This product has been manufactured to your company’s specifications a part for use in your
company’s general electronic products. It is guaranteed to perform according to delivery
specifications. For any other use apart from general electronic equipment, we cannot take
responsibility if the product is used in medical devices, nuclear power control equipment,
aerospace equipment, fire and security systems, or any other applications in which there is a
direct risk to human life and where extremely high levels of reliability are required. If the
product is to be used in any of the above applications, we will need to enter into a separate
product liability agreement.
This document provides practical, common guidelines for incorporating PCI Express interconnect
layouts onto Printed Circuit Boards (PCB) ranging from 4-layer desktop baseboard designs to 10-
layer or more server baseboard designs. Guidelines and constraints in this document are intended
for use on both baseboard and add-in card PCB designs. This includes interconnects between PCI
Express devices located on the same baseboard (chip-to-chip routing) and interconnects between
a PCI Express device located “down” on the baseboard and a device located “up” on an add-in
card attached through a connector.
This document is intended to cover all major components of the physical interconnect including
design guidelines for the PCB traces, vias and AC coupling capacitors, as well as add-in card
edge-finger and connector considerations. The intent of the guidelines and examples is to help
ensure that good high-speed signal design practices are used and that the timing/jitter and
loss/attenuation budgets can also be met from end-to-end across the PCI Express interconnect.
However, while general physical guidelines and suggestions are given, they may not necessarily
guarantee adequate performance of the interconnect for all layouts and implementations.
Therefore, designers should consider modeling and simulation of the interconnect in order to
ensure compliance to all applicable specifications.
The document is composed of two main sections. The first section provides an overview of
general topology and interconnect guidelines. The second section concentrates on physical layout
constraints where bulleted items at the beginning of a topic highlight important constraints, while
the narrative that follows offers additional insight.
Abstract: Electrolytic capacitors are notorious for short lifetimes in high-temperature applications such asLED light bulbs. The careful selection of these devices with proper interpretation of their specifications isessential to ensure that they do not compromise the life of the end product. This application notediscusses this problem with electrolytic capacitors in LED light bulbs and provides an analysis that showshow it is possible to use electrolytics in such products.
The TJA1042 is a high-speed CAN transceiver that provides an interface between aController Area Network (CAN) protocol controller and the physical two-wire CAN bus.The transceiver is designed for high-speed (up to 1 Mbit/s) CAN applications in theautomotive industry, providing the differential transmit and receive capability to (amicrocontroller with) a CAN protocol controller.
The TJA1051 is a high-speed CAN transceiver that provides an interface between aController Area Network (CAN) protocol controller and the physical two-wire CAN bus.The transceiver is designed for high-speed (up to 1 Mbit/s) CAN applications in theautomotive industry, providing differential transmit and receive capability to (amicrocontroller with) a CAN protocol controller.