This application note concentrates on explaining the fundamental concepts about CANape and CCP communication
標簽： concentrates application fundamental explaining
上傳時間： 2017-04-15
上傳用戶：Miyuki
This project concentrates on the deterministic approach. This guarantees the full coverage in mobile adhoc network. This uses deterministic broadcast protocols that use neighbor set information only, which is more efficient method.
標簽： This deterministic concentrates guarantees
上傳時間： 2017-05-17
上傳用戶：日光微瀾
This project concentrates on the deterministic approach. This guarantees the full coverage in mobile adhoc network. This uses deterministic broadcast protocols that use neighbor set information only, which is more efficient method.
標簽： This deterministic concentrates guarantees
上傳時間： 2017-05-17
上傳用戶：teddysha
This project concentrates on the deterministic approach. This guarantees the full coverage in mobile adhoc network. This uses deterministic broadcast protocols that use neighbor set information only, which is more efficient method.
標簽： This deterministic concentrates guarantees
上傳時間： 2013-12-12
上傳用戶：15736969615
This project concentrates on the deterministic approach. This guarantees the full coverage in mobile adhoc network. This uses deterministic broadcast protocols that use neighbor set information only, which is more efficient method.
標簽： This deterministic concentrates guarantees
上傳時間： 2013-11-28
上傳用戶：maizezhen
This project concentrates on the deterministic approach. This guarantees the full coverage in mobile adhoc network. This uses deterministic broadcast protocols that use neighbor set information only, which is more efficient method.
標簽： This deterministic concentrates guarantees
上傳時間： 2013-11-28
上傳用戶：784533221
This project concentrates on the deterministic approach. This guarantees the full coverage in mobile adhoc network. This uses deterministic broadcast protocols that use neighbor set information only, which is more efficient method.
標簽： This deterministic concentrates guarantees
上傳時間： 2017-05-17
上傳用戶：chens000
This document provides practical, common guidelines for incorporating PCI Express interconnect layouts onto Printed Circuit Boards (PCB) ranging from 4-layer desktop baseboard designs to 10- layer or more server baseboard designs. Guidelines and constraints in this document are intended for use on both baseboard and add-in card PCB designs. This includes interconnects between PCI Express devices located on the same baseboard (chip-to-chip routing) and interconnects between a PCI Express device located “down” on the baseboard and a device located “up” on an add-in card attached through a connector. This document is intended to cover all major components of the physical interconnect including design guidelines for the PCB traces, vias and AC coupling capacitors, as well as add-in card edge-finger and connector considerations. The intent of the guidelines and examples is to help ensure that good high-speed signal design practices are used and that the timing/jitter and loss/attenuation budgets can also be met from end-to-end across the PCI Express interconnect. However, while general physical guidelines and suggestions are given, they may not necessarily guarantee adequate performance of the interconnect for all layouts and implementations. Therefore, designers should consider modeling and simulation of the interconnect in order to ensure compliance to all applicable specifications. The document is composed of two main sections. The first section provides an overview of general topology and interconnect guidelines. The second section concentrates on physical layout constraints where bulleted items at the beginning of a topic highlight important constraints, while the narrative that follows offers additional insight.
上傳時間： 2013-10-15
上傳用戶：busterman
This document describes the system hardware implementation for the OMAP3530 processor and theTPS65930/20 companion power integrated circuit (IC). The document concentrates on the powerconnectivity for the processor and the companion power IC. The document also briefly explains someother specifics related to power, such as the boot modes and the power-up sequence.
上傳時間： 2013-11-14
上傳用戶：yeling1919
This document provides practical, common guidelines for incorporating PCI Express interconnect layouts onto Printed Circuit Boards (PCB) ranging from 4-layer desktop baseboard designs to 10- layer or more server baseboard designs. Guidelines and constraints in this document are intended for use on both baseboard and add-in card PCB designs. This includes interconnects between PCI Express devices located on the same baseboard (chip-to-chip routing) and interconnects between a PCI Express device located “down” on the baseboard and a device located “up” on an add-in card attached through a connector. This document is intended to cover all major components of the physical interconnect including design guidelines for the PCB traces, vias and AC coupling capacitors, as well as add-in card edge-finger and connector considerations. The intent of the guidelines and examples is to help ensure that good high-speed signal design practices are used and that the timing/jitter and loss/attenuation budgets can also be met from end-to-end across the PCI Express interconnect. However, while general physical guidelines and suggestions are given, they may not necessarily guarantee adequate performance of the interconnect for all layouts and implementations. Therefore, designers should consider modeling and simulation of the interconnect in order to ensure compliance to all applicable specifications. The document is composed of two main sections. The first section provides an overview of general topology and interconnect guidelines. The second section concentrates on physical layout constraints where bulleted items at the beginning of a topic highlight important constraints, while the narrative that follows offers additional insight.
上傳時間： 2014-01-24
上傳用戶：s363994250
