A major societal challenge for the decades to come will be the delivery of effective medical services while at the same time curbing the growing cost of healthcare. It is expected that new concepts-particularly electronically assisted healthcare will provide an answer. This will include new devices, new medical services as well as networking. On the device side, impressive innovation has been made possible by micro- and nanoelectronics or CMOS Integrated Circuits. Even higher accuracy and smaller form factor combined with reduced cost and increased convenience of use are enabled by incorporation of CMOS IC design in the realization of biomedical systems. The compact hearing aid devices and current pacemakers are good examples of how CMOS ICs bring about these new functionalities and services in the medical field. Apart from these existing applications, many researchers are trying to develop new bio-medical solutions such as Artificial Retina, Deep Brain Stimulation, and Wearable Healthcare Systems. These are possible by combining the recent advances of bio-medical technology with low power CMOS IC technology.
上傳時間： 2017-02-06
上傳用戶：linyj
The AP2406 is a 1.5Mhz constant frequency, slope compensated current mode PWM step-down converter. The device integrates a main switch and a synchronous rectifier for high efficiency without an external Schottky diode. It is ideal for powering portable equipment that runs from a single cell lithium-Ion (Li+) battery. The AP2406 can supply 600mA of load current from a 2.5V to 5.5V input voltage. The output voltage can be regulated as low as 0.6V. The AP2406 can also run at 100% duty cycle for low dropout operation, extending battery life in portable system. Idle mode operation at light loads provides very low output ripple voltage for noise sensitive applications. The AP2406 is offered in a low profile (1mm) 5-pin, thin SOT package, and is available in an adjustable version and fixed output voltage of 1.2V, 1.5V and 1.8V
上傳時間： 2017-02-23
上傳用戶：w124141
是否要先打開ALLEGRO? 不需要(當然你的機器須有CADENCE系統)。生成完封裝后在你的輸出目錄下就會有幾千個器件（全部生成的話）,默認輸出目錄為c:\MySym\. Level里面的Minimum, Nominal, Maximum 是什么意思？ 對應ipc7351A的ABC封裝嗎？ 是的 能否將MOST, NOMINAL, LEAST三種有差別的封裝在命名上也體現出差別？ NOMINAL 的名稱最后沒有后綴，MOST的后綴自動添加“Ｍ”，LEAST的后綴自動添加“L”，你看看生成的庫名稱就知道了。（直插件以及特別的器件，如BGA等是沒有MOST和LEAST級別的，對這類器件只有NOMINAL） IC焊盤用長方形好像比用橢圓形的好，能不能生成長方形的？ 嗯。。。。基本上應該是非直角的焊盤比矩形的焊盤好，我記不得是AMD還是NS還是AD公司專門有篇文檔討論了這個問題，如果沒有記錯的話至少有以下好處：信號質量好、更省空間（特別是緊密設計中）、更省錫量。我過去有一篇帖子有一個倒角焊盤的SKILL，用于晶振電路和高速器件（如DDR的濾波電容)，原因是對寬度比較大的矩形用橢圓焊盤也不合適，這種情況下用自定義的矩形倒角焊盤就比較好了－－－你可以從網上另外一個DDR設計的例子中看到。 當然，我已經在程序中添加了一選擇項，對一些矩形焊盤可以選擇倒角方式. 剛才試了一下，感覺器件的命名的規范性不是太好，另好像不能生成器件的DEVICE文件，我沒RUN完。。。 這個程序的命名方法基本參照IPC-7351，每個人都有自己的命名嗜好，仍是不好統一的；我是比較懶的啦，所以就盡量靠近IPC-7351了。 至于DEVICE，的選項已經添加 (這就是批量程序的好處，代碼中加一行，重新生產的上千上萬個封裝就都有新東西了)。 