Electrostatic discharge (ESD) is one of the most prevalent threats to the reliability of electronic components. It is an event in which a finite amount of charge is trans- ferred from one object (i.e., human body) to another (i.e., microchip). This process can result in a very high current passing through the microchip within a very short period of time, and, hence, more than 35% of chip damages can be attributed to an ESD-related event. As such, designing on-chip ESD structures to protect integrated circuits against the ESD stresses is a high priority in the semiconductor industry.
標簽： Electrostatic Protection Discharge
上傳時間： 2020-06-05
上傳用戶：shancjb
Electrostatic discharge (ESD) events can have serious detrimental effects on the manufacture and performance of microelectronic devices, the systems that contain them, and the manufacturing facilities used to produce them. Submicron device technologies, high system operating speeds, and factory automation are making ESD control programs a critical factor in the quality and reliability of ESD-sensitive products.
標簽： Management Program ESD
上傳時間： 2020-06-05
上傳用戶：shancjb
The goal of this book is to introduce the simulation methods necessary to describe the behaviour of semiconductor devices during an electrostatic discharge (ESD). The challenge of this task is the correct description of semiconductor devices under very high current density and high temperature transients. As it stands, the book can be no more than a snapshot and a summary of the research in this field during the past few years. The authors hope that the book will provide the basis for further development of simulation methods at this current frontier of device physics.
標簽： Development Protection ESD
上傳時間： 2020-06-05
上傳用戶：shancjb
The challenges associated with the design and implementation of Electro- static Discharge (ESD) protection circuits become increasingly complex as technology is scaled well into nano-metric regime. One must understand the behavior of semiconductor devices under very high current densities, high temperature transients in order to surmount the nano-meter ESD challenge. As a consequence, the quest for suitable ESD solution in a given technology must start from the device level. Traditional approaches of ESD design may not be adequate as the ESD damages occur at successively lower voltages in nano-metric dimensions.
標簽： Protection Circuit Device Design ESD and
上傳時間： 2020-06-05
上傳用戶：shancjb
Guideline Suggestion for High-Speed I/O ESD Protection
標簽： ESD_Suggestion_for_HighSpeed_IO_K er
上傳時間： 2020-06-05
上傳用戶：shancjb
The planarization technology of Chemical-Mechanical-Polishing (CMP), used for the manufacturing of multi- level metal interconnects for high-density Integrated Circuits (IC), is also readily adaptable as an enabling technology in MicroElectroMechanical Systems (MEMS) fabrication, particularly polysilicon surface micromachining. CMP not only eases the design and manufacturability of MEMS devices by eliminating several photolithographic and film issues generated by severe topography, but also enables far greater flexibility with process complexity and associated designs. T
標簽： mechanical polishing Chemical
上傳時間： 2020-06-06
上傳用戶：shancjb
Micro-Electro-Mechanical Systems (MEMS) are miniature systems composed ofintegratedelectricalandmechanicalpartstosenseand/orcontrolthingsonaμmscale. The concept of MEMS is attributed to Richard Feynman’s famous talk on December 29th, 1959 [2,3]. Dr. Feynman foresaw many aspects of future MEMS development with his insight in microphysics. In particular, material properties in the μm scale are differentfrombulkpropertiesandthescalingdownofintegratedcircuits(IC)fabrication technology has been a major driving force of MEMS development.
標簽： Performance High MEMS RF
上傳時間： 2020-06-06
上傳用戶：shancjb
Resource allocation is an important issue in wireless communication networks. In recent decades, cognitive radio technology and cognitive radio-based networks have obtained more and more attention and have been well studied to improve spectrum utilization and to overcomethe problem of spectrum scarcity in future wireless com- munication systems. Many new challenges on resource allocation appear in cogni- tive radio-based networks. In this book, we focus on effective solutions to resource allocation in several important cognitive radio-based networks, including a cogni- tive radio-basedopportunisticspectrum access network, a cognitiveradio-basedcen- tralized network, a cognitive radio-based cellular network, a cognitive radio-based high-speed vehicle network, and a cognitive radio-based smart grid.
上傳時間： 2020-06-07
上傳用戶：shancjb
The solid high-polymer-film-type fuel cell (PEM-FC) system is used as the power supply equipment for transportation and replaces an internal combustion engine. A reduction of the environmental load is expected through the cogeneration system’s (CGS) use of the PEM-FC system as a distributed power supply to individual houses, apartments, and so forth [1–3]. The growing use of distributed power systems, such as fuel cells, the reduction of power-transmission losses, and an increase of waste heat recovery are expected. Therefore, the reduction of carbon- dioxide emission is also expected as compared to conventional energy supply methods using commercial electric power.
標簽： Micro-grids Fuel Cell
上傳時間： 2020-06-07
上傳用戶：shancjb
The use of renewable energy systems, such as wind power, hydropower, tidal power, solar power, geothermal power and biomass burn is growing. Research in electric power generation from renewable sources is continuously expanding and stands for an area of high technological and financial importance. The implemen- tation of new technologies for the functioning and management of renewable energy systems will help to further develop the renewable energy sector.
標簽： Intelligent Renewable Systems Energy
上傳時間： 2020-06-07
上傳用戶：shancjb
