同步技術是跳頻通信系統的關鍵技術之一，尤其是在快速跳頻通信系統中，常規跳頻通信通過同步字頭攜帶相關碼的方法來實現同步，但對于快跳頻來說，由于是一跳或者多跳傳輸一個調制符號，難以攜帶相關碼。對此引入雙跳頻圖案方法，提出了一種適用于快速跳頻通信系統的同步方案。采用短碼攜帶同步信息，克服了快速跳頻難以攜帶相關碼的困難。分析了同步性能，仿真結果表明該方案同步時間短、虛警概率低、捕獲概率高，同步性能可靠。 Abstract: Synchronization is one of the key techniques to frequency-hopping communication system， especially in the fast frequency hopping communication system. In conventional frequency hopping communication systems， synchronization can be achieved by synchronization-head which can be used to carry the synchronization information， but for the fast frequency hopping， Because modulation symbol is transmitted by per hop or multi-hop， it is difficult to carry the correlation code. For the limitation of fast frequency hopping in carrying correlation code， a fast frequency-hopping synchronization scheme with two hopping patterns is proposed. The synchronization information is carried by short code， which overcomes the difficulty of correlation code transmission in fast frequency-hopping. The performance of the scheme is analyzed， and simulation results show that the scheme has the advantages of shorter synchronization time， lower probability of false alarm， higher probability of capture and more reliable of synchronization.
上傳時間： 2013-11-23
上傳用戶：mpquest
The NXP LPC315x combine an 180 MHz ARM926EJ-S CPU core, High-speed USB 2.0OTG, 192 KB SRAM, NAND flash controller, flexible external bus interface, an integratedaudio codec, Li-ion charger, Real-Time Clock (RTC), and a myriad of serial and parallelinterfaces in a single chip targeted at consumer, industrial, medical, and communicationmarkets. To optimize system power consumption, the LPC315x have multiple powerdomains and a very flexible Clock Generation Unit (CGU) that provides dynamic clockgating and scaling.The LPC315x is implemented as multi-chip module with two side-by-side dies, one fordigital fuctions and one for analog functions, which include a Power Supply Unit (PSU),audio codec, RTC, and Li-ion battery charger.
上傳時間： 2014-01-17
上傳用戶：Altman
Today in many applications such as network switches, routers, multi-computers,and processor-memory interfaces, the ability to integrate hundreds of multi-gigabit I/Os is desired to make better use of the rapidly advancing IC technology.
上傳時間： 2013-10-30
上傳用戶：ysjing
ARM通訊 H-JTAG 是一款簡單易用的的調試代理軟件，功能和流行的MULTI-ICE 類似。H-JTAG 包括兩個工具軟件：H-JTAG SERVER 和H-FLASHER。其中，H-JTAG SERVER 實現調試代理的功能，而H-FLASHER則實現了FLASH 燒寫的功能。H-JTAG 的基本結構如下圖1-1所示。 H-JTAG支持所有基于ARM7 和ARM9的芯片的調試，并且支持大多數主流的ARM調試軟件，如ADS、RVDS、IAR 和KEIL。通過靈活的接口配置，H-JTAG 可以支持WIGGLER，SDT-JTAG 和用戶自定義的各種JTAG 調試小板。同時，附帶的H-FLASHER 燒寫軟件還支持常用片內片外FLASH 的燒寫。使用H-JTAG，用戶能夠方便的搭建一個簡單易用的ARM 調試開發平臺。H-JTAG 的功能和特定總結如下： 1. 支持 RDI 1.5.0 以及 1.5.1； 2. 支持所有ARM7 以及 ARM9 芯片； 3. 支持 THUMB 以及ARM 指令； 4. 支持 LITTLE-ENDIAN 以及 BIG-ENDIAN； 5. 支持 SEMIHOSTING； 6. 支持 WIGGLER， SDT-JTAG和用戶自定義JTAG調試板； 7. 支持 WINDOWS 9.X/NT/2000/XP； 8．支持常用FLASH 芯片的編程燒寫； 9. 支持LPC2000 和AT91SAM 片內FLASH 的自動下載；
上傳時間： 2014-12-01
上傳用戶：Miyuki
中文版詳情瀏覽：http://www.elecfans.com/emb/fpga/20130715324029.html Xilinx UltraScale:The Next-Generation Architecture for Your Next-Generation Architecture The Xilinx® UltraScale™ architecture delivers unprecedented levels of integration and capability with ASIC-class system- level performance for the most demanding applications. The UltraScale architecture is the industr y's f irst application of leading-edge ASIC architectural enhancements in an All Programmable architecture that scales from 20 nm planar through 16 nm FinFET technologies and beyond, in addition to scaling from monolithic through 3D ICs. Through analytical co-optimization with the X ilinx V ivado® Design Suite, the UltraScale architecture provides massive routing capacity while intelligently resolving typical bottlenecks in ways never before possible. This design synergy achieves greater than 90% utilization with no performance degradation. Some of the UltraScale architecture breakthroughs include: • Strategic placement (virtually anywhere on the die) of ASIC-like system clocks, reducing clock skew by up to 50% • Latency-producing pipelining is virtually unnecessary in systems with massively parallel bus architecture, increasing system speed and capability • Potential timing-closure problems and interconnect bottlenecks are eliminated, even in systems requiring 90% or more resource utilization • 3D IC integration makes it possible to build larger devices one process generation ahead of the current industr y standard • Greatly increased system performance, including multi-gigabit serial transceivers, I/O, and memor y bandwidth is available within even smaller system power budgets • Greatly enhanced DSP and packet handling The Xilinx UltraScale architecture opens up whole new dimensions for designers of ultra-high-capacity solutions.
