎng)屏蔽.....................................................................................674.3.1.4 電磁屏蔽體和屏蔽效率.................................................................684.3.2 濾波.....................................................................................................714.3.2.1 去耦電容.........................................................................................714.3.2.3 磁性元件.........................................................................................734.3.3 接地.....................................................................................................744.4 PCB 設(shè)計(jì)中的EMI.......................................................................................754.4.1 傳輸線RLC 參數(shù)和EMI ........................................................................764.4.2 疊層設(shè)計(jì)抑制EMI ..............................................................................774.4.3 電容和接地過孔對(duì)回流的作用.........................................................784.4.4 布局和走線規(guī)則.................................................................................79第五章 電源完整性理論基礎(chǔ)...............................................................................825.1 電源噪聲的起因及危害.............................................................................825.2 電源阻抗設(shè)計(jì).............................................................................................855.3 同步開關(guān)噪聲分析.....................................................................................875.3.1 芯片內(nèi)部開關(guān)噪聲.............................................................................885.3.2 芯片外部開關(guān)噪聲.............................................................................895.3.3 等效電感衡量SSN ..............................................................................905.4 旁路電容的特性和應(yīng)用.............................................................................925.4.1 電容的頻率特性.................................................................................935.4.3 電容的介質(zhì)和封裝影響.....................................................................955.4.3 電容并聯(lián)特性及反諧振.....................................................................955.4.4 如何選擇電容.....................................................................................975.4.5 電容的擺放及Layout ........................................................................99第六章 系統(tǒng)時(shí)序.................................................................................................1006.1 普通時(shí)序系統(tǒng)...........................................................................................1006.1.1 時(shí)序參數(shù)的確定...............................................................................1016.1.2 時(shí)序約束條件...................................................................................1063.2 高速設(shè)計(jì)的問題.......................................................................................2093.3 SPECCTRAQuest SI Expert 的組件.......................................................2103.3.1 SPECCTRAQuest Model Integrity .................................................2103.3.2 SPECCTRAQuest Floorplanner/Editor .........................................2153.3.3 Constraint Manager .......................................................................2163.3.4 SigXplorer Expert Topology Development Environment .......2233.3.5 SigNoise 仿真子系統(tǒng)......................................................................2253.3.6 EMControl .........................................................................................2303.3.7 SPECCTRA Expert 自動(dòng)布線器.......................................................2303.4 高速設(shè)計(jì)的大致流程...............................................................................2303.4.1 拓?fù)浣Y(jié)構(gòu)的探索...............................................................................2313.4.2 空間解決方案的探索.......................................................................2313.4.3 使用拓?fù)淠０弪?qū)動(dòng)設(shè)計(jì)...................................................................2313.4.4 時(shí)序驅(qū)動(dòng)布局...................................................................................2323.4.5 以約束條件驅(qū)動(dòng)設(shè)計(jì).......................................................................2323.4.6 設(shè)計(jì)后分析.......................................................................................233第四章 