This design uses Common-Emitter Amplifier (Class A) with 2N3904 Bipolar Junction Transistor. Use “Voltage Divider Biasing” to reduce the effects of varying β (= ic / ib) (by holding the Base voltage constant) Base Voltage (Vb) = Vcc * [R2 / (R1 + R2)] Use Coupling Capacitors to separate the AC signals from the DC biasing voltage (which only pass AC signals and block any DC component). Use Bypass Capacitor to maintain the Q-point stability. To determine the value of each component, first set Q-point close to the center position of the load line. (RL is the resistance of the speaker.)
上傳時間： 2020-11-27
上傳用戶：
%this is an example demonstrating the Radial Basis Function %if you select a RBF that supports it (Gausian, or 1st or 3rd order %polyharmonic spline), this also calculates a line integral between two %points.
上傳時間： 2021-07-02
上傳用戶：19800358905
Wide 2.2V to 6V Input Voltage Range ? 0.20V FB adjustable LED drive current ? Directly drive 9 Series 1W LED at VIN>=6V ? Fixed 800KHz Switching Frequency ? Max. 3A Switching Current Capability ? Up to 92% efficiency ? Excellent line and load regulation ? EN PIN TTL shutdown capability ? Internal Optimize Power MOSFET
標簽： sc3633
上傳時間： 2021-11-05
上傳用戶：d1997wayne
SIM7600C 全網通4G模塊軟硬件設計技術資料包linux驅動SIM7500_SIM7600 Series_AT Command Manual_V1.01.pdfsim7600C-CE.zipSIM7600CE_SIM7600C 硬件設計手冊_V1.01.pdfSIM7600CE_SIM7600C-PCIE_Hardware_Design_V1.00.pdfSIM7600CE_SIM7600C_Hardware Design_V1.01.pdfSIM7600CE_SPEC CN_201607.pdfSIM7600CE_SPEC EN_201607.pdfSIM7600CE_TAC_86147703.pdfSIM7600C_SIM7100C_Hardware Comparion_V1.00.pdfSIM7600C_SIM7100C_硬件差異文檔_V1.01.pdfSIM7600C_SPEC CN_201607.pdfSIM7600C_SPEC EN_201607.pdfSIM7600C_TAC_86147603.pdf
上傳時間： 2021-11-09
上傳用戶：
黑金CYCLONE4 EP4CE6F17C8 FPGA開發板ALTIUM設計硬件工程（原理圖+PCB+AD集成封裝庫）,Altium Designer 設計的工程文件，包括完整的原理圖及PCB文件，可以用Altium(AD)軟件打開或修改，可作為你產品設計的參考。集成封裝器件型號列表：Library Component Count : 50Name Description----------------------------------------------------------------------------------------------------1117-3.3 24LC04B_0 4148 BAV99 CAP NP_Dup2CAP NP_Dup2_1 CAP NP_Dup2_2CP2102_0 C_Dup1 C_Dup1_1C_Dup2 C_Dup3 C_Dup4 C_Dup4_1 Circuit Breaker Circuit BreakerConnector 15 Receptacle Assembly, 15-Pin, Sim Line ConnectorDS1302_8SO EC EP4CE6F17C8 Cyclone IV Family FPGA, 2V Core, 179 I/O Pins, 2 PLLs, 256-Pin FBGA, Speed Grade 8, Commercial GradeEP4CE6F17C8_1 Cyclone IV Family FPGA, 2V Core, 179 I/O Pins, 2 PLLs, 256-Pin FBGA, Speed Grade 8, Commercial GradeFuse 2 FuseHEX6HY57651620/SO_0 Header 2 Header, 2-PinHeader 9X2 Header, 9-Pin, Dual rowINDUCTOR JTAG-10_Dup1 KEYB LED LED_Dup1 M25P16-VMN3PB 16 Mb (x1) Automotive Serial NOR Flash Memory, 75 MHz, 2.7 to 3.6 V, 8-pin SO8 Narrow (MN), TubeMHDR2X20 Header, 20-Pin, Dual rowMiniUSBB OSCPNP R RESISTOR RN RN_Dup1 R_Dup1 R_Dup2 R_Dup3 R_Dup5R_Dup6 SD SPEAKERSRV05-4SW KEY-DPDT ZTAbattery
標簽： 黑金 cyclone4 ep4ce6f17c8 fpga
上傳時間： 2021-12-22
上傳用戶：
1. Scope ......................................................................................................................................................................... 12. DDR4 SDRAM Package Pinout and Addressing ....................................................................................................... 22.1 DDR4 SDRAM Row for X4,X8 and X16 ................................................................................................................22.2 DDR4 SDRAM Ball Pitch........................................................................................................................................22.3 DDR4 SDRAM Columns for X4,X8 and X16 ..........................................................................................................22.4 DDR4 SDRAM X4/8 Ballout using MO-207......................................................................................................... 22.5 DDR4 SDRAM X16 Ballout using MO-207.............................................................................................................32.6 Pinout Description ..................................................................................................................................................52.7 DDR4 SDRAM Addressing.....................................................................................................................................73. Functional Description ...............................................................................................................................................83.1 Simplified State Diagram ....................................................................................................................................83.2 Basic Functionality..................................................................................................................................................93.3 RESET and Initialization Procedure .....................................................................................................................103.3.1 Power-up Initialization Sequence .............................................................................................................103.3.2 Reset Initialization with Stable Power ......................................................................................................113.4 Register Definition ................................................................................................................................................123.4.1 Programming the mode registers .............................................................................................................123.5 Mode Register ......................................................................................................................................................134. DDR4 SDRAM Command Description and Operation ............................................................................................. 244.1 Command Truth Table ..........................................................................................................................................244.2 CKE Truth Table ...................................................................................................................................................254.3 Burst Length, Type and Order ..............................................................................................................................264.3.1 BL8 Burst order with CRC Enabled .........................................................................................................264.4 DLL-off Mode & DLL on/off Switching procedure ................................................................................................274.4.1 DLL on/off switching procedure ...............................................................................................................274.4.2 DLL “on” to DLL “off” Procedure ..............................................................................................................274.4.3 DLL “off” to DLL “on” Procedure ..............................................................................................................284.5 DLL-off Mode........................................................................................................................................................294.6 Input Clock Frequency Change ............................................................................................................................304.7 Write Leveling.......................................................................................................................................................314.7.1 DRAM setting for write leveling & DRAM termination function in that mode ............................................324.7.2 Procedure Description .............................................................................................................................334.7.3 Write Leveling Mode Exit .........................................................................................................................34
標簽： DDR4
上傳時間： 2022-01-09
上傳用戶：
高通(Qualcomm)藍牙芯片QCC5151_硬件設計詳細指導書（官方內部培訓手冊）共52頁其內容是針對硬件設計、部分重要元器件選擇(ESD，Filter）及走線注意事項的詳細說明。2 Power management 2.1 SMPS 2.1.1 Components specification 2.1.2 Input power supply selection 2.1.3 Minimize SMPS EMI emissions 2.1.4 Internal LDOs and digital core decoupling 2.1.5 Powering external components 2.2 Charger 2.2.1 Charger connections.2.2.2 General charger operation2.2.3 Temperature measurement during charging 2.3 SYS_CTRL 3 Bluetooth radio3.1 RF PSU component choice 3.2 RF band-pass filter3.3 Layout (天線 走線的注意事項)4 Audio4.1 Audio bypass capacitors 4.2 Earphone speaker output4.3 Line/Mic input 4.4 Headphone output optimizition5 LED pads 5.1 LED driver 5.2 Digital/Button input 5.3 Analog input5.4 Disabled 6 Reset pin (Reset#)7 QSPIinterface 8 USB interfaces 8.1 USB device port8.1.1 USB connections8.1.2 Layout notes8.1.3 USB charger detection
上傳時間： 2022-01-24
上傳用戶：XuVshu
The PW2312 is a high frequency, synchronous, rectified, step-down, switch-mode converter withinternal power MOSFETs. It offers a very compact solution to achieve a 1.5A peak output currentover a wide input supply range, with excellent load and line regulation.The PW2312 requires a minimal number of readily available, external components and is available ina space saving SOT23-6 package.
標簽： pw2312
上傳時間： 2022-02-11
上傳用戶：qingfengchizhu
The PW2163D is a high frequency, synchronous, rectified, step-down, switch-mode converter withinternal powerMOSFETs. It offers a very compact solution to provide a 3A continuous current over awide input supply range,with excellent load and line regulation.The PW2163D requires a minimal number of readily available, external components and is availablein a spacesaving SOT23-6 package
標簽： pw2163d
上傳時間： 2022-02-11
上傳用戶：
v> 目前最常見的藍牙天線有偶極天線（dipole antenna）,倒 F 型天線（planar inverted F anternna）、曲流線型天線（meander line antenna）、微小型陶瓷天線（ceramic antenna）、液晶 聚合體天線（lcp）和棒狀天線（2.4G 頻率專用）等。由于這些具有近似全向性的輻射場型 以及結構簡單、制作成本低的優點，所以非常適合嵌入藍牙技術裝置使用。
上傳時間： 2022-03-11
上傳用戶：
