Allegro后仿真流程介紹
上傳時間: 2013-11-19
上傳用戶:kxyw404582151
allegro_PCB_SI仿真
標簽: allegro_PCB_SI 仿真
上傳時間: 2013-10-19
上傳用戶:墻角有棵樹
《Protel99SE電路設計與仿真》,軟件實用資料
上傳時間: 2015-01-02
上傳用戶:stst
通過運用FFT IP Core計算收發序列間的互相關函數,可以實現快速捕獲。仿真結果表明,該方法具有速度快、誤差小、設計靈活、效率高的特點。
上傳時間: 2013-10-16
上傳用戶:stst
通過介紹Multisim軟件的功能和特點,結合格雷瑪計數器的設計實例,敘述了在Multisim軟件平臺進行時序邏輯電路的設計原理及構成方法,并利用軟件對設計進行仿真。
上傳時間: 2014-01-05
上傳用戶:sunchao524
討論了高速PCB 設計中涉及的定時、反射、串擾、振鈴等信號完整性( SI)問題,結合CA2DENCE公司提供的高速PCB設計工具Specctraquest和Sigxp,對一采樣率為125MHz的AD /DAC印制板進行了仿真和分析,根據布線前和布線后的仿真結果設置適當的約束條件來控制高速PCB的布局布線,從各個環節上保證高速電路的信號完整性。
上傳時間: 2013-12-26
上傳用戶:niumeng16
Protel DXP 是第一個將所有設計工具集于一身的板級設計系統,電子設計者從最初的項目模塊規劃到最終形成生產數據都可以按照自己的設計方式實現。Protel DXP 運行在優化的設計瀏覽器平臺上,并且具備當今所有先進的設計特點,能夠處理各種復雜的 PCB設計過程。Protel DXP 作為一款新推出的電路設計軟件,在前版本的基礎上增加了許多新的功能。新的可定制設計環境功能包括雙顯示器支持,可固定、浮動以及彈出面板,強大的過濾及增強的用戶界面等。通過設計輸入仿真、PCB 繪制編輯、拓撲自動布線、信號完整性分析和設計輸出等技術融合,Protel DXP 提供了全面的設計解決方案。 PCB電路板設計的一般原則包括: 電路板的選用、電路板尺寸、元件布局、布線、焊盤、
上傳時間: 2013-11-13
上傳用戶:新手無憂
為了在CDMA系統中更好地應用QDPSK數字調制方式,在分析四相相對移相(QDPSK)信號調制解調原理的基礎上,設計了一種QDPSK調制解調電路,它包括串并轉換、差分編碼、四相載波產生和選相、相干解調、差分譯碼和并串轉換電路。在MAX+PLUSⅡ軟件平臺上,進行了編譯和波形仿真。綜合后下載到復雜可編程邏輯器件EPM7128SLC84-15中,測試結果表明,調制電路能正確選相,解調電路輸出數據與QDPSK調制輸入數據完全一致,達到了預期的設計要求。 Abstract: In order to realize the better application of digital modulation mode QDPSK in the CDMA system, a sort of QDPSK modulation-demodulation circuit was designed based on the analysis of QDPSK signal modulation-demodulation principles. It included serial/parallel conversion circuit, differential encoding circuit, four-phase carrier wave produced and phase chosen circuit, coherent demodulation circuit, difference decoding circuit and parallel/serial conversion circuit. And it was compiled and simulated on the MAX+PLUSⅡ software platform,and downloaded into the CPLD of EPM7128SLC84-15.The test result shows that the modulation circuit can exactly choose the phase,and the output data of the demodulator circuit is the same as the input data of the QDPSK modulate. The circuit achieves the prospective requirement of the design.
上傳時間: 2013-10-28
上傳用戶:jyycc
現代數字信號處理從視頻擴展到了中頻甚至射頻,針對要求信號處理的處理速度越來越高、傳輸速率越來越快等特點,給出了一款使用高性能FPGA、DAC以及經先進的PCB設計工具設計、仿真的高速信號處理模塊,實現了對高速信號的實時接收和處理。關鍵詞:數字信號處理; 高速電路; FPGA;設計與仿真
上傳時間: 2013-10-09
上傳用戶:baiom
第一部分 信號完整性知識基礎.................................................................................5第一章 高速數字電路概述.....................................................................................51.1 何為高速電路...............................................................................................51.2 高速帶來的問題及設計流程剖析...............................................................61.3 相關的一些基本概念...................................................................................8第二章 傳輸線理論...............................................................................................122.1 分布式系統和集總電路.............................................................................122.2 傳輸線的RLCG 模型和電報方程...............................................................132.3 傳輸線的特征阻抗.....................................................................................142.3.1 特性阻抗的本質.................................................................................142.3.2 特征阻抗相關計算.............................................................................152.3.3 特性阻抗對信號完整性的影響.........................................................172.4 傳輸線電報方程及推導.............................................................................182.5 趨膚效應和集束效應.................................................................................232.6 信號的反射.................................................................................................252.6.1 反射機理和電報方程.........................................................................252.6.2 反射導致信號的失真問題.................................................................302.6.2.1 過沖和下沖.....................................................................................302.6.2.2 振蕩:.............................................................................................312.6.3 反射的抑制和匹配.............................................................................342.6.3.1 串行匹配.........................................................................................352.6.3.1 并行匹配.........................................................................................362.6.3.3 差分線的匹配.................................................................................392.6.3.4 多負載的匹配.................................................................................41第三章 串擾的分析...............................................................................................423.1 串擾的基本概念.........................................................................................423.2 前向串擾和后向串擾.................................................................................433.3 后向串擾的反射.........................................................................................463.4 后向串擾的飽和.........................................................................................463.5 共模和差模電流對串擾的影響.................................................................483.6 連接器的串擾問題.....................................................................................513.7 串擾的具體計算.........................................................................................543.8 避免串擾的措施.........................................................................................57第四章 EMI 抑制....................................................................................................604.1 EMI/EMC 的基本概念..................................................................................604.2 EMI 的產生..................................................................................................614.2.1 電壓瞬變.............................................................................................614.2.2 信號的回流.........................................................................................624.2.3 共模和差摸EMI ..................................................................................634.3 EMI 的控制..................................................................................................654.3.1 屏蔽.....................................................................................................654.3.1.1 電場屏蔽.........................................................................................654.3.1.2 磁場屏蔽.........................................................................................674.3.1.3 電磁場屏蔽.....................................................................................674.3.1.4 