Abstract: This tutorial discusses proper printed-circuit board (PCB) grounding for mixed-signal designs. Formost applications a simple method without cuts in the ground plane allows for successful PCB layouts withthis kind of IC. We begin this document with the basics: where the current flows. Later, we describe how toplace components and route signal traces to minimize problems with crosstalk. Finally, we move on toconsider power supply-currents and end by discussing how to extend what we have learned to circuits withmultiple mixed-signal ICs.
上傳時間： 2013-11-04
上傳用戶：pol123
This reference design (RD) features a fullyassembled and tested surface-mount printed circuitboard (PCB). The RD board utilizes the MAX48851:2 or 2:1 multiplexer and other ICs to implement acomplete video graphics array (VGA) 8:1multiplexer.VGA input/output connections are provided to easilyinterface the MAX4885 RD board with VGAcompatibledevices. The RD board gives the optionto use a single 5V DC power supply (V+), or this RDboard can be powered from any one of the eight VGA sources.
標(biāo)簽： multiplexer reference VGA
上傳時間： 2013-11-09
上傳用戶：ANRAN
Abstract: Using a wafer-level package (WLP) can reduce the overall size and cost of your solution.However when using a WLP IC, the printed circuit board (PCB) layout can become more complex and, ifnot carefully planned, result in an unreliable design. This article presents some PCB designconsiderations and general recommendations for choosing a 0.4mm- or 0.5mm-pitch WLP for yourapplication.
標(biāo)簽： Considerations Guidelines and Design
上傳時間： 2013-10-14
上傳用戶：ysystc699
【摘要】本文結(jié)合作者多年的印制板設(shè)計(jì)經(jīng)驗(yàn)，著重印制板的電氣性能，從印制板穩(wěn)定性、可靠性方面，來討論多層印制板設(shè)計(jì)的基本要求。【關(guān)鍵詞】印制電路板；表面貼裝器件；高密度互連；通孔【Key words】printed Circuit Board；Surface Mounting Device；High Density Interface；Via一．概述印制板（PCB－printed Circuit Board）也叫印制電路板、印刷電路板。多層印制板，就是指兩層以上的印制板，它是由幾層絕緣基板上的連接導(dǎo)線和裝配焊接電子元件用的焊盤組成，既具有導(dǎo)通各層線路，又具有相互間絕緣的作用。隨著SMT（表面安裝技術(shù)）的不斷發(fā)展，以及新一代SMD（表面安裝器件）的不斷推出，如QFP、QFN、CSP、BGA（特別是MBGA），使電子產(chǎn)品更加智能化、小型化，因而推動了PCB工業(yè)技術(shù)的重大改革和進(jìn)步。自1991年IBM公司首先成功開發(fā)出高密度多層板（SLC）以來，各國各大集團(tuán)也相繼開發(fā)出各種各樣的高密度互連（HDI）微孔板。這些加工技術(shù)的迅猛發(fā)展，促使了PCB的設(shè)計(jì)已逐漸向多層、高密度布線的方向發(fā)展。多層印制板以其設(shè)計(jì)靈活、穩(wěn)定可靠的電氣性能和優(yōu)越的經(jīng)濟(jì)性能，現(xiàn)已廣泛應(yīng)用于電子產(chǎn)品的生產(chǎn)制造中。下面，作者以多年設(shè)計(jì)印制板的經(jīng)驗(yàn)，著重印制板的電氣性能，結(jié)合工藝要求，從印制板穩(wěn)定性、可靠性方面，來談?wù)劧鄬又瓢逶O(shè)計(jì)的基本要領(lǐng)。
上傳時間： 2013-11-19
上傳用戶：zczc