你的庫都是"-"的,請問用過ALLEGRO的兄弟,你們的FOOTPRINT認"-"嗎?反正我的ALLEGRO只認"_"(下劃線) 用“－”應該沒有問題的，焊盤的命名我用的是"_"（這個一直沒改動過）。 部分絲印畫在焊盤上了。 絲印的問題我早已知道，只是盡量避免開（我有個可配置的SilkGap變量）,不過工作量比較大，有些已經改過，有些還沒有；另外我沒有特別費功夫在絲印上的另一個原因是，我通常最后用AUTO-SILK的來合并相關的層，這樣既方便快捷也統一各個器件的絲印間距，用AUTO-SILK的話絲印線會自動避開SOLDER-MASK的。 點擊allegro后命令行出現E- Can't change to directory: Files\FPM，什么原因？ 我想你一定是將FPM安裝在一個含空格的目錄里面了，比如C:\Program Files\等等之類，在自定義安裝目錄的時候該目錄名不能含有空格，且存放生成的封裝的目錄名也不能含有空格。你如果用默認安裝的話應該是不會有問題的, 默認FPM安裝在C:\FPM，默認存放封裝的目錄為C:\MYSYM 0.04版用spb15.51生成時.allegro會死機.以前版本的Allegro封裝生成器用spb15.51生成時沒有死機現象 我在生成MELF類封裝的時候有過一次死機現象，估計是文件操作錯誤導致ALLEGRO死機，原因是我沒有找到在ｓｋｉｌｌ里面直接生成SHAPE焊盤的方法（FLASH和常規焊盤沒問題）, 查了下資料也沒有找到解決方法，所以只得在外部調用SCRIPT來將就一下了。（下次我再查查看），用SCRIPT的話文件訪問比較頻繁（幸好目前MELF類的器件不多）. 解決辦法： １、對MELF類器件單獨選擇生成，其它的應該可以一次生成。 ２、試試最新的版本(當前0.05) 請說明運行在哪類器件的時候ALLEGRO出錯，如果不是在MELF附近的話，請告知，謝謝。 用FPM0.04生成的封裝好像文件都比較大，比如CAPC、RES等器件，都是300多K，而自己建的或采用PCB Libraries Eval生成的封裝一般才幾十K到100K左右，不知封裝是不是包含了更多的信息？ 我的每個封裝文件包含了幾個文字層（REF,VAL,TOL,DEV,PARTNUMBER等),SILK和ASSEM也是分開的，BOND層和高度信息，還有些定位線(在DISP層）,可能這些越來越豐富的信息加大了生成文件的尺寸.你如果想看有什么內容的話，打開所有層就看見了（或REPORT） 非常感謝 LiWenHui 發現的BUG, 已經找到原因，是下面這行： axlDBChangeDesignExtents( '((-1000 -1000) (1000 1000))) 有尺寸空間開得太大，后又沒有壓縮的原因，現在生成的封裝也只有幾十K了，0.05版已經修復這個BUG了。 Allegro封裝生成器0.04生成do-27封裝不正確,生成封裝的焊盤的位號為a,c.應該是A,B或者1,2才對. 呵呵，DIODE通常管腳名為AC(A = anode, C = cathode) 也有用AK 或 12的， 極少見AB。 除了DIODE和極個別插件以及BGA外，焊盤名字以數字為主, 下次我給DIODE一個選擇項，可以選擇AC 或 12 或 AK, 至于TRANSISTER我就不去區分BCE/CBE/ECB/EBC/GDS/GSD/DSG/DGS/SGD/SDG等了，這樣會沒完沒了的，我將對TRANSISTER強制統一以數字編號了，如果用家非要改變，只得在生成庫后手工修改。
標簽： Footprint Maker 0.08 FPM skill
上傳時間： 2018-01-10
上傳用戶：digitzing
DESCRIPTION The Texas Instruments MSP430 family of ultra-low-power microcontrollers consists of several devices featuring different sets of peripherals targeted for various applications. The architecture, combined with five low-power modes, is optimized to achieve extended battery life in portable measurement applications. The device features a powerful 16-bit RISC CPU, 16-bit registers, and constant generators that contribute to maximum code efficiency. The digitally controlled oscillator (DCO) allows wake-up from low-power modes to active mode in less than 1 μs. The MSP430G2x13 and MSP430G2x53 series are ultra-low-power mixed signal microcontrollers with built-in 16- bit timers, up to 24 I/O capacitive-touch enabled pins, a versatile analog comparator, and built-in communication capability using the universal serial communication interface. In addition the MSP430G2x53 family members have a 10-bit analog-to-digital (A/D) converter. For configuration details see Table 1. Typical applications include low-cost sensor systems that capture analog signals, convert them to digital values, and then process the data for display or for transmission to a host system.
