基于變頻調速的水平連鑄機拉坯輥速度控制系統Frequency Inverter Based Drawing RollerS peedC ontrolSy stem ofHorizontal Continuous Casting MachineA 偉劉沖旅巴(南 華 大 學電氣工程學院，衡陽421001)摘要拉坯輥速度控制是水平連鑄工藝的關鍵技術之一，采用變頻器實現水平連鑄機拉坯輥速度程序控制，由信號發生裝置給變頻器提供程控信號。現場應用表明該控制系統速度響應快，控制精度高，滿足了水平連鑄生產的需要。關鍵詞水平連鑄拉坯輥速度程序控制變頻器Absh'act Speedc ontorlof dr awingor leris on eo fth ek eyte chnologiesfo rho rizontalco ntinuousca stingm achine.Fo rth ispu rpose,fr equencyco nverterisad optedfo rdr awingor lersp eedp rogrammablec ontorlof ho rizontalco ntinuousca stingm achine,th ep rogrammableco ntorlsi gnalto fr equencyc onverteris provided場a signal generator. The results of application show that the response of system is rapid and the control accuracy is high enough to meet thedemand of production of horizontal continuous casting.Keywords Horizontalco ntinuousc asting Drawingor ler Speedp rogrammablec ontrol Ferquencyin verter 隨著 現 代 化工業生產對鋼材需求量的日益增加，連鑄生產能力已經成為衡量一個國家冶金工業發展水平的重要指標之一。近十幾年來，水平連鑄由于具有投資少、鑄坯直、見效快等多方面的優點，國內許多鋼鐵企業利用水平連鑄機來澆鑄特種合金鋼，發揮了其獨特的優勢并取得了較好的經濟效益〔1,2)0采用 水 平 連鑄機澆鑄特種合金鋼時，由于拉坯機是水平連鑄系統中的關鍵設備之一，拉坯機及其控制性能的好壞直接影響著連鑄坯的質量，因此，連鑄的拉坯技術便成為整個水平連鑄技術的核心。由于鋼的冶煉過程是在高溫下進行的，鋼水溫度的變化又容易影響鑄坯的質量和成材率，因此，如何能在高溫環境下控制好與鑄坯速度相關的參數(拉、推程量，中停時間和拉坯頻率等)對于確保連鑄作業的進一步高效化，延長系統的連續作業時間十分關鍵。因此，拉坯輥速度控制技術是連鑄生產過程控制領域中的關鍵技術之- [31
上傳時間： 2013-10-12
上傳用戶：gxy670166755
PLC TM卡開發系統匯編程序(ATM8051) ;***************** 定義管腳*************************SCL BIT P1.0SDA BIT P1.1GC BIT P1.2BZ BIT P3.6LEDI BIT P1.4LEDII BIT P1.5OK BIT 20H.1OUT1 BIT P1.3OUT2 BIT P1.0OUT3 BIT P1.1RXD BIT P3.0TXD BIT P3.1PCV BIT P3.2WPC BIT P3.3RPC BIT P3.5LEDR BIT P3.4LEDL BIT P3.6TM BIT P3.7;********************定義寄存器***********************ROMDTA EQU 30H;NUMBY EQU 61H;SLA EQU 60H;MTD EQU 2FH;MRD EQU 40H;TEMP EQU 50H;;ORG 00H;;INDEX:MOV P1, #00H;MOV P2, #0FFHMOV MTD ,#00HCALL REEMOV R0,40HCJNE R0,#01,NO;MOV P2,#1CHLJMP VIMEN MOV P2,#79HACALL TOUCHRESET ;JNC NO ;CALL READTM ;CJNE A,#01H,NO;NOPMOV MTD, #00HCALL WEENOPMOV P2,#4AHSETB BZCALL TIMECLR BZMOV PCON, #0FFHVIME:CALL TIME1CALL TOUCHRESETJNC VIMECALL READTMCJNE A, #01H,VIME;NOPNOPNOPIII: MOV MTD,#00HCALL REECALL BBJNB OK,NO1LJMP ZHUNO1:MOV MTD,#10H
上傳時間： 2014-03-24
上傳用戶：448949
用單片機配置FPGA—PLD設計技巧 Configuration/Program Method for Altera Device Configure the FLEX Device You can use any Micro-Controller to configure the FLEX device–the main idea is clocking in ONE BITof configuration data per CLOCK–start from the BIT 0The total Configuration time–e.g. 10K10 need 15K byte configuration file•calculation equation–10K10* 1.5= 15Kbyte–configuration time for the file itself•15*1024*8*clock = 122,880Clock•assume the CLOCK is 4MHz•122,880*1/4Mhz=30.72msec
上傳時間： 2013-10-09
上傳用戶：a67818601
自動檢測80C51 串行通訊中的波特率本文介紹一種在80C51 串行通訊應用中自動檢測波特率的方法。按照經驗，程序起動后所接收到的第1 個字符用于測量波特率。這種方法可以不用設定難于記憶的開關，還可以免去在有關應用中使用多種不同波特率的煩惱。人們可以設想：一種可靠地實現自動波特檢測的方法是可能的，它無須嚴格限制可被確認的字符。問題是：在各種的條件下，如何可以在大量允許出現的字符中找出波特率的定時間隔。顯然，最快捷的方法是檢測一個單獨位時間（single bit time），以確定接收波特率應該是多少。可是，在RS-232 模式下，許多ASCII 字符并不能測量出一個單獨位時間。對于大多數字符來說，只要波特率存在合理波動（這里的波特率是指標準波特率），從起始位到最后一位“可見”位的數據傳輸周期就會在一定范圍內發生變化。此外，許多系統采用8 位數據、無奇偶校驗的格式傳輸ASCII 字符。在這種格式里，普通ASCII 字節不會有MSB 設定
上傳時間： 2013-10-15
上傳用戶：shirleyYim
Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their productsor to discontinue any product or service without notice, and advise customers to obtain the latestversion of relevant information to verify, before placing orders, that information being relied onis current and complete. All products are sold subject to the terms and conditions of sale suppliedat the time of order acknowledgement, including those pertaining to warranty, patentinfringement, and limitation of liability
