This publication represents the largest LTC commitmentto an application note to date. No other application noteabsorbed as much effort, took so long or cost so much.This level of activity is justified by our belief that high speedmonolithic amplifiers greatly interest users.
標(biāo)簽： 高速放大器
上傳時(shí)間： 2014-01-07
上傳用戶(hù)：wfl_yy
The MAX2691 low-noise amplifier (LNA) is designed forGPS L2 applications. Designed in Maxim’s advancedSiGe process, the device achieves high gain andlow noise figure while maximizing the input-referred 1dBcompression point and the 3rd-order intercept point. TheMAX2691 provides a high gain of 17.5dB and sub 1dBnoise figure.
標(biāo)簽： Amplifier Low-Noise 2691 Band
上傳時(shí)間： 2014-12-04
上傳用戶(hù)：zaocan888
This application note describes a Linear Technology "Half-Flash" A/D converter, the LTC1099, being connected to a 256 element line scan photodiode array. This technology adapts itself to handheld (i.e., low power) bar code readers, as well as high resolution automated machine inspection applications..
標(biāo)簽： 1099 LTC 8位 AD轉(zhuǎn)換
上傳時(shí)間： 2013-11-21
上傳用戶(hù)：lchjng
•Founded in Jan. 08, 2001 in Shanghai, China.•Fabless IDH focused on Analog & Mixed Signal Chip design & marketing •Over 100 IC introduced.•Over 200 OEM Customer worldwide•ISO-9000 Certified•Distribution Channel in Taiwan, China & Japan To achieve 100% customer satisfactionby producing the technically advanced product with the best quality, on-time delivery and service. Leverages on proprietary process and world-class engineering team to develop innovative & high quality analog solutions that add value to electronics equipment.
標(biāo)簽： Circuit Analog Design Porta
上傳時(shí)間： 2013-10-24
上傳用戶(hù)：songnanhua
前面討論了很多內(nèi)容，基本上涉及了有關(guān)PCB板的絕大部分相關(guān)的知識(shí)。第二章探討了傳輸線(xiàn)的基本原理，第三章探討了串?dāng)_，在第四章里我們闡述了許多在現(xiàn)代設(shè)計(jì)中必須關(guān)注的非理想互連的問(wèn)題。對(duì)于信號(hào)從驅(qū)動(dòng)端引腳到接收端引腳的電氣路徑的相關(guān)問(wèn)題，我們已經(jīng)做了一些探究，然而對(duì)于硅芯片，即處于封裝內(nèi)部的IC來(lái)說(shuō)，其信號(hào)傳輸通常要通過(guò)過(guò)孔和連接器來(lái)進(jìn)行，對(duì)這樣的情況我們?cè)撊绾翁幚恚吭诒菊轮校覀儗⑼ㄟ^(guò)對(duì)封裝、過(guò)孔和連接器的研究，闡述其原理，從而指導(dǎo)大家在設(shè)計(jì)的時(shí)候?qū)φ麄€(gè)電氣路徑進(jìn)行完整地分析，即從驅(qū)動(dòng)端內(nèi)部IC芯片的焊盤(pán)到接受器IC芯片的焊盤(pán)。
標(biāo)簽： High-Speed Digital System desi
上傳時(shí)間： 2013-11-24
上傳用戶(hù)：maizezhen
高速數(shù)字系統(tǒng)設(shè)計(jì)下載pdf:High-Speed Digital SystemDesign—A Handbook ofInterconnect Theory and DesignPracticesStephen H. HallGarrett W. HallJames A. McCallA Wiley-Interscience Publication JOHN WILEY & SONS, INC.New York • Chichester • Weinheim • Brisbane • Singapore • TorontoCopyright © 2000 by John Wiley & Sons, Inc.speeddigital systems at the platform level. The book walks the reader through everyrequired concept, from basic transmission line theory to digital timing analysis, high-speedmeasurement techniques, as well as many other topics. In doing so, a unique balancebetween theory and practical applications is achieved that will allow the reader not only tounderstand the nature of the problem, but also provide practical guidance to the solution.The level of theoretical understanding is such that the reader will be equipped to see beyondthe immediate practical application and solve problems not contained within these pages.Much of the information in this book has not been needed in past digital designs but isabsolutely necessary today. Most of the information covered here is not covered in standardcollege curricula, at least not in its focus on digital design, which is arguably one of the mostsignificant industries in electrical engineering.The focus of this book is on the design of robust high-volume, high-speed digital productssuch as computer systems, with particular attention paid to computer busses. However, thetheory presented is applicable to any high-speed digital system. All of the techniquescovered in this book have been applied in industry to actual digital products that have beensuccessfully produced and sold in high volume.Practicing engineers and graduate and undergraduate students who have completed basicelectromagnetic or microwave design classes are equipped to fully comprehend the theorypresented in this book. At a practical level, however, basic circuit theory is all thebackground required to apply the formulas in this book.
