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  • Analog Solutions for Xilinx FPGAs

    Designing withProgrammable Logicin an Analog WorldProgrammable logic devicesrevolutionized digital design over 25years ago, promising designers a blankchip to design literally any functionand program it in the field. PLDs canbe low-logic density devices that usenonvolatile sea-of-gates cells calledcomplex programmable logic devices(CPLDs) or they can be high-densitydevices based on SRAM look-up tables

    標簽: Solutions Analog Xilinx FPGAs

    上傳時間: 2013-11-07

    上傳用戶:suicone

  • wp379 AXI4即插即用IP

    In the past decade, the size and complexity of manyFPGA designs exceeds the time and resourcesavailable to most design teams, making the use andreuse of Intellectual Property (IP) imperative.However, integrating numerous IP blocks acquiredfrom both internal and external sources can be adaunting challenge that often extends, rather thanshortens, design time. As today's designs integrateincreasing amounts of functionality, it is vital thatdesigners have access to proven, up-to-date IP fromreliable sources.

    標簽: AXI4 379 wp 即插即用

    上傳時間: 2013-11-11

    上傳用戶:csgcd001

  • XAPP953-二維列序濾波器的實現

      This application note describes the implementation of a two-dimensional Rank Order filter. Thereference design includes the RTL VHDL implementation of an efficient sorting algorithm. Thedesign is parameterizable for input/output precision, color standards, filter kernel size,maximum horizontal resolution, and implementation options. The rank to be selected can bemodified dynamically, and the actual horizontal resolution is picked up automatically from theinput synchronization signals. The design has a fully synchronous interface through the ce, clk,and rst ports.

    標簽: XAPP 953 二維 濾波器

    上傳時間: 2013-12-14

    上傳用戶:逗逗666

  • XAPP740利用AXI互聯設計高性能視頻系統

    This application note covers the design considerations of a system using the performance features of the LogiCORE™ IP Advanced eXtensible Interface (AXI) Interconnect core. The design focuses on high system throughput through the AXI Interconnect core with F MAX  and area optimizations in certain portions of the design. The design uses five AXI video direct memory access (VDMA) engines to simultaneously move 10 streams (five transmit video streams and five receive video streams), each in 1920 x 1080p format, 60 Hz refresh rate, and up to 32 data bits per pixel. Each VDMA is driven from a video test pattern generator (TPG) with a video timing controller (VTC) block to set up the necessary video timing signals. Data read by each AXI VDMA is sent to a common on-screen display (OSD) core capable of multiplexing or overlaying multiple video streams to a single output video stream. The output of the OSD core drives the DVI video display interface on the board. Performance monitor blocks are added to capture performance data. All 10 video streams moved by the AXI VDMA blocks are buffered through a shared DDR3 SDRAM memory and are controlled by a MicroBlaze™ processor. The reference system is targeted for the Virtex-6 XC6VLX240TFF1156-1 FPGA on the Xilinx® ML605 Rev D evaluation board

    標簽: XAPP 740 AXI 互聯

    上傳時間: 2013-11-23

    上傳用戶:shen_dafa

  • Creating Safe State Machines(Mentor)

      Finite state machines are widely used in digital circuit designs. Generally, when designing a state machine using an HDL, the synthesis tools will optimize away all states that cannot be reached and generate a highly optimized circuit. Sometimes, however, the optimization is not acceptable. For example, if the circuit powers up in an invalid state, or the circuit is in an extreme working environment and a glitch sends it into an undesired state, the circuit may never get back to its normal operating condition.

