PCB LAYOUT 術(shù)語解釋(TERMS)1. COMPONENT SIDE(零件面、正面)︰大多數(shù)零件放置之面。2. SOLDER SIDE(焊錫面、反面)。3. SOLDER MASK(止焊膜面)︰通常指Solder Mask Open 之意。4. TOP PAD︰在零件面上所設(shè)計之零件腳PAD，不管是否鑽孔、電鍍。5. BOTTOM PAD：在銲錫面上所設(shè)計之零件腳PAD，不管是否鑽孔、電鍍。6. POSITIVE LAYER：單、雙層板之各層線路；多層板之上、下兩層線路及內(nèi)層走線皆屬之。7. NEGATIVE LAYER：通常指多層板之電源層。8. INNER PAD：多層板之POSITIVE LAYER 內(nèi)層PAD。9. ANTI-PAD：多層板之NEGATIVE LAYER 上所使用之絕緣範(fàn)圍，不與零件腳相接。10. THERMAL PAD：多層板內(nèi)NEGATIVE LAYER 上必須零件腳時所使用之PAD，一般稱為散熱孔或?qū)住?1. PAD (銲墊)：除了SMD PAD 外，其他PAD 之TOP PAD、BOTTOM PAD 及INNER PAD 之形狀大小皆應(yīng)相同。12. Moat : 不同信號的 Power& GND plane 之間的分隔線13. Grid : 佈線時的走線格點2. Test Point : ATE 測試點供工廠ICT 測試治具使用ICT 測試點 LAYOUT 注意事項:PCB 的每條TRACE 都要有一個作為測試用之TEST PAD(測試點)，其原則如下：1. 一般測試點大小均為30-35mil，元件分布較密時，測試點最小可至30mil.測試點與元件PAD 的距離最小為40mil。2. 測試點與測試點間的間距最小為50-75mil，一般使用75mil。密度高時可使用50mil,3. 測試點必須均勻分佈於PCB 上，避免測試時造成板面受力不均。4. 多層板必須透過貫穿孔(VIA)將測試點留於錫爐著錫面上(Solder Side)。5. 測試點必需放至於Bottom Layer6. 輸出test point report(.asc 檔案powerpcb v3.5)供廠商分析可測率7. 測試點設(shè)置處:Setuppadsstacks
標(biāo)簽： layout design pcb 硬件工程師
上傳時間： 2013-11-17
上傳用戶：cjf0304
Integrated EMI/Thermal Design forSwitching Power SuppliesWei ZhangThesis submitted to the Faculty of theVirginia Polytechnic Institute and State Universityin partial fulfillment of the requirements for the degree of Integrated EMI/Thermal Design forSwitching Power SuppliesWei Zhang(ABSTRACT)This work presents the modeling and analysis of EMI and thermal performancefor switch power supply by using the CAD tools. The methodology and design guidelinesare developed.By using a boost PFC circuit as an example, an equivalent circuit model is builtfor EMI noise prediction and analysis. The parasitic elements of circuit layout andcomponents are extracted analytically or by using CAD tools. Based on the model, circuitlayout and magnetic component design are modified to minimize circuit EMI. EMI filtercan be designed at an early stage without prototype implementation.In the second part, thermal analyses are conducted for the circuit by using thesoftware Flotherm, which includes the mechanism of conduction, convection andradiation. Thermal models are built for the components. Thermal performance of thecircuit and the temperature profile of components are predicted. Improved thermalmanagement and winding arrangement are investigated to reduce temperature.In the third part, several circuit layouts and inductor design examples are checkedfrom both the EMI and thermal point of view. Insightful information is obtained.
標(biāo)簽： EMI 開關(guān)電源 英文
上傳時間： 2013-11-16
上傳用戶：萍水相逢
SOD323A/123/523/723封裝尺寸 Packageing Information●SOD-523 ●SOD-723●SMA SOD-123A●SOD-323A
上傳時間： 2013-10-22
上傳用戶：妄想演繹師
The high defi nition multimedia interface (HDMI) is fastbecoming the de facto standard for passing digitalaudio and video data in home entertainment systems.This standard includes an I2C type bus called a displaydata channel (DDC) that is used to pass extended digitalinterface data (EDID) from the sinkdevice (such as adigital TV) to the source device (such as a digital A/Vreceiver). EDID includes vital information on the digitaldata formats that the sink device can accept. The HDMIspecifi cation requires that devices have less than 50pFof input capacitance on their DDC bus lines, which canbe very diffi cult to meet. The LTC®4300A’s capacitancebuffering feature allows devices to pass the HDMI DDCinput capacitance compliance test with ease.
上傳時間： 2013-11-21
上傳用戶：tian126vip
Automobiles, aircraft, marine vehicles, uninterruptiblepower supplies and telecom hardware represent areasutilizing series connected battery stacks. These stacksof individual cells may contain many units, reaching potentialsof hundreds of volts. In such systems it is oftendesirable to accurately determine each individual cell’svoltage. Obtaining this information in the presence of thehigh “common mode” voltage generated by the batterystack is more diffi cult than might be supposed.
上傳時間： 2013-10-24
上傳用戶：kang1923
Abstract: How can an interface change a happy face to a sad face? Engineers have happy faces when an interface works properly.Sad faces indicate failure somewhere. Because interfaces between microprocessors and ICs are simple—even easy—they are oftenignored until interface failure causes sad faces all around. In this article, we discuss a common SPI error that can be almostimpossible to find in a large system. Links to interface tutorial information are provided for complete information. Noise as a systemissue and ICs to minimize its effects are also described.
上傳時間： 2013-11-18
上傳用戶：zgz317
It provides a base of DICT web service ( similar to DICT rfc2229) and create relative applications (server side,client side), they are all SOAP based.
標(biāo)簽： DICT applications provides relative
上傳時間： 2015-01-12
上傳用戶：alan-ee
It provides a base of DICT web service ( similar to DICT rfc2229) and create relative applications (server side,client side), they are all SOAP based.
標(biāo)簽： DICT applications provides relative
上傳時間： 2015-01-12
上傳用戶：TF2015
The Gray Watson debugging malloc library is C source code for a drop in replacement for the system malloc & other memory manage ment routines. What is unique about this library is that it contains a number of powerful debugging facilities including very comprehensive heap testing and ex- cellent run-time debugging information.
標(biāo)簽： replacement debugging for library
上傳時間： 2015-02-05
上傳用戶：TF2015
Conservator extends on the concept of a Flyweight Factory by allowing shared Flyweight objects to be mutated after creation without undesired side effects.
標(biāo)簽： Flyweight Conservator allowing extends
上傳時間： 2014-01-06
上傳用戶：cuibaigao
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