This errata sheet describes both the known functional problems and anydeviations from the electrical specifications known at the release date ofthis document.Each deviation is assigned a number and its history is tracked in a table atthe end of the document.
The LPC4350/30/20/10 are ARM Cortex-M4 based microcontrollers for embeddedapplications. The ARM Cortex-M4 is a next generation core that offers systemenhancements such as low power consumption, enhanced debug features, and a highlevel of support block integration.The LPC4350/30/20/10 operate at CPU frequencies of up to 150 MHz. The ARMCortex-M4 CPU incorporates a 3-stage pipeline, uses a Harvard architecture withseparate local instruction and data buses as well as a third bus for peripherals, andincludes an internal prefetch unit that supports speculative branching. The ARMCortex-M4 supports single-cycle digital signal processing and SIMD instructions. Ahardware floating-point processor is integrated in the core.The LPC4350/30/20/10 include an ARM Cortex-M0 coprocessor, up to 264 kB of datamemory, advanced configurable peripherals such as the State Configurable Timer (SCT)and the Serial General Purpose I/O (SGPIO) interface, two High-speed USB controllers,Ethernet, LCD, an external memory controller, and multiple digital and analog peripherals
This errata sheet describes both the known functional problems and anydeviations from the electrical specifications known at the release date ofthis document.Each deviation is assigned a number and its history is tracked in a table atthe end of the document.
The NXP LPC315x combine an 180 MHz ARM926EJ-S CPU core, High-speed USB 2.0OTG, 192 KB SRAM, NAND flash controller, flexible external bus interface, an integratedaudio codec, Li-ion charger, Real-Time Clock (RTC), and a myriad of serial and parallelinterfaces in a single chip targeted at consumer, industrial, medical, and communicationmarkets. To optimize system power consumption, the LPC315x have multiple powerdomains and a very flexible Clock Generation Unit (CGU) that provides dynamic clockgating and scaling.The LPC315x is implemented as multi-chip module with two side-by-side dies, one fordigital fuctions and one for analog functions, which include a Power Supply Unit (PSU),audio codec, RTC, and Li-ion battery charger.
The super-junction structure, which has P-type pillar layers as shown left,
realizes high withstand voltage and ON-resistance lower than the conventional
theoretical limit of silicon.
資料說明介紹
PCB Translator_CAMCAD轉(zhuǎn)換器3.95版本,里面含CAMCAD_3.9.5a_crack文件,可以對軟件進(jìn)行破解 (需要安裝PCB Translator后才能進(jìn)行破解)
針對PCB設(shè)計(jì)文件的RSI轉(zhuǎn)換器能夠轉(zhuǎn)換PCB設(shè)計(jì)和生產(chǎn)所需要的所有信息。它們包括:庫,布置位置,插入屬性信息,網(wǎng)表,走線,文字和銅箔,以及其它相關(guān)的項(xiàng)目。不需要執(zhí)行"導(dǎo)入Gerber"和"交叉參考"就可以完成所有這些工作。事實(shí)上,根本不需要定義參考,因?yàn)檐浖梢詮脑嘉募袷街刑崛〕鯟AD數(shù)據(jù),并把它直接輸出到新的文件格式中。只需要注意CAD系統(tǒng)本身的限制就可以了。
CAMCAD PCB 轉(zhuǎn)換器
CAMCAD PCB 轉(zhuǎn)換器是一個(gè)功能完善的PCB CAD 轉(zhuǎn)換器,圖形用戶界面也很淺顯易懂。CAMCAD PCB 轉(zhuǎn)換器支持大多數(shù)流行的CAD格式,比如Cadence Allegro, Orcad, Mentor and Accel EDA,也支持工業(yè)標(biāo)準(zhǔn)格式,比如GenCAM, GenCAD, and IPC-D-356.CAMCAD PCB 轉(zhuǎn)換器允許導(dǎo)入CAD文件到CAMCAD圖形用戶環(huán)境中,校驗(yàn)數(shù)據(jù),修改數(shù)據(jù),然后可以把數(shù)據(jù)導(dǎo)出為任意格式的文件。這些特性意味著用戶可以完全控制所有的事情,比如層的轉(zhuǎn)換,也能解決CAD格式之間不兼容的問題。
一個(gè)案例,如果要轉(zhuǎn)換Cadence Allegro文件到PADS,所有必須的設(shè)計(jì)信息都會(huì)包含在新的文件中。不過,Cadence Allegro允許板子上的銅箔重疊,PADS卻不允許。Allegro 文件可以正常導(dǎo)入到CAMCAD。如果要立即把這個(gè)文件導(dǎo)出到PADS,程序會(huì)有錯(cuò)誤提示。這時(shí),可以使用CAMCAD的數(shù)據(jù)處理特性來改變有問題的銅箔,解決問題后再導(dǎo)出到PADS。
下面的矩陣表格,列出了CAMCAD PCB 轉(zhuǎn)換器所支持的當(dāng)前PCB的轉(zhuǎn)換組合。Import Modules 一列中列出了可以被導(dǎo)入(讀取)的所有ECAD文件格式。Export Modules一行中列出了可以被導(dǎo)出(寫)的文件格式。在這個(gè)矩陣中的任意輸入和輸出模塊組合轉(zhuǎn)換都是可行的。當(dāng)然,沒有任何ECAD到ECAD的轉(zhuǎn)換器是絕對完美的。由于ECAD layout系統(tǒng)有自己獨(dú)特的特性,而這些可能不能直接轉(zhuǎn)換到另一個(gè)有自己獨(dú)特特性的ECAD系統(tǒng)中。
CAMCAD PCB 轉(zhuǎn)換器支持的組合
建議配置:Windows 2000 或者 XP Professional,800 MHZ 處理器,512MB RAM 17"顯示器,1024×768分辨率
Copyright 2004 Router Solutions Incorporated
RSI Reserves the right to make changes to its specifications and products without prior notice.