SPECCTRAQUEST SIGNAL EXPLORER 的進(jìn)階運(yùn)用..........................................2344.1 SPECCTRAQuest Signal Explorer 的功能包括：................................2344.2 圖形化的拓?fù)浣Y(jié)構(gòu)探索...........................................................................2344.3 全面的信號(hào)完整性(Signal Integrity)分析.......................................2344.4 完全兼容 IBIS 模型...............................................................................2344.5 PCB 設(shè)計(jì)前和設(shè)計(jì)的拓?fù)浣Y(jié)構(gòu)提取.......................................................2354.6 仿真設(shè)置顧問...........................................................................................2354.7 改變?cè)O(shè)計(jì)的管理.......................................................................................2354.8 關(guān)鍵技術(shù)特點(diǎn)...........................................................................................2364.8.1 拓?fù)浣Y(jié)構(gòu)探索...................................................................................2364.8.2 SigWave 波形顯示器........................................................................2364.8.3 集成化的在線分析(Integration and In-process Analysis) .236第五章 部分特殊的運(yùn)用...............................................................................2375.1 Script 指令的使用..................................................................................2375.2 差分信號(hào)的仿真.......................................................................................2435.3 眼圖模式的使用.......................................................................................249第四部分：HYPERLYNX 仿真工具使用指南............................................................251第一章 使用LINESIM 進(jìn)行前仿真.......................................................................2511.1 用LineSim 進(jìn)行仿真工作的基本方法...................................................2511.2 處理信號(hào)完整性原理圖的具體問題.......................................................2591.3 在LineSim 中如何對(duì)傳輸線進(jìn)行設(shè)置...................................................2601.4 在LineSim 中模擬IC 元件.....................................................................2631.5 在LineSim 中進(jìn)行串?dāng)_仿真...................................................................268第二章 使用BOARDSIM 進(jìn)行后仿真......................................................................2732.1 用BOARDSIM 進(jìn)行后仿真工作的基本方法...................................................2732.2 BoardSim 的進(jìn)一步介紹..........................................................................2922.3 BoardSim 中的串?dāng)_仿真..........................................................................309
標(biāo)簽： PCB 內(nèi)存 仿真技術(shù)
上傳時(shí)間： 2013-11-07
上傳用戶：aa7821634
網(wǎng)絡(luò)家電，利用61板作為控制板，配合DM9000以太網(wǎng)模組，完成一個(gè)Web服務(wù)器，并具有控制功能基于凌陽單片機(jī)！
標(biāo)簽： 網(wǎng)絡(luò)家電
上傳時(shí)間： 2013-12-20
上傳用戶：maizezhen
本文主要論述了一種基于51單片機(jī)為核心控制器的數(shù)控直流電源的設(shè)計(jì)原理和實(shí)現(xiàn)方法。該電源具有電壓可預(yù)置、可步進(jìn)調(diào)整、輸出的電壓信號(hào)和電流信號(hào)可同時(shí)顯示功能。文章介紹了系統(tǒng)的總體設(shè)計(jì)方案，其主要由微控制器模塊、穩(wěn)壓控制模塊、電壓/電流采樣模塊、顯示模塊、鍵盤模塊、電源模塊五部分構(gòu)成。該系統(tǒng)原理是以STC89C52單片機(jī)為控制單元，以數(shù)模轉(zhuǎn)換芯片DAC0832輸出參考電壓控制電壓轉(zhuǎn)換模塊LM317輸出電壓大小，同時(shí)輸出穩(wěn)壓、恒流采用模數(shù)轉(zhuǎn)換芯片ADC0832對(duì)采樣的電壓、電流轉(zhuǎn)換為數(shù)字信號(hào)，再通過單片機(jī)實(shí)現(xiàn)閉環(huán)控制。文章最后對(duì)數(shù)控直流電源的主要性能參數(shù)進(jìn)行了測(cè)定和總結(jié)，并對(duì)其發(fā)展前景進(jìn)行了展望。關(guān)鍵詞單片機(jī)（MCU）：數(shù)模轉(zhuǎn)換器（DAC）；模數(shù)轉(zhuǎn)換器（ADC）：閉環(huán)控制電源技術(shù)尤其是數(shù)控電源技術(shù)是一門實(shí)踐性很強(qiáng)的工程技術(shù)，服務(wù)于各行各業(yè)。當(dāng)今電源技術(shù)融合了電氣、電子、系統(tǒng)集成、控制理論、材料等諸多學(xué)科領(lǐng)域。直流穩(wěn)壓電源是電子技術(shù)常用的儀器設(shè)備之一，廣泛的應(yīng)用于教學(xué)、科研等領(lǐng)域，是電子實(shí)驗(yàn)員、電子設(shè)計(jì)人員及電路開發(fā)部門進(jìn)行實(shí)驗(yàn)操作和科學(xué)研究所不可缺少的電子儀器。在電子電路中，通常都需要電壓穩(wěn)定的直流電源來供電。而整個(gè)穩(wěn)壓過程是由電源變壓器、整流、濾波、穩(wěn)壓等四部分組成。然而這種傳統(tǒng)的直流穩(wěn)壓電源功能簡(jiǎn)單、不好控制、可靠性低、干擾大、精度低且體積大、復(fù)雜度高。普通的直流穩(wěn)壓電源品種有很多，但均存在以下二個(gè)問題：輸出電壓是通過粗調(diào)（波段開關(guān)）及細(xì)調(diào)（電位器）來調(diào)節(jié)。這樣，當(dāng)輸出電壓需要精確輸出，或需要在一個(gè)小范圍內(nèi)改變時(shí)，困難就較大。另外，隨著使用時(shí)間的增加，波段開關(guān)及電位器難免接觸不良，對(duì)輸出會(huì)有影響。穩(wěn)壓方式均是采用串聯(lián)型穩(wěn)壓電路，對(duì)過載進(jìn)行限流或截流型保護(hù)，電路構(gòu)成復(fù)雜，穩(wěn)壓精度也不高。
上傳時(shí)間： 2022-04-05
上傳用戶：wangshoupeng199
量測(cè)可變電阻的類比電壓值，並將10位元的良測(cè)結(jié)果轉(zhuǎn)換成ASCII編碼，並輸出到個(gè)人電腦上的終端機(jī)
標(biāo)簽：
上傳時(shí)間： 2014-01-19
上傳用戶：hzy5825468
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