    標簽: Creating Machines Mentor State

    上傳時間: 2013-11-02

    上傳用戶:xauthu

  • 高性能覆銅板的發展趨勢及對環氧樹脂性能的新需求

    討論、研究高性能覆銅板對它所用的環氧樹脂的性能要求,應是立足整個產業鏈的角度去觀察、分析。特別應從HDI多層板發展對高性能CCL有哪些主要性能需求上著手研究。HDI多層板有哪些發展特點,它的發展趨勢如何——這都是我們所要研究的高性能CCL發展趨勢和重點的基本依據。而HDI多層板的技術發展,又是由它的應用市場——終端電子產品的發展所驅動(見圖1)。 圖1 在HDI多層板產業鏈中各類產品對下游產品的性能需求關系圖 1.HDI多層板發展特點對高性能覆銅板技術進步的影響1.1 HDI多層板的問世,對傳統PCB技術及其基板材料技術是一個嚴峻挑戰20世紀90年代初,出現新一代高密度互連(High Density Interconnection,簡稱為 HDI)印制電路板——積層法多層板(Build—Up Multiplayer printed board,簡稱為 BUM)的最早開發成果。它的問世是全世界幾十年的印制電路板技術發展歷程中的重大事件。積層法多層板即HDI多層板,至今仍是發展HDI的PCB的最好、最普遍的產品形式。在HDI多層板之上,將最新PCB尖端技術體現得淋漓盡致。HDI多層板產品結構具有三大突出的特征:“微孔、細線、薄層化”。其中“微孔”是它的結構特點中核心與靈魂。因此,現又將這類HDI多層板稱作為“微孔板”。HDI多層板已經歷了十幾年的發展歷程,但它在技術上仍充滿著朝氣蓬勃的活力,在市場上仍有著前程廣闊的空間。

    標簽: 性能 發展趨勢 覆銅板 環氧樹脂

    上傳時間: 2013-11-19

    上傳用戶:zczc

  • PCB設計問題集錦

    PCB設計問題集錦 問:PCB圖中各種字符往往容易疊加在一起,或者相距很近,當板子布得很密時,情況更加嚴重。當我用Verify Design進行檢查時,會產生錯誤,但這種錯誤可以忽略。往往這種錯誤很多,有幾百個,將其他更重要的錯誤淹沒了,如何使Verify Design會略掉這種錯誤,或者在眾多的錯誤中快速找到重要的錯誤。    答:可以在顏色顯示中將文字去掉,不顯示后再檢查;并記錄錯誤數目。但一定要檢查是否真正屬于不需要的文字。 問: What’s mean of below warning:(6230,8330 L1) Latium Rule not checked: COMPONENT U26 component rule.答:這是有關制造方面的一個檢查,您沒有相關設定,所以可以不檢查。 問: 怎樣導出jop文件?答:應該是JOB文件吧?低版本的powerPCB與PADS使用JOB文件。現在只能輸出ASC文件,方法如下STEP:FILE/EXPORT/選擇一個asc名稱/選擇Select ALL/在Format下選擇合適的版本/在Unit下選Current比較好/點擊OK/完成然后在低版本的powerPCB與PADS產品中Import保存的ASC文件,再保存為JOB文件。 問: 怎樣導入reu文件?答:在ECO與Design 工具盒中都可以進行,分別打開ECO與Design 工具盒,點擊右邊第2個圖標就可以。 問: 為什么我在pad stacks中再設一個via:1(如附件)和默認的standardvi(如附件)在布線時V選擇1,怎么布線時按add via不能添加進去這是怎么回事,因為有時要使用兩種不同的過孔。答:PowerPCB中有多個VIA時需要在Design Rule下根據信號分別設置VIA的使用條件,如電源類只能用Standard VIA等等,這樣操作時就比較方便。詳細設置方法在PowerPCB軟件通中有介紹。 問:為什么我把On-line DRC設置為prevent..移動元時就會彈出(圖2),而你們教程中也是這樣設置怎么不會呢?答:首先這不是錯誤,出現的原因是在數據中沒有BOARD OUTLINE.您可以設置一個,但是不使用它作為CAM輸出數據. 問:我用ctrl+c復制線時怎設置原點進行復制,ctrl+v粘帖時總是以最下面一點和最左邊那一點為原點 答: 復制布線時與上面的MOVE MODE設置沒有任何關系,需要在右鍵菜單中選擇,這在PowerPCB軟件通教程中有專門介紹. 問:用(圖4)進行修改線時拉起時怎總是往左邊拉起(圖5),不知有什么辦法可以輕易想拉起左就左,右就右。答: 具體條件不明,請檢查一下您的DESIGN GRID,是否太大了. 問: 好不容易拉起右邊但是用(圖6)修改線怎么改怎么下面都會有一條不能和在一起,而你教程里都會好好的(圖8)答:這可能還是與您的GRID 設置有關,不過沒有問題,您可以將不需要的那段線刪除.最重要的是需要找到布線的感覺,每個軟件都不相同,所以需要多練習。 問: 尊敬的老師:您好!這個圖已經畫好了,但我只對(如圖1)一種的完全間距進行檢查,怎么錯誤就那么多,不知怎么改進。請老師指點。這個圖在附件中請老師幫看一下,如果還有什么問題請指出來,本人在改進。謝?。。。?!答:請注意您的DRC SETUP窗口下的設置是錯誤的,現在選中的SAME NET是對相同NET進行檢查,應該選擇NET TO ALL.而不是SAME NET有關各項參數的含義請仔細閱讀第5部教程. 問: U101元件已建好,但元件框的拐角處不知是否正確,請幫忙CHECK 答:元件框等可以通過修改編輯來完成。問: U102和U103元件沒建完全,在自動建元件參數中有幾個不明白:如:SOIC--》silk screen欄下spacing from pin與outdent from first pin對應U102和U103元件應寫什么數值,還有這兩個元件SILK怎么自動設置,以及SILK內有個圓圈怎么才能畫得與該元件參數一致。 答:Spacing from pin指從PIN到SILK的Y方向的距離,outdent from first pin是第一PIN與SILK端點間的距離.請根據元件資料自己計算。