上傳時間： 2018-12-25
上傳用戶：ygyh
The SP2526A device is a dual +3.0V to +5.5V USB Supervisory Power Control Switch ideal for self-powered and bus-powered Universal Serial Bus (USB) applications. Each switch has low on-resistance (110mΩ typical) and can supply 500mA minimum. The fault currents are limited to 1.0A typical and the flag output pin for each switch is available to indicate fault conditions to the USB controller. The thermal shutdown feature will prevent damage to the device when subjected to excessive current loads. The undervoltage lockout feature will ensure that the device will remain off unless there is a valid input voltage present.
標簽： High-Side Switch Power Dual USB
上傳時間： 2019-03-06
上傳用戶：bhitr
AEC-Q100 qualified ? 12 V and 24 V battery systems compliance ? 3.3 V and 5 V logic compatible I/O ? 8-channel configurable MOSFET pre-driver – High-side (N-channel and P-channel MOS) – Low-side (N-channel MOS) – H-bridge (up to 2 H-bridge) – Peak & Hold (2 loads) ? Operating battery supply voltage 3.8 V to 36 V ? Operating VDD supply voltage 4.5 V to 5.5 V ? All device pins, except the ground pins, withstand at least 40 V ? Programmable gate charge/discharge currents for improving EMI behavior
標簽： configurable Automotive pre-driver suitable channel systems MOSFET fully High side
上傳時間： 2019-03-27
上傳用戶：guaixiaolong
Duringthe past years, there has been a quickly rising interest in radio access technologies for providing mobile as well as nomadic and fixed services for voice, video, and data. This proves that the difference in design, implementation, and use between telecom and datacom technologies is also becoming more blurred. What used to be a mobile phone used for voice communication is today increasingly becoming the main data communication device for end-users, providing web browsing, social networking, and many other services.
標簽： LTELTE-Advanced 4G
上傳時間： 2020-05-26
上傳用戶：shancjb
The continued reduction of integrated circuit feature sizes and commensurate improvements in device performance are fueling the progress to higher functionality and new application areas. For example, over the last 15 years, the performance of microprocessors has increased 1000 times. Analog circuit performance has also improved, albeit at a slower pace. For example, over the same period the speed/resolution figure-of-merit of analog-to-digital converters improved by only a factor 10.
標簽： Digitally Assisted Pipeline ADCs
上傳時間： 2020-05-27
上傳用戶：shancjb
Currently, the information and communications technology (ICT) industry sector accounts for about 2–6% of the energy consumption worldwide, and a significant por- tion of this is contributed by the wireless and mobile communications industry. With the proliferation of wireless data applications, wireless technology continues to increase worldwide at an unprecedented growth rate. This has resulted in an increased number of installed base stations and higher demand on power grids and device power usage, causing an increased carbon footprint worldwide.
標簽： Communication Networks Green Radio
上傳時間： 2020-05-27
上傳用戶：shancjb
With the rapid growth in the number of wireless applications, services and devices, using a single wireless technology such as a second generation (2G) and third gener- ation (3G) wireless system would not be efficient to deliver high speed data rate and quality-of-service (QoS) support to mobile users in a seamless way. The next genera- tion wireless systems (also sometimes referred to as Fourth generation (4G) systems) are being devised with the vision of heterogeneity in which a mobile user/device will be able to connect to multiple wireless networks (e.g., WLAN, cellular, WMAN) simultaneously.
標簽： Heterogeneous Wireless Networks Access
上傳時間： 2020-05-27
上傳用戶：shancjb