討論、研究高性能覆銅板對它所用的環(huán)氧樹脂的性能要求，應(yīng)是立足整個產(chǎn)業(yè)鏈的角度去觀察、分析。特別應(yīng)從HDI多層板發(fā)展對高性能CCL有哪些主要性能需求上著手研究。HDI多層板有哪些發(fā)展特點(diǎn)，它的發(fā)展趨勢如何——這都是我們所要研究的高性能CCL發(fā)展趨勢和重點(diǎn)的基本依據(jù)。而HDI多層板的技術(shù)發(fā)展，又是由它的應(yīng)用市場——終端電子產(chǎn)品的發(fā)展所驅(qū)動（見圖1）。 圖1 在HDI多層板產(chǎn)業(yè)鏈中各類產(chǎn)品對下游產(chǎn)品的性能需求關(guān)系圖 1．HDI多層板發(fā)展特點(diǎn)對高性能覆銅板技術(shù)進(jìn)步的影響1.1 HDI多層板的問世，對傳統(tǒng)PCB技術(shù)及其基板材料技術(shù)是一個嚴(yán)峻挑戰(zhàn)20世紀(jì)90年代初，出現(xiàn)新一代高密度互連（High Density Interconnection，簡稱為 HDI）印制電路板——積層法多層板（Build—Up Multiplayer printed board，簡稱為 BUM）的最早開發(fā)成果。它的問世是全世界幾十年的印制電路板技術(shù)發(fā)展歷程中的重大事件。積層法多層板即HDI多層板，至今仍是發(fā)展HDI的PCB的最好、最普遍的產(chǎn)品形式。在HDI多層板之上，將最新PCB尖端技術(shù)體現(xiàn)得淋漓盡致。HDI多層板產(chǎn)品結(jié)構(gòu)具有三大突出的特征：“微孔、細(xì)線、薄層化”。其中“微孔”是它的結(jié)構(gòu)特點(diǎn)中核心與靈魂。因此，現(xiàn)又將這類HDI多層板稱作為“微孔板”。HDI多層板已經(jīng)歷了十幾年的發(fā)展歷程，但它在技術(shù)上仍充滿著朝氣蓬勃的活力，在市場上仍有著前程廣闊的空間。
標(biāo)簽： 性能 發(fā)展趨勢 覆銅板 環(huán)氧樹脂
上傳時間： 2013-11-22
上傳用戶：gundan
This document provides practical, common guidelines for incorporating PCI Express interconnect layouts onto printed Circuit Boards (PCB) ranging from 4-layer desktop baseboard designs to 10- layer or more server baseboard designs. Guidelines and constraints in this document are intended for use on both baseboard and add-in card PCB designs. This includes interconnects between PCI Express devices located on the same baseboard (chip-to-chip routing) and interconnects between a PCI Express device located “down” on the baseboard and a device located “up” on an add-in card attached through a connector. This document is intended to cover all major components of the physical interconnect including design guidelines for the PCB traces, vias and AC coupling capacitors, as well as add-in card edge-finger and connector considerations. The intent of the guidelines and examples is to help ensure that good high-speed signal design practices are used and that the timing/jitter and loss/attenuation budgets can also be met from end-to-end across the PCI Express interconnect. However, while general physical guidelines and suggestions are given, they may not necessarily guarantee adequate performance of the interconnect for all layouts and implementations. Therefore, designers should consider modeling and simulation of the interconnect in order to ensure compliance to all applicable specifications. The document is composed of two main sections. The first section provides an overview of general topology and interconnect guidelines. The second section concentrates on physical layout constraints where bulleted items at the beginning of a topic highlight important constraints, while the narrative that follows offers additional insight.
