現(xiàn)在很多windows平板 帶有很多sensor 本代碼可以運(yùn)行在win8、win10下 讀取compass的值 只要稍加修改API中的參數(shù) 即可讀取其他sensor的值 大家可以從中學(xué)習(xí)如何在windows下如何讀取傳感器數(shù)值 例如Lightsensor Accelerometer Gyrometer P-sensor等
標(biāo)簽： Sensor code
上傳時(shí)間： 2016-04-12
上傳用戶：aiai
對(duì)微機(jī)電系統(tǒng)(Micro electro mechanical systems，MEMS)組裝與封裝工藝的特點(diǎn)進(jìn)行了總結(jié)分析，給出了MEMS組裝與封裝設(shè)備的研究現(xiàn)狀。針對(duì)MEMS產(chǎn)業(yè)發(fā)展的特點(diǎn)，分析了面向MEMS組裝與封裝的微操作設(shè)備中的工藝參數(shù)優(yōu)化數(shù)據(jù)庫、快速精密定位、模塊化作業(yè)工具、快速顯微視覺、柔性裝夾和自動(dòng)化物流等關(guān)鍵技術(shù)。在此基礎(chǔ)上，詳細(xì)介紹了研制的MEMS傳感器陽極化鍵合設(shè)備和引線鍵合設(shè)備的組成結(jié)構(gòu)，工作原理，并給出了組裝和封裝試驗(yàn)結(jié)果。最后，指出了MEMS組裝與封裝技術(shù)及設(shè)備研制的發(fā)展趨勢(shì)。
標(biāo)簽： 微機(jī)電系統(tǒng) 封裝 關(guān)鍵技術(shù) 操作
上傳時(shí)間： 2016-07-26
上傳用戶：leishenzhichui
A major societal challenge for the decades to come will be the delivery of effective medical services while at the same time curbing the growing cost of healthcare. It is expected that new concepts-particularly electronically assisted healthcare will provide an answer. This will include new devices, new medical services as well as networking. On the device side, impressive innovation has been made possible by micro- and nanoelectronics or CMOS Integrated Circuits. Even higher accuracy and smaller form factor combined with reduced cost and increased convenience of use are enabled by incorporation of CMOS IC design in the realization of biomedical systems. The compact hearing aid devices and current pacemakers are good examples of how CMOS ICs bring about these new functionalities and services in the medical field. Apart from these existing applications, many researchers are trying to develop new bio-medical solutions such as Artificial Retina, Deep Brain Stimulation, and Wearable Healthcare Systems. These are possible by combining the recent advances of bio-medical technology with low power CMOS IC technology.
上傳時(shí)間： 2017-02-06
上傳用戶：linyj
本設(shè)計(jì)利用德國(guó)西門子PLC S7-200進(jìn)行電鍍行車自動(dòng)化控制。在本次設(shè)計(jì)中，從電鍍行車在生產(chǎn)現(xiàn)場(chǎng)的運(yùn)行環(huán)境和自動(dòng)控制技術(shù)器件在國(guó)內(nèi)的應(yīng)用前景來考慮，以電鍍行車具備自動(dòng)生產(chǎn)運(yùn)行為目的，制定了采用在當(dāng)前及以后都應(yīng)用廣泛且能適應(yīng)多種環(huán)境的可編程控制器PLC來控制整個(gè)工作流程的方案。首先對(duì)系統(tǒng)的軟硬件進(jìn)行設(shè)計(jì)，給出系統(tǒng)的工作流程圖、硬件接線圖、PLC控制I/O端口分配表及整體程序流程圖。并以STEP7 Micro/WIN32為編程軟件設(shè)計(jì)出電鍍行車自動(dòng)控制系統(tǒng)的梯形圖，最后通過仿真實(shí)驗(yàn)，實(shí)現(xiàn)了電鍍行車自動(dòng)化控制，提高了電鍍生產(chǎn)效率，降低了勞動(dòng)強(qiáng)度。
上傳時(shí)間： 2017-11-11
上傳用戶：狂暴老戴
ZCORE系列NBIOT開發(fā)底板資料開源。 NBIOT開發(fā)板主要接口： Micro USB *1 3.7V電池充電電路 慶科WIFI模塊支持 貼片SIM卡支持 STM32L433全部外圍接口已拉出為2.0排針
標(biāo)簽： ZCORE-STM 32 BC 95 核心板
上傳時(shí)間： 2018-04-25
上傳用戶：pshr960405
The rapid growth in mobile communications has led to an increasing demand for wide- band high data rate communications services. In recent years, Distributed Antenna Systems (DAS) has emerged as a promising candidate for future (beyond 3G or 4G) mobile communications, as illustrated by projects such as FRAMES and FuTURE. The architecture of DAS inherits and develops the concepts of pico- or micro-cell systems, where multiple distributed antennas or access points (AP) are connected to and con- trolled by a central unit.
標(biāo)簽： Distributed Antenna Systems
上傳時(shí)間： 2020-05-27
上傳用戶：shancjb
Applications of microelectromechanical systems (MEMS) and microfabrica- tion have spread to different fields of engineering and science in recent years. Perhaps the most exciting development in the application of MEMS technol- ogy has occurred in the biological and biomedical areas. In addition to key fluidic components, such as microvalves, pumps, and all kinds of novel sensors that can be used for biological and biomedical analysis and mea- surements, many other types of so-called micro total analysis systems (TAS) have been developed.
標(biāo)簽： Applications Technologies Bio-MEMS and
上傳時(shí)間： 2020-06-06
上傳用戶：shancjb
The mature CMOS fabrication processes are available in many IC foundries. It is cost-effective to leverage the existing CMOS fabrication technologies to implement MEMS devices. On the other hand, the MEMS devices could also add values to the IC industry as the Moore’s law reaching its limit. The CMOS MEMS could play a key role to bridge the gap between the CMOS and MEMS technologies. The CMOS MEMS also offers the advantage of monolithic integration of ICs and micro mechanical components.
標(biāo)簽： TECHNOLOGY CMOS MEMS KEY
上傳時(shí)間： 2020-06-06
上傳用戶：shancjb
For more than three decades, Micro Electro Mechanical Systems (MEMS) have steadily transitioned out of research labs and into production forming a more than $10 billion market [1]. MEMS devices such as accelerometers, pressure sensors and microphones, to name a few, have seen immense utilization, particularly in the consumer electronics market, because of their compact sizes and minute power consumptions. In addition, these devices benefit from batch fabrication, which has enabled year-over-year reductions in cost [2]. In recent years,
標(biāo)簽： Frequency Tunable MEMS
上傳時(shí)間： 2020-06-06
上傳用戶：shancjb
Micro-Electro-Mechanical Systems (MEMS) are miniature systems composed ofintegratedelectricalandmechanicalpartstosenseand/orcontrolthingsonaμmscale. The concept of MEMS is attributed to Richard Feynman’s famous talk on December 29th, 1959 [2,3]. Dr. Feynman foresaw many aspects of future MEMS development with his insight in microphysics. In particular, material properties in the μm scale are differentfrombulkpropertiesandthescalingdownofintegratedcircuits(IC)fabrication technology has been a major driving force of MEMS development.
標(biāo)簽： Performance High MEMS RF
上傳時(shí)間： 2020-06-06
上傳用戶：shancjb
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