Pitch=CorrelogramPitch(correlogram, width [, sr, lowPitch, highPitch]) computes the Pitch of a correlogram sequence by finding the time lag with the largest correlation energy.
標簽： Pitch CorrelogramPitch correlogram highPitch
上傳時間： 2015-08-11
上傳用戶：youth25
helicopter fuzzy pid control including Pitch and yaw
標簽： helicopter including control fuzzy
上傳時間： 2014-01-17
上傳用戶：gxmm
Helicopter PID control including Pitch and yaw
標簽： Helicopter including control Pitch
上傳時間： 2015-11-18
上傳用戶：qiao8960
該程序是日本人用matlab寫出來的提取Pitch的，效果很好，唯一的缺點是算的太慢
上傳時間： 2013-12-08
上傳用戶：大融融rr
cepstral analisys for Pitch and F0 detection
標簽： detection cepstral analisys Pitch
上傳時間： 2017-03-08
上傳用戶：ardager
The is used for Pitch calculation
標簽： calculation Pitch used The
上傳時間： 2013-12-14
上傳用戶：lo25643
Abstract: Using a wafer-level package (WLP) can reduce the overall size and cost of your solution.However when using a WLP IC, the printed circuit board (PCB) layout can become more complex and, ifnot carefully planned, result in an unreliable design. This article presents some PCB designconsiderations and general recommendations for choosing a 0.4mm- or 0.5mm-Pitch WLP for yourapplication.
標簽： Considerations Guidelines and Design
上傳時間： 2013-10-14
上傳用戶：ysystc699
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced Pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
上傳時間： 2013-10-22
上傳用戶：ztj182002
Abstract: Using a wafer-level package (WLP) can reduce the overall size and cost of your solution.However when using a WLP IC, the printed circuit board (PCB) layout can become more complex and, ifnot carefully planned, result in an unreliable design. This article presents some PCB designconsiderations and general recommendations for choosing a 0.4mm- or 0.5mm-Pitch WLP for yourapplication.
標簽： Considerations Guidelines and Design
上傳時間： 2013-11-09
上傳用戶：ls530720646
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced Pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
上傳時間： 2013-11-21
上傳用戶：不懂夜的黑