CAMCAD is a registered trademark of Router Solutions Incorporated. All rights reserved.
RSI recognizes other brand and product names as trademarks or registered trademarks of their respective holders.
資料說明介紹
PCB Translator_CAMCAD轉(zhuǎn)換器3.95版本,里面含CAMCAD_3.9.5a_crack文件,可以對軟件進(jìn)行破解 (需要安裝PCB Translator后才能進(jìn)行破解)
針對PCB設(shè)計(jì)文件的RSI轉(zhuǎn)換器能夠轉(zhuǎn)換PCB設(shè)計(jì)和生產(chǎn)所需要的所有信息。它們包括:庫,布置位置,插入屬性信息,網(wǎng)表,走線,文字和銅箔,以及其它相關(guān)的項(xiàng)目。不需要執(zhí)行"導(dǎo)入Gerber"和"交叉參考"就可以完成所有這些工作。事實(shí)上,根本不需要定義參考,因?yàn)檐浖梢詮脑嘉募袷街刑崛〕鯟AD數(shù)據(jù),并把它直接輸出到新的文件格式中。只需要注意CAD系統(tǒng)本身的限制就可以了。
CAMCAD PCB 轉(zhuǎn)換器
CAMCAD PCB 轉(zhuǎn)換器是一個(gè)功能完善的PCB CAD 轉(zhuǎn)換器,圖形用戶界面也很淺顯易懂。CAMCAD PCB 轉(zhuǎn)換器支持大多數(shù)流行的CAD格式,比如Cadence Allegro, Orcad, Mentor and Accel EDA,也支持工業(yè)標(biāo)準(zhǔn)格式,比如GenCAM, GenCAD, and IPC-D-356.CAMCAD PCB 轉(zhuǎn)換器允許導(dǎo)入CAD文件到CAMCAD圖形用戶環(huán)境中,校驗(yàn)數(shù)據(jù),修改數(shù)據(jù),然后可以把數(shù)據(jù)導(dǎo)出為任意格式的文件。這些特性意味著用戶可以完全控制所有的事情,比如層的轉(zhuǎn)換,也能解決CAD格式之間不兼容的問題。
一個(gè)案例,如果要轉(zhuǎn)換Cadence Allegro文件到PADS,所有必須的設(shè)計(jì)信息都會(huì)包含在新的文件中。不過,Cadence Allegro允許板子上的銅箔重疊,PADS卻不允許。Allegro 文件可以正常導(dǎo)入到CAMCAD。如果要立即把這個(gè)文件導(dǎo)出到PADS,程序會(huì)有錯(cuò)誤提示。這時(shí),可以使用CAMCAD的數(shù)據(jù)處理特性來改變有問題的銅箔,解決問題后再導(dǎo)出到PADS。
下面的矩陣表格,列出了CAMCAD PCB 轉(zhuǎn)換器所支持的當(dāng)前PCB的轉(zhuǎn)換組合。Import Modules 一列中列出了可以被導(dǎo)入(讀取)的所有ECAD文件格式。Export Modules一行中列出了可以被導(dǎo)出(寫)的文件格式。在這個(gè)矩陣中的任意輸入和輸出模塊組合轉(zhuǎn)換都是可行的。當(dāng)然,沒有任何ECAD到ECAD的轉(zhuǎn)換器是絕對完美的。由于ECAD layout系統(tǒng)有自己獨(dú)特的特性,而這些可能不能直接轉(zhuǎn)換到另一個(gè)有自己獨(dú)特特性的ECAD系統(tǒng)中。
CAMCAD PCB 轉(zhuǎn)換器支持的組合
建議配置:Windows 2000 或者 XP Professional,800 MHZ 處理器,512MB RAM 17"顯示器,1024×768分辨率
Copyright 2004 Router Solutions Incorporated
RSI Reserves the right to make changes to its specifications and products without prior notice.
CAMCAD is a registered trademark of Router Solutions Incorporated. All rights reserved.
RSI recognizes other brand and product names as trademarks or registered trademarks of their respective holders.
中文版詳情瀏覽:http://www.elecfans.com/emb/fpga/20130715324029.html
Xilinx UltraScale:The Next-Generation Architecture for Your Next-Generation Architecture
The Xilinx® UltraScale™ architecture delivers unprecedented levels of integration and capability with ASIC-class system- level performance for the most demanding applications.
The UltraScale architecture is the industr y's f irst application of leading-edge ASIC architectural enhancements in an All Programmable architecture that scales from 20 nm planar through 16 nm FinFET technologies and beyond, in addition to scaling from monolithic through 3D ICs. Through analytical co-optimization with the X ilinx V ivado® Design Suite, the UltraScale architecture provides massive routing capacity while intelligently resolving typical bottlenecks in ways never before possible. This design synergy achieves greater than 90% utilization with no performance degradation.
Some of the UltraScale architecture breakthroughs include:
• Strategic placement (virtually anywhere on the die) of ASIC-like system clocks, reducing clock skew by up to 50%
• Latency-producing pipelining is virtually unnecessary in systems with massively parallel bus architecture, increasing system speed and capability
• Potential timing-closure problems and interconnect bottlenecks are eliminated, even in systems requiring 90% or more resource utilization
• 3D IC integration makes it possible to build larger devices one process generation ahead of the current industr y standard
• Greatly increased system performance, including multi-gigabit serial transceivers, I/O, and memor y bandwidth is available within even smaller system power budgets
• Greatly enhanced DSP and packet handling
The Xilinx UltraScale architecture opens up whole new dimensions for designers of ultra-high-capacity solutions.