Abstract: Using a wafer-level package (WLP) can reduce the overall size and cost of your solution.However when using a WLP IC, the printed circuit board (PCB) layout can become more complex and, ifnot carefully planned, result in an unreliable deSign. This article presents some PCB deSignconsiderations and general recommendations for choosing a 0.4mm- or 0.5mm-pitch WLP for yourapplication.
多遠(yuǎn)程二極管溫度傳感器-deSign Considerations for pc thermal management
Multiple RDTS (remote diode temperature sensing) provides the most accurate method of sensing an IC’s junction temperature. It overcomes thermal gradient and placement issues encountered when trying to place external sensors. PCB component count decreases when using a device that provides multiple inputs.Better temperature sensing improves product performance and reliability. Disk drive data integrity suffers at elevated temperatures. IBM published an article stating that a 5°C rise in operating temperature causes a 15% increase in the drive’s failure rate. The overall performance of a system can be improved by providing a more accurate temperature measurement of the most critical devices allowing them to run just a few degrees hotter.The LM83 directly senses its own temperature and the temperature of three external PN junctions. One is dedicated to the CPU of choice, the other two go to other parts of your system that need thermal monitoring such as the disk drive or graphics chip. The SMBus-compatible LM83 supports SMBus timeout and logic levels. The LM83 has two interrupt outputs; one for user-programmable limits and WATCHDOG capability (INT), the other is a Critical Temperature Alarm output (T_CRIT_A) for system power supply shutdown.
The main objective of this book is to present all the relevant informationrequired for RF and micro-wave power amplifier deSign includingwell-known and novel theoretical approaches and practical deSign techniquesas well as to suggest optimum deSign approaches effectively combininganalytical calculations and computer-aided deSign. This bookcan also be very useful for lecturing to promote the analytical way ofthinking with practical verification by making a bridge between theoryand practice of RF and microwave engineering. As it often happens, anew result is the well-forgotten old one. Therefore, the demonstrationof not only new results based on new technologies or circuit schematicsis given, but some sufficiently old ideas or approaches are also introduced,that could be very useful in modern practice or could contributeto appearance of new ideas or schematic techniques.
Abstract: Using a wafer-level package (WLP) can reduce the overall size and cost of your solution.However when using a WLP IC, the printed circuit board (PCB) layout can become more complex and, ifnot carefully planned, result in an unreliable deSign. This article presents some PCB deSignconsiderations and general recommendations for choosing a 0.4mm- or 0.5mm-pitch WLP for yourapplication.
In this paper, we discuss efficient coding and deSign styles using verilog. This can beimmensely helpful for any digital deSigner initiating deSigns. Here, we address different problems rangingfrom RTL-Gate Level simulation mismatch to race conditions in writing behavioral models. All theseproblems are accompanied by an example to have a better idea, and these can be taken care off if thesecoding guidelines are followed. Discussion of all the techniques is beyond the scope of this paper, however,here we try to cover a few of them.