標簽： UltraScale Xilinx 架構
上傳時間： 2013-11-21
上傳用戶：wxqman
Today’s digital systems combine a myriad of chips with different voltage configurations.Designers must interface 2.5V processors with 3.3V memories—both RAM and ROM—as wellas 5V buses and multiple peripheral chips. Each chip has specific power supply needs. CPLDsare ideal for handling the multi-voltage interfacing, but do require forethought to ensure correctoperation.
上傳時間： 2013-11-10
上傳用戶：yy_cn
為了在CDMA系統中更好地應用QDPSK數字調制方式，在分析四相相對移相（QDPSK)信號調制解調原理的基礎上，設計了一種QDPSK調制解調電路，它包括串并轉換、差分編碼、四相載波產生和選相、相干解調、差分譯碼和并串轉換電路。在MAX+PLUSⅡ軟件平臺上，進行了編譯和波形仿真。綜合后下載到復雜可編程邏輯器件EPM7128SLC84-15中，測試結果表明，調制電路能正確選相，解調電路輸出數據與QDPSK調制輸入數據完全一致，達到了預期的設計要求。 Abstract: In order to realize the better application of digital modulation mode QDPSK in the CDMA system， a sort of QDPSK modulation-demodulation circuit was designed based on the analysis of QDPSK signal modulation-demodulation principles. It included serial/parallel conversion circuit, differential encoding circuit, four-phase carrier wave produced and phase chosen circuit, coherent demodulation circuit, difference decoding circuit and parallel/serial conversion circuit. And it was compiled and simulated on the MAX+PLUSⅡ software platform,and downloaded into the CPLD of EPM7128SLC84-15.The test result shows that the modulation circuit can exactly choose the phase，and the output data of the demodulator circuit is the same as the input data of the QDPSK modulate. The circuit achieves the prospective requirement of the design.
上傳時間： 2013-10-28
上傳用戶：jyycc
半導體的產品很多，應用的場合非常廣泛，圖一是常見的幾種半導體元件外型。半導體元件一般是以接腳形式或外型來劃分類別，圖一中不同類別的英文縮寫名稱原文為 PDID：Plastic Dual Inline Package SOP：Small Outline Package SOJ：Small Outline J-Lead Package PLCC：Plastic Leaded Chip Carrier QFP：Quad Flat Package PGA：Pin Grid Array BGA：Ball Grid Array 雖然半導體元件的外型種類很多，在電路板上常用的組裝方式有二種，一種是插入電路板的銲孔或腳座，如PDIP、PGA，另一種是貼附在電路板表面的銲墊上，如SOP、SOJ、PLCC、QFP、BGA。 從半導體元件的外觀，只看到從包覆的膠體或陶瓷中伸出的接腳，而半導體元件真正的的核心，是包覆在膠體或陶瓷內一片非常小的晶片，透過伸出的接腳與外部做資訊傳輸。圖二是一片EPROM元件，從上方的玻璃窗可看到內部的晶片，圖三是以顯微鏡將內部的晶片放大，可以看到晶片以多條銲線連接四周的接腳，這些接腳向外延伸並穿出膠體，成為晶片與外界通訊的道路。請注意圖三中有一條銲線從中斷裂，那是使用不當引發過電流而燒毀，致使晶片失去功能，這也是一般晶片遭到損毀而失效的原因之一。 圖四是常見的LED，也就是發光二極體，其內部也是一顆晶片，圖五是以顯微鏡正視LED的頂端，可從透明的膠體中隱約的看到一片方型的晶片及一條金色的銲線，若以LED二支接腳的極性來做分別，晶片是貼附在負極的腳上，經由銲線連接正極的腳。當LED通過正向電流時，晶片會發光而使LED發亮，如圖六所示。 半導體元件的製作分成兩段的製造程序，前一段是先製造元件的核心─晶片，稱為晶圓製造；後一段是將晶中片加以封裝成最後產品，稱為IC封裝製程，又可細分成晶圓切割、黏晶、銲線、封膠、印字、剪切成型等加工步驟，在本章節中將簡介這兩段的製造程序。
上傳時間： 2013-11-04
上傳用戶：372825274
The data plane of the reference design consists of a configurable multi-channel XBERT modulethat generates and checks high-speed serial data transmitted and received by the MGTs. Eachchannel in the XBERT module consists of two MGTs (MGTA and MGTB), which physicallyoccupy one MGT tile in the Virtex-4 FPGA. Each MGT has its own pattern checker, but bothMGTs in a channel share the same pattern generator. Each channel can load a differentpattern. The MGT serial rate depends on the reference clock frequency and the internal PMAdivider settings. The reference design can be scaled anywhere from one channel (two MGTs)to twelve channels (twenty-four MGTs).
上傳時間： 2013-12-25
上傳用戶：jkhjkh1982
ACPR (adjacent channel power ratio), AltCPR (alternatechannel power ratio), and noise are important performancemetrics for digital communication systems thatuse, for example, WCDMA (wideband code division multipleaccess) modulation. ACPR and AltCPR are bothmeasures of spectral regrowth. The power in the WCDMAcarrier is measured using a 5MHz measurement bandwidth;see Figure 1. In the case of ACPR, the total powerin a 3.84MHz bandwidth centered at 5MHz (the carrierspacing) away from the center of the outermost carrier ismeasured and compared to the carrier power. The resultis expressed in dBc. For AltCPR, the procedure is thesame, except we center the measurement 10MHz awayfrom the center of the outermost carrier.
上傳時間： 2013-11-02
上傳用戶：maricle
