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pitch

  • pitch=Correlogrampitch(correlogram, width [, sr, lowpitch, highpitch]) computes the pitch of a cor

    pitch=Correlogrampitch(correlogram, width [, sr, lowpitch, highpitch]) computes the pitch of a correlogram sequence by finding the time lag with the largest correlation energy.

    標(biāo)簽: pitch Correlogrampitch correlogram highpitch

    上傳時間: 2015-08-11

    上傳用戶:youth25

  • helicopter fuzzy pid control including pitch and yaw

    helicopter fuzzy pid control including pitch and yaw

    標(biāo)簽: helicopter including control fuzzy

    上傳時間: 2014-01-17

    上傳用戶:gxmm

  • Helicopter PID control including pitch and yaw

    Helicopter PID control including pitch and yaw

    標(biāo)簽: Helicopter including control pitch

    上傳時間: 2015-11-18

    上傳用戶:qiao8960

  • 該程序是日本人用matlab寫出來的提取pitch

    該程序是日本人用matlab寫出來的提取pitch的,效果很好,唯一的缺點是算的太慢

    標(biāo)簽: matlab pitch 程序 日本

    上傳時間: 2013-12-08

    上傳用戶:大融融rr

  • cepstral analisys for pitch and F0 detection

    cepstral analisys for pitch and F0 detection

    標(biāo)簽: detection cepstral analisys pitch

    上傳時間: 2017-03-08

    上傳用戶:ardager

  • The is used for pitch calculation

    The is used for pitch calculation

    標(biāo)簽: calculation pitch used The

    上傳時間: 2013-12-14

    上傳用戶:lo25643

  • PCB Design Considerations and Guidelines for 0.4mm and 0.5mm WLPs

    Abstract: Using a wafer-level package (WLP) can reduce the overall size and cost of your solution.However when using a WLP IC, the printed circuit board (PCB) layout can become more complex and, ifnot carefully planned, result in an unreliable design. This article presents some PCB designconsiderations and general recommendations for choosing a 0.4mm- or 0.5mm-pitch WLP for yourapplication.

    標(biāo)簽: Considerations Guidelines and Design

    上傳時間: 2013-10-14

    上傳用戶:ysystc699

  • 《器件封裝用戶向?qū)А焚愳`思產(chǎn)品封裝資料

    Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.

    標(biāo)簽: 封裝 器件 用戶 賽靈思

    上傳時間: 2013-10-22

    上傳用戶:ztj182002

  • PCB Design Considerations and Guidelines for 0.4mm and 0.5mm WLPs

    Abstract: Using a wafer-level package (WLP) can reduce the overall size and cost of your solution.However when using a WLP IC, the printed circuit board (PCB) layout can become more complex and, ifnot carefully planned, result in an unreliable design. This article presents some PCB designconsiderations and general recommendations for choosing a 0.4mm- or 0.5mm-pitch WLP for yourapplication.

    標(biāo)簽: Considerations Guidelines and Design

    上傳時間: 2013-11-09

    上傳用戶:ls530720646

  • 《器件封裝用戶向?qū)А焚愳`思產(chǎn)品封裝資料

    Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.

    標(biāo)簽: 封裝 器件 用戶 賽靈思

    上傳時間: 2013-11-21

    上傳用戶:不懂夜的黑

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