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electrostatic

  • ESD-Phenomena-and-the-Reliability

    As we enter the next millennium, there are clear technological patterns. First, the electronic industry continues to scale microelectronic structures to achieve faster devices, new devices, or more per unit area. Secondly, electrostatic charge, electrostatic discharge (ESD), electrical overstress (EOS) and electromagnetic emissions (EMI) continue to be a threat to these scaled structures. This dichotomy presents a dilemma for the scaling of semiconductor technologies and a future threat to new technologies. Technological advancements, material changes, design techniques, and simulation can fend off this growing concern – but to maintain this ever-threatening challenge, one must continue to establish research and education in this issue. 

    標(biāo)簽: ESD-Phenomena-and-the-Reliability

    上傳時間: 2020-06-05

    上傳用戶:shancjb

  • 靜電放電ESD保護(hù)器件的模擬與仿真

    靜電放電(electrostatic Discharge,ESD)是構(gòu)成集成電路可靠性的主要因素之一,存在于生產(chǎn)到使用的每一個環(huán)節(jié),并成為開發(fā)新一代工藝技術(shù)的難點之一,近年來,對ESD的研究也因而越來越受到重視,仿真工具在ESD領(lǐng)域的應(yīng)用使得ESD防護(hù)的研究變得更為便利,可大幅縮短研發(fā)周期然而,由于ESD現(xiàn)象復(fù)雜的物理機(jī)制,極端的電場及溫度條件,以及ESD仿真中頻繁的不收斂現(xiàn)象,都使得FSD的仿真變得極為困難本文詳細(xì)闡述了ESD的來源、造成的危害以及如何測試集成電路的防靜電沖擊能力,并基于 Sentaurus軟件,對ESD防護(hù)器件展開了的分析、研究,內(nèi)容包括1)掌握ESD保護(hù)的基本理論、測試方法和防護(hù)機(jī)理2)研究了工藝仿真流程的步驟以及網(wǎng)格定義在工藝仿真中的重要性,并對網(wǎng)格定義的方法進(jìn)行了探討3)硏究了器件仿真流程以及器件仿真中的物理模型和模型函數(shù),并對描述同一物理機(jī)制的的各種不同模型展開對比分析.主要包括傳輸方程模型、能帶模型、各種遷移率退化模型、雪崩離化模型和復(fù)合模型4)研究了雙極型晶體管和可控硅(Silicon Controlled rectifier,SCR)防護(hù)器件的仿真,并通過對仿真結(jié)果的分析,研究了ESD保護(hù)器件在ESD應(yīng)力作用下的工作機(jī)理關(guān)鍵詞:靜電放電;網(wǎng)格;器件仿真;雙極型晶體管;可控硅

    標(biāo)簽: 靜電放電 esd

    上傳時間: 2022-03-30

    上傳用戶:

  • IEC 61000-4-2-2018

    INTERNATIONAL STANDARD NORME INTERNATIONALEPart 4-2: Testing and measurement techniques – electrostatic discharge immunity test.About the IEC The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes International Standards for all electrical, electronic and related technologies.About IEC publications The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the latest edition, a corrigenda or an amendment might have been published.

    標(biāo)簽: IEC

    上傳時間: 2022-04-19

    上傳用戶:fliang

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