The LPC2292/2294 microcontrollers are based on a 16/32-bit ARM7TDMI-S CPU with real-time emulation and embedded trace support, together with 256 kB of embedded high-speed flash memory. A 128-bit wide memory interface and a unique accelerator architecture enable 32-bit code execution at the maximum clock rate. For critical code size applications, the alternative 16-bit Thumb mode reduces code by more than 30 pct with minimal performance penalty. With their 144-pin package, low power consumption, various 32-bit timers, 8-channel 10-bit ADC, 2/4 (LPC2294) advanced CAN channels, PWM channels and up to nine external interrupt pins these microcontrollers are particularly suitable for automotive and industrial control applications as well as medical systems and fault-tolerant maintenance buses. The number of available fast GPIOs ranges from 76 (with external memory) through 112 (single-chip). With a wide range of additional serial communications interfaces, they are also suited for communication gateways and protocol converters as well as many other general-purpose applications. Remark: Throughout the data sheet, the term LPC2292/2294 will apply to devices with and without the /00 or /01 suffix. The suffixes /00 and /01 will be used to differentiate from other devices only when necessary.
上傳時間： 2014-12-30
上傳用戶：aysyzxzm
Abstract: This application note helps system designers choose the correct external components for use with the MAX16948 dualremote antenna LDO/switch, thus ensuring that automobile-regulated phantom antenna supply and output-current-monitoring circuitrymeet performance objectives. An electronic calculator is provided that helps specify the critical external components for theMAX16948, thus reducing design time. The calculator also determines the device's analog output voltage, output current-limitthreshold, and output current-sensing accuracies. The calculator includes new automatic Step By Step feature that assists designerswith component choice. To use the new automatic feature, click on the Step By Step button relative to the desired section.
上傳時間： 2013-11-04
上傳用戶：lhll918
Single-Ended and Differential S-Parameters Differential circuits have been important incommunication systems for many years. In the past,differential communication circuits operated at lowfrequencies, where they could be designed andanalyzed using lumped-element models andtechniques. With the frequency of operationincreasing beyond 1GHz, and above 1Gbps fordigital communications, this lumped-elementapproach is no longer valid, because the physicalsize of the circuit approaches the size of awavelength.Distributed models and analysis techniques are nowused instead of lumped-element techniques.Scattering parameters, or S-parameters, have beendeveloped for this purpose [1]. These S-parametersare defined for single-ended networks. S-parameterscan be used to describe differential networks, but astrict definition was not developed until Bockelmanand others addressed this issue [2]. Bockelman’swork also included a study on how to adapt single-ended S-parameters for use with differential circuits[2]. This adaptation, called “mixed-mode S-parameters,” addresses differential and common-mode operation, as well as the conversion betweenthe two modes of operation.This application note will explain the use of single-ended and mixed-mode S-parameters, and the basicconcepts of microwave measurement calibration.
上傳時間： 2014-03-25
上傳用戶：yyyyyyyyyy
XRP7714是一款四輸出脈寬調制（PWM）分級降壓（step down）DC-DC控制器，并具有內置LDO提供待機電源。該器件在單個IC上為電池供電的產品提供了整套的電源管理方案，并且通過內含的I2C串行接口進行整體的編程配置
上傳時間： 2013-11-01
上傳用戶：xiaohuanhuan
《西門子系列PLC原理及應用》共有8章，第1章介紹了PLC的基本組成與工作原理；第2章介紹了西門子S7-200系列PLC的構成、性能及其工作方式；第3章詳細地介紹了S7-200系列PLC專用編程軟件STEP 7-Micro/WIN的主要功能與使用方法；第4～5章，結合實例介紹S7-200系列PLC的基本命令與功能命令；第6章講述了S7-200系列PLC的網絡通信知識與命令；第7章講述了PLC控制系統的總體設計方法，并由淺入深地介紹了8個控制系統設計實例；第8章介紹了西門子S7-200系列PLC的安裝與維護。
上傳時間： 2013-12-31
上傳用戶：stampede
MAXQUSBJTAGOW評估板軟件:關鍵特性 Easily Load and Debug Code Interface Provides In-Application Debugging Features Step-by-Step Execution Tracing Breakpointing by Code Address, Data Memory Address, or Register Access Data Memory View and Edit Supports Logic Levels from 1.1V to 3.6V Supports JTAG and 1-Wire Protocols Each Adapter Has Its Own Unique Serial ID, Allowing Multiple Adapters to be Connected Without COM Port Conflicts Has In-Field Upgradable Capability if Firmware Needs to be Upgraded Enclosure Protects from Shorts and ESD
標簽： MAXQUSBJTAGOW 評估板 軟件
上傳時間： 2013-10-24
上傳用戶：teddysha
MAXQUSBJTAGOW評估板軟件:關鍵特性 Easily Load and Debug Code Interface Provides In-Application Debugging Features Step-by-Step Execution Tracing Breakpointing by Code Address, Data Memory Address, or Register Access Data Memory View and Edit Supports Logic Levels from 1.1V to 3.6V Supports JTAG and 1-Wire Protocols Each Adapter Has Its Own Unique Serial ID, Allowing Multiple Adapters to be Connected Without COM Port Conflicts Has In-Field Upgradable Capability if Firmware Needs to be Upgraded Enclosure Protects from Shorts and ESD
標簽： MAXQUSBJTAGOW 評估板 軟件
上傳時間： 2013-11-23
上傳用戶：truth12
Abstract: Using a wafer-level package (WLP) can reduce the overall size and cost of your solution.However when using a WLP IC, the printed circuit board (PCB) layout can become more complex and, ifnot carefully planned, result in an unreliable design. This article presents some PCB designconsiderations and general recommendations for choosing a 0.4mm- or 0.5mm-pitch WLP for yourapplication.
標簽： Considerations Guidelines and Design
上傳時間： 2013-11-09
上傳用戶：ls530720646
附件為：pdf轉cad軟件最新版 PDF Fly V7.1安裝文件。還附有自制的Crack，把我的文件 貼到裝好的目錄下就行了!沒有30天限制。 附pdf轉cad軟件使用教程： 1、pdf轉cad軟件的界面比較簡單的，如下圖，點擊ADD添加你要轉換的PDF文件，然后下一步 2、選擇DXF格式，然后在右邊的option里面還可以進行相關的設置 3、然后再下一步。step 3頁面只要點最下面的 convert 就可以了 轉完以后同樣線條沒有什么大問題的，只是文字肯定是被打碎的，你自己需要刪除后重新輸入要重新輸入。
上傳時間： 2013-10-22
上傳用戶：ardager
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
上傳時間： 2013-11-21
上傳用戶：不懂夜的黑
