This paper presents a space vector modulation(SVM)-based switching strategy for a three-level neutral point clamped (NPC) converter that is adapted as a STATCOM.
The LT®6552 is a specialized dual-differencing 75MHzoperational amplifier ideal for rejecting common modenoise as a video line receiver. The input pairs are designedto operate with equal but opposite large-signal differencesand provide exceptional high frequency commonmode rejection (CMRR of 65dB at 10MHz), therebyforming an extremely versatile gain block structure thatminimizes component count in most situations. The dualinput pairs are free to take on independent common modelevels, while the two voltage differentials are summedinternally to form a net input signal.
This unique guide to designing digital VLSI circuits takes a top-down approach, reflecting the natureof the design process in industry. Starting with architecture design, the book explains the why andhow of digital design, using the physics that designers need to know, and no more.Covering system and component aspects, design verification, VHDL modelling, clocking, signalintegrity, layout, electricaloverstress, field-programmable logic, economic issues, and more, thescope of the book is singularly comprehensive.
A fully differential amplifi er is often used to converta single-ended signal to a differential signal, a designwhich requires three signifi cant considerations: theimpedance of the single-ended source must match thesingle-ended impedance of the differential amplifi er,the amplifi er’s inputs must remain within the commonmode voltage limits and the input signal must be levelshifted to a signal that is centered at the desired outputcommon mode voltage.
The STM32F10xxx microcontroller family embeds up to three advanced 12-bit ADCs (depending on the device) with a conversion time down to 1 μs. A self-calibration feature is provided to enhance ADC accuracy versus environmental condition changes.
分析了調(diào)幅信號和載波信號之間的相位差與調(diào)制信號的極性的對應(yīng)關(guān)系,得出了相敏檢波電路輸出電壓的極性與調(diào)制信號的極性有對應(yīng)關(guān)系的結(jié)論。為了驗證相敏檢波電路的這一特性,給出3 個電路方案,分別選用理想元件和實際元件,采用Multisim 對其進行仿真實驗,直觀形象地演示了相敏檢波電路的鑒相特性,是傳統(tǒng)的實際操作實驗所不可比擬的。關(guān)鍵詞:相敏檢波;鑒相特性;Multisim;電路仿真
Abstract : The corresponding relation between modulation signal polarity and difference phases of amplitudemodulated signal and the carrier signal ,the polarity of phase2sensitive detecting circuit output voltage and the polarity of modulation signal are correspondent . In order to verify this characteristic ,three elect ric circuit s plans are produced ,idea element s and actual element s are selected respectively. Using Multisim to carry on a simulation experiment ,and then demonst rating the phase detecting characteristic of the phase sensitive circuit vividly and directly. Which is t raditional practical experience cannot be com pared.Keywords :phase sensitive detection ;phase2detecting characteristic ;Multisim;circuit simulation
Integrated EMI/Thermal Design forSwitching Power SuppliesWei ZhangThesis submitted to the Faculty of theVirginia Polytechnic Institute and State Universityin partial fulfillment of the requirements for the degree of
Integrated EMI/Thermal Design forSwitching Power SuppliesWei Zhang(ABSTRACT)This work presents the modeling and analysis of EMI and thermal performancefor switch power supply by using the CAD tools. The methodology and design guidelinesare developed.By using a boost PFC circuit as an example, an equivalent circuit model is builtfor EMI noise prediction and analysis. The parasitic elements of circuit layout andcomponents are extracted analytically or by using CAD tools. Based on the model, circuitlayout and magnetic component design are modified to minimize circuit EMI. EMI filtercan be designed at an early stage without prototype implementation.In the second part, thermal analyses are conducted for the circuit by using thesoftware Flotherm, which includes the mechanism of conduction, convection andradiation. Thermal models are built for the components. Thermal performance of thecircuit and the temperature profile of components are predicted. Improved thermalmanagement and winding arrangement are investigated to reduce temperature.In the third part, several circuit layouts and inductor design examples are checkedfrom both the EMI and thermal point of view. Insightful information is obtained.