上傳時間： 2013-12-26
上傳用戶：凌云御清風
This white paper discusses how market trends, the need for increased productivity, and new legislation have accelerated the use of safety systems in industrial machinery. This TÜV-qualified FPGA design methodology is changing the paradigms of safety designs and will greatly reduce development effort, system complexity, and time to market. This allows FPGA users to design their own customized safety controllers and provides a significant competitive advantage over traditional microcontroller or ASIC-based designs. Introduction The basic motivation of deploying functional safety systems is to ensure safe operation as well as safe behavior in cases of failure. Examples of functional safety systems include train brakes, proximity sensors for hazardous areas around machines such as fast-moving robots, and distributed control systems in process automation equipment such as those used in petrochemical plants. The International Electrotechnical Commission’s standard, IEC 61508: “Functional safety of electrical/electronic/programmable electronic safety-related systems,” is understood as the standard for designing safety systems for electrical, electronic, and programmable electronic (E/E/PE) equipment. This standard was developed in the mid-1980s and has been revised several times to cover the technical advances in various industries. In addition, derivative standards have been developed for specific markets and applications that prescribe the particular requirements on functional safety systems in these industry applications. Example applications include process automation (IEC 61511), machine automation (IEC 62061), transportation (railway EN 50128), medical (IEC 62304), automotive (ISO 26262), power generation, distribution, and transportation. 圖Figure 1. Local Safety System
上傳時間： 2013-11-05
上傳用戶：維子哥哥
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
上傳時間： 2013-10-22
上傳用戶：ztj182002
本文詳細介紹了有關FPGA的開發流程，對初學者會有很大的指導作用。
上傳時間： 2013-11-18
上傳用戶：simonpeng
In the past decade, the size and complexity of manyFPGA designs exceeds the time and resourcesavailable to most design teams, making the use andreuse of Intellectual Property (IP) imperative.However, integrating numerous IP blocks acquiredfrom both internal and external sources can be adaunting challenge that often extends, rather thanshortens, design time. As today's designs integrateincreasing amounts of functionality, it is vital thatdesigners have access to proven, up-to-date IP fromreliable sources.
上傳時間： 2013-11-15
上傳用戶：lyy1234
Design techniques for electronic systems areconstantly changing. In industries at the heart of thedigital revolution, this change is especially acute.Functional integration, dramatic increases incomplexity, new standards and protocols, costconstraints, and increased time-to-market pressureshave bolstered both the design challenges and theopportunities to develop modern electronic systems.One trend driving these changes is the increasedintegration of core logic with previously discretefunctions to achieve higher performance and morecompact board designs.
上傳時間： 2014-12-28
上傳用戶：康郎