標(biāo)簽： 高速數(shù)字 系統(tǒng)設(shè)計(jì)
上傳時(shí)間： 2013-10-26
上傳用戶(hù)：縹緲
OPTOELECTRONICS CIRCUIT COLLECTION AVALANCHE PHOTODIODE BIAS SUPPLY 1Provides an output voltage of 0V to +80V for reverse biasingan avalanche photodiode to control its gain. This circuit canalso be reconfigured to supply a 0V to –80V output.LINEAR TEC DRIVER–1This is a bridge-tied load (BTL) linear amplifier for drivinga thermoelectric cooler (TEC). It operates on a single +5Vsupply and can drive ±2A into a common TEC.LINEAR TEC DRIVER–2This is very similar to DRIVER–1 but its power output stagewas modified to operate from a single +3.3V supply in orderto increase its efficiency. Driving this amplifier from astandard +2.5V referenced signal causes the output transistorsto have unequal power dissipation.LINEAR TEC DRIVER–3This BTL TEC driver power output stage achieves very highefficiency by swinging very close to its supply rails, ±2.5V.This driver can also drive ±2A into a common TEC. Operationis shown with the power output stage operating on±1.5V supplies. Under these conditions, this linear amplifiercan achieve very high efficiency. Application ReportThe following collection of analog circuits may be useful in electro-optics applications such as optical networkingsystems. This page summarizes their salient characteristics.
標(biāo)簽： 光電轉(zhuǎn)換 電路設(shè)計(jì)
上傳時(shí)間： 2013-10-27
上傳用戶(hù)：落花無(wú)痕
Radio Frequency Integrated Circuit Design I enjoyed reading this book for a number of reasons. One reason is that itaddresses high-speed analog design in the context of microwave issues. This isan advanced-level book, which should follow courses in basic circuits andtransmission lines. Most analog integrated circuit designers in the past workedon applications at low enough frequency that microwave issues did not arise.As a consequence, they were adept at lumped parameter circuits and often notcomfortable with circuits where waves travel in space. However, in order todesign radio frequency (RF) communications integrated circuits (IC) in thegigahertz range, one must deal with transmission lines at chip interfaces andwhere interconnections on chip are far apart. Also, impedance matching isaddressed, which is a topic that arises most often in microwave circuits. In mycareer, there has been a gap in comprehension between analog low-frequencydesigners and microwave designers. Often, similar issues were dealt with in twodifferent languages. Although this book is more firmly based in lumped-elementanalog circuit design, it is nice to see that microwave knowledge is brought inwhere necessary.Too many analog circuit books in the past have concentrated first on thecircuit side rather than on basic theory behind their application in communications.The circuits usually used have evolved through experience, without asatisfying intellectual theme in describing them. Why a given circuit works bestcan be subtle, and often these circuits are chosen only through experience. Forthis reason, I am happy that the book begins first with topics that require anintellectual approach—noise, linearity and filtering, and technology issues. Iam particularly happy with how linearity is introduced (power series). In therest of the book it is then shown, with specific circuits and numerical examples,how linearity and noise issues arise.
標(biāo)簽： Rogers Radio John Freq
上傳時(shí)間： 2014-12-23
上傳用戶(hù)：han_zh
介紹高速電路的設(shè)計(jì)
標(biāo)簽： High-speed Digital Design 高速數(shù)字
上傳時(shí)間： 2013-10-16
上傳用戶(hù)：yt1993410
【摘要】本文結(jié)合作者多年的印制板設(shè)計(jì)經(jīng)驗(yàn)，著重印制板的電氣性能，從印制板穩(wěn)定性、可靠性方面，來(lái)討論多層印制板設(shè)計(jì)的基本要求。【關(guān)鍵詞】印制電路板；表面貼裝器件；高密度互連；通孔【Key words】Printed Circuit Board；Surface Mounting Device；High Density Interface；Via一．概述印制板（PCB－Printed Circuit Board）也叫印制電路板、印刷電路板。多層印制板，就是指兩層以上的印制板，它是由幾層絕緣基板上的連接導(dǎo)線(xiàn)和裝配焊接電子元件用的焊盤(pán)組成，既具有導(dǎo)通各層線(xiàn)路，又具有相互間絕緣的作用。隨著SMT（表面安裝技術(shù)）的不斷發(fā)展，以及新一代SMD（表面安裝器件）的不斷推出，如QFP、QFN、CSP、BGA（特別是MBGA），使電子產(chǎn)品更加智能化、小型化，因而推動(dòng)了PCB工業(yè)技術(shù)的重大改革和進(jìn)步。自1991年IBM公司首先成功開(kāi)發(fā)出高密度多層板（SLC）以來(lái)，各國(guó)各大集團(tuán)也相繼開(kāi)發(fā)出各種各樣的高密度互連（HDI）微孔板。這些加工技術(shù)的迅猛發(fā)展，促使了PCB的設(shè)計(jì)已逐漸向多層、高密度布線(xiàn)的方向發(fā)展。多層印制板以其設(shè)計(jì)靈活、穩(wěn)定可靠的電氣性能和優(yōu)越的經(jīng)濟(jì)性能，現(xiàn)已廣泛應(yīng)用于電子產(chǎn)品的生產(chǎn)制造中。下面，作者以多年設(shè)計(jì)印制板的經(jīng)驗(yàn)，著重印制板的電氣性能，結(jié)合工藝要求，從印制板穩(wěn)定性、可靠性方面，來(lái)談?wù)劧鄬又瓢逶O(shè)計(jì)的基本要領(lǐng)。
上傳時(shí)間： 2013-11-19
上傳用戶(hù)：zczc
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