電磁屏蔽體和屏蔽效率.................................................................684.3.2 濾波.....................................................................................................714.3.2.1 去耦電容.........................................................................................714.3.2.3 磁性元件.........................................................................................734.3.3 接地.....................................................................................................744.4 PCB 設計中的EMI.......................................................................................754.4.1 傳輸線RLC 參數和EMI ........................................................................764.4.2 疊層設計抑制EMI ..............................................................................774.4.3 電容和接地過孔對回流的作用.........................................................784.4.4 布局和走線規則.................................................................................79第五章 電源完整性理論基礎...............................................................................825.1 電源噪聲的起因及危害.............................................................................825.2 電源阻抗設計.............................................................................................855.3 同步開關噪聲分析.....................................................................................875.3.1 芯片內部開關噪聲.............................................................................885.3.2 芯片外部開關噪聲.............................................................................895.3.3 等效電感衡量SSN ..............................................................................905.4 旁路電容的特性和應用.............................................................................925.4.1 電容的頻率特性.................................................................................935.4.3 電容的介質和封裝影響.....................................................................955.4.3 電容并聯特性及反諧振.....................................................................955.4.4 如何選擇電容.....................................................................................975.4.5 電容的擺放及Layout ........................................................................99第六章 系統時序.................................................................................................1006.1 普通時序系統...........................................................................................1006.1.1 時序參數的確定...............................................................................1016.1.2 時序約束條件...................................................................................1063.2 高速設計的問題.......................................................................................2093.3 SPECCTRAQuest SI Expert 的組件.......................................................2103.3.1 SPECCTRAQuest Model Integrity .................................................2103.3.2 SPECCTRAQuest Floorplanner/Editor .........................................2153.3.3 Constraint Manager .......................................................................2163.3.4 SigXplorer Expert Topology Development Environment .......2233.3.5 SigNoise 仿真子系統......................................................................2253.3.6 EMControl .........................................................................................2303.3.7 SPECCTRA Expert 自動布線器.......................................................2303.4 高速設計的大致流程...............................................................................2303.4.1 拓撲結構的探索...............................................................................2313.4.2 空間解決方案的探索.......................................................................2313.4.3 使用拓撲模板驅動設計...................................................................2313.4.4 時序驅動布局...................................................................................2323.4.5 以約束條件驅動設計.......................................................................2323.4.6 設計后分析.......................................................................................233第四章 SPECCTRAQUEST SIGNAL EXPLORER 的進階運用..........................................2344.1 SPECCTRAQuest Signal Explorer 的功能包括:................................2344.2 圖形化的拓撲結構探索...........................................................................2344.3 全面的信號完整性(Signal Integrity)分析.......................................2344.4 完全兼容 IBIS 模型...............................................................................2344.5 PCB 設計前和設計的拓撲結構提取.......................................................2354.6 仿真設置顧問...........................................................................................2354.7 改變設計的管理.......................................................................................2354.8 關鍵技術特點...........................................................................................2364.8.1 拓撲結構探索...................................................................................2364.8.2 SigWave 波形顯示器........................................................................2364.8.3 集成化的在線分析(Integration and In-process Analysis) .236第五章 部分特殊的運用...............................................................................2375.1 Script 指令的使用..................................................................................2375.2 差分信號的仿真.......................................................................................2435.3 眼圖模式的使用.......................................................................................249第四部分:HYPERLYNX 仿真工具使用指南............................................................251第一章 使用LINESIM 進行前仿真.......................................................................2511.1 用LineSim 進行仿真工作的基本方法...................................................2511.2 處理信號完整性原理圖的具體問題.......................................................2591.3 在LineSim 中如何對傳輸線進行設置...................................................2601.4 在LineSim 中模擬IC 元件.....................................................................2631.5 在LineSim 中進行串擾仿真...................................................................268第二章 使用BOARDSIM 進行后仿真......................................................................2732.1 用BOARDSIM 進行后仿真工作的基本方法...................................................2732.2 BoardSim 的進一步介紹..........................................................................2922.3 BoardSim 中的串擾仿真..........................................................................309
上傳時間: 2013-11-07
上傳用戶:aa7821634