標(biāo)簽： pci PCB 設(shè)計(jì)規(guī)范
上傳時間： 2013-10-15
上傳用戶：busterman
The latest generation of Texas Instruments (TI) boardmountedpower modules utilizes a pin interconnect technologythat improves surface-mount manufacturability.These modules are produced as a double-sided surfacemount(DSSMT) subassembly, yielding a case-less constructionwith subcomponents located on both sides of theprinted circuit board (PCB). Products produced in theDSSMT outline use the latest high-efficiency topologiesand magnetic-component packaging. This providescustomers with a high-efficiency, ready-to-use switchingpower module in a compact, space-saving package. Bothnonisolated point-of-load (POL) switching regulators andthe isolated dc/dc converter modules are being producedin the DSSMT outline.TI’s plug-in power product line offers power modules inboth through-hole and surface-mount packages. The surfacemountmodules produced in the DSSMT outline use asolid copper interconnect with an integral solder ball fortheir
上傳時間： 2013-10-10
上傳用戶：1184599859
The μPSD32xx family, from ST, consists of Flash programmable system devices with a 8032 MicrocontrollerCore. Of these, the μPSD3234A and μPSD3254A are notable for having a complete implementationof the USB hardware directly on the chip, complying with the Universal Serial Bus Specification, Revision1.1.This application note describes a demonstration program that has been written for the DK3200 hardwaredemonstration kit (incorporating a μPSD3234A device). It gives the user an idea of how simple it is to workwith the device, using the HID class as a ready-made device driver for the USB connection.IN-APPLICATION-PROGRAMMING (IAP) AND IN-SYSTEM-PROGRAMMING (ISP)Since the μPSD contains two independent Flash memory arrays, the Micro Controller Unit (MCU) can executecode from one memory while erasing and programming the other. Product firmware updates in thefield can be reliably performed over any communication channel (such as CAN, Ethernet, UART, J1850)using this unique architecture. For In-Application-Programming (IAP), all code is updated through theMCU. The main advantage for the user is that the firmware can be updated remotely. The target applicationruns and takes care on its own program code and data memory.IAP is not the only method to program the firmware in μPSD devices. They can also be programmed usingIn-System-Programming (ISP). A IEEE1149.1-compliant JTAG interface is included on the μPSD. Withthis, the entire device can be rapidly programmed while soldered to the circuit board (Main Flash memory,Secondary Boot Flash memory, the PLD, and all configuration areas). This requires no MCU participation.The MCU is completely bypassed. So, the μPSD can be programmed or reprogrammed any time, anywhere, even when completely uncommitted.Both methods take place with the device in its normal hardware environment, soldered to a printed circuitboard. The IAP method cannot be used without previous use of ISP, because IAP utilizes a small amountof resident code to receive the service commands, and to perform the desired operations.
標(biāo)簽： Demonstration 3200 USB for
上傳時間： 2014-02-27
上傳用戶：zhangzhenyu
Abstract: This application note explains the hardware of different types of 1-Wire® interfaces and software examples adapted to this hardware with a focus on serial ports. Depending on the types of iButtons required for a project and the type of computer to be used, the most economical interface is easily found. The hardware examples shown are basically two different types: 5V general interface and 12V RS-232 interface. Within the 5V group a common printed circuit board could be used for all circuits described. The variations can be achieved by different populations of components. The same principal is used for the 12V RS-232 interface. The population determines if it is a Read all or a Read/Write all type of interface. There are other possible circuit implementations to create a 1-Wire interface. The circuits described in this application note cover many different configurations. For a custom application, one of the described options can be adapted to meet individual needs.
標(biāo)簽： iButtons Reading Writing and
上傳時間： 2013-10-29
上傳用戶：long14578
電力設(shè)備熱點(diǎn)溫度與電流在線監(jiān)測預(yù)警系統(tǒng)工作在大型變壓器旁，極易受電磁輻射干擾，針對該預(yù)警系統(tǒng)的子系統(tǒng)：無線傳輸部分進(jìn)行了抗電磁干擾設(shè)計(jì)，采用Ansoft Designer軟件仿真分析了PCB（printed Circuit Board）中電磁波對PCB電磁兼容性產(chǎn)生的影響，根據(jù)其得出的PCB的電流圖及近場分布圖，分析PCB的電磁兼容性，針對結(jié)果中的電磁輻射過高區(qū)域進(jìn)行了重新設(shè)計(jì)，經(jīng)Ansoft Designer驗(yàn)證，重新設(shè)計(jì)后的PCB各項(xiàng)指數(shù)有所下降，電磁兼容性得到提高。
標(biāo)簽： Zigbee 無線傳輸 抗電磁干擾 優(yōu)化設(shè)計(jì)
上傳時間： 2013-11-11
上傳用戶：ggwz258
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