F型端子的壓接與檢驗
標簽： 端子
上傳時間： 2013-06-05
上傳用戶：eeworm
·Ive been working with Windows CE for almost as long as its been in existence. A Windows programmer for many years, Im amazed by the number of different, typically quite small, systems to which I can a
上傳時間： 2013-04-24
上傳用戶：Zxcvbnm
·無線經典教材《無線通信》by Goldsmith 英文版
上傳時間： 2013-06-27
上傳用戶：zklh8989
PCI Arbitor by VHDL
上傳時間： 2013-08-18
上傳用戶：h886166
提出了一種基于FPGA的高階高速F IR濾波器的設計與實現方法。通過一個169階的均方根\r\n升余弦滾降濾波器的設計,介紹了如何應用流水線技術來設計高階高速F IR濾波器,并且對所設計的\r\nFIR濾波器性能、資源占用進行了分析。
上傳時間： 2013-08-31
上傳用戶：小火車啦啦啦
* DESCRIPTION: DDS design BY PLD DEVICES.\r\n *\r\n * AUTHOR: Sun Yu\r\n *\r\n * HISTORY: 12/06/2002 \r\n *
標簽： DESCRIPTION DEVICES design DDS
上傳時間： 2013-09-09
上傳用戶：jokey075
Altium Designer Guide by Univ of Nevada
標簽： Designer Altium Nevada Guide
上傳時間： 2013-09-11
上傳用戶：qingzhuhu
Accessing IDE Hard disk by ATmega32 microcontroller (Proteus simulation include)
標簽： microcontroller simulation Accessing Proteus
上傳時間： 2013-09-21
上傳用戶：18888888888
Integrated EMI/Thermal Design forSwitching Power SuppliesWei ZhangThesis submitted to the Faculty of theVirginia Polytechnic Institute and State Universityin partial fulfillment of the requirements for the degree of Integrated EMI/Thermal Design forSwitching Power SuppliesWei Zhang(ABSTRACT)This work presents the modeling and analysis of EMI and thermal performancefor switch power supply by using the CAD tools. The methodology and design guidelinesare developed.By using a boost PFC circuit as an example, an equivalent circuit model is builtfor EMI noise prediction and analysis. The parasitic elements of circuit layout andcomponents are extracted analytically or by using CAD tools. Based on the model, circuitlayout and magnetic component design are modified to minimize circuit EMI. EMI filtercan be designed at an early stage without prototype implementation.In the second part, thermal analyses are conducted for the circuit by using thesoftware Flotherm, which includes the mechanism of conduction, convection andradiation. Thermal models are built for the components. Thermal performance of thecircuit and the temperature profile of components are predicted. Improved thermalmanagement and winding arrangement are investigated to reduce temperature.In the third part, several circuit layouts and inductor design examples are checkedfrom both the EMI and thermal point of view. Insightful information is obtained.
上傳時間： 2013-11-10
上傳用戶：1595690
Abstract: Investment in smart meters and smart grid end equipment continues to grow worldwide as countriestry to make their electric delivery systems more efficient. However, as critical as the electric deliveryinfrastructure is, it is normally not secured and thus subject to attack. This article describes the concept oflife-cycle security—the idea that embedded equipment in the smart grid must have security designed into theentire life of the product, even back to the contract manufacturer. We also talk about how life-cycle securityapplies to embedded equipment in the smart grid. Potential threats are discussed, as are potential solutionsto mitigate the risks posed by those threats.
上傳時間： 2014-12-24
上傳用戶：熊少鋒