    標簽: PCB 設計問題 集錦

    上傳時間: 2014-01-03

    上傳用戶:Divine

  • pci e PCB設計規范

    This document provides practical, common guidelines for incorporating PCI Express interconnect layouts onto Printed Circuit Boards (PCB) ranging from 4-layer desktop baseboard designs to 10- layer or more server baseboard designs. Guidelines and constraints in this document are intended for use on both baseboard and add-in card PCB designs. This includes interconnects between PCI Express devices located on the same baseboard (chip-to-chip routing) and interconnects between a PCI Express device located “down” on the baseboard and a device located “up” on an add-in card attached through a connector. This document is intended to cover all major components of the physical interconnect including design guidelines for the PCB traces, vias and AC coupling capacitors, as well as add-in card edge-finger and connector considerations. The intent of the guidelines and examples is to help ensure that good high-speed signal design practices are used and that the timing/jitter and loss/attenuation budgets can also be met from end-to-end across the PCI Express interconnect. However, while general physical guidelines and suggestions are given, they may not necessarily guarantee adequate performance of the interconnect for all layouts and implementations. Therefore, designers should consider modeling and simulation of the interconnect in order to ensure compliance to all applicable specifications. The document is composed of two main sections. The first section provides an overview of general topology and interconnect guidelines. The second section concentrates on physical layout constraints where bulleted items at the beginning of a topic highlight important constraints, while the narrative that follows offers additional insight.  

    標簽: pci PCB 設計規范

    上傳時間: 2014-01-24

    上傳用戶:s363994250

  • 8259 VHDL代碼

    a8259 可編程中斷控制 altera提供 The a8259 is designed to simplify the implementation of the interrupt interface  in 8088 and 8086  based microcomputer systems. The device is known as a programmable interrupt controller.  The a8259 receives and prioritizes up to 8 interrupts,  and in the cascade mode, this can be expanded up to  64 interrupts. An asynchronous reset and a clock input have been added to improve operation and reliability.

    標簽: 8259 VHDL 代碼

    上傳時間: 2015-01-02

    上傳用戶:panpanpan

  • STEP 7 V5.4 編程手冊

    學習西門子S7-300/400PLC編程用。

    標簽: STEP 5.4 編程手冊

    上傳時間: 2015-01-02

    上傳用戶:ifree2016

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