第一部分 信號完整性知識基礎(chǔ).................................................................................5第一章 高速數(shù)字電路概述.....................................................................................51.1 何為高速電路...............................................................................................51.2 高速帶來的問題及設(shè)計(jì)流程剖析...............................................................61.3 相關(guān)的一些基本概念...................................................................................8第二章 傳輸線理論...............................................................................................122.1 分布式系統(tǒng)和集總電路.............................................................................122.2 傳輸線的RLCG 模型和電報(bào)方程...............................................................132.3 傳輸線的特征阻抗.....................................................................................142.3.1 特性阻抗的本質(zhì).................................................................................142.3.2 特征阻抗相關(guān)計(jì)算.............................................................................152.3.3 特性阻抗對信號完整性的影響.........................................................172.4 傳輸線電報(bào)方程及推導(dǎo).............................................................................182.5 趨膚效應(yīng)和集束效應(yīng).................................................................................232.6 信號的反射.................................................................................................252.6.1 反射機(jī)理和電報(bào)方程.........................................................................252.6.2 反射導(dǎo)致信號的失真問題.................................................................302.6.2.1 過沖和下沖.....................................................................................302.6.2.2 振蕩：.............................................................................................312.6.3 反射的抑制和匹配.............................................................................342.6.3.1 串行匹配.........................................................................................352.6.3.1 并行匹配.........................................................................................362.6.3.3 差分線的匹配.................................................................................392.6.3.4 多負(fù)載的匹配.................................................................................41第三章 串?dāng)_的分析...............................................................................................423.1 串?dāng)_的基本概念.........................................................................................423.2 前向串?dāng)_和后向串?dāng)_.................................................................................433.3 后向串?dāng)_的反射.........................................................................................463.4 后向串?dāng)_的飽和.........................................................................................463.5 共模和差模電流對串?dāng)_的影響.................................................................483.6 連接器的串?dāng)_問題.....................................................................................513.7 串?dāng)_的具體計(jì)算.........................................................................................543.8 避免串?dāng)_的措施.........................................................................................57第四章 EMI 抑制....................................................................................................604.1 EMI/EMC 的基本概念..................................................................................604.2 EMI 的產(chǎn)生..................................................................................................614.2.1 電壓瞬變.............................................................................................614.2.2 信號的回流.........................................................................................624.2.3 共模和差摸EMI ..................................................................................634.3 EMI 的控制..................................................................................................654.3.1 屏蔽.....................................................................................................654.3.1.1 電場屏蔽.........................................................................................654.3.1.2 磁場屏蔽.........................................................................................674.3.1.3 電磁場屏蔽.....................................................................................674.3.1.4 電磁屏蔽體和屏蔽效率.................................................................684.3.2 濾波.....................................................................................................714.3.2.1 去耦電容.........................................................................................714.3.2.3 磁性元件.........................................................................................734.3.3 接地.....................................................................................................744.4 PCB 設(shè)計(jì)中的EMI.......................................................................................754.4.1 傳輸線RLC 參數(shù)和EMI ........................................................................764.4.2 疊層設(shè)計(jì)抑制EMI ..............................................................................774.4.3 電容和接地過孔對回流的作用.........................................................784.4.4 布局和走線規(guī)則.................................................................................79第五章 電源完整性理論基礎(chǔ)...............................................................................825.1 電源噪聲的起因及危害.............................................................................825.2 電源阻抗設(shè)計(jì).............................................................................................855.3 同步開關(guān)噪聲分析.....................................................................................875.3.1 芯片內(nèi)部開關(guān)噪聲.............................................................................885.3.2 芯片外部開關(guān)噪聲.............................................................................895.3.3 等效電感衡量SSN ..............................................................................905.4 旁路電容的特性和應(yīng)用.............................................................................925.4.1 電容的頻率特性.................................................................................935.4.3 電容的介質(zhì)和封裝影響.....................................................................955.4.3 電容并聯(lián)特性及反諧振.....................................................................955.4.4 如何選擇電容.....................................................................................975.4.5 電容的擺放及Layout ........................................................................99第六章 系統(tǒng)時(shí)序.................................................................................................1006.1 普通時(shí)序系統(tǒng)...........................................................................................1006.1.1 時(shí)序參數(shù)的確定...............................................................................1016.1.2 時(shí)序約束條件...................................................................................1063.2 高速設(shè)計(jì)的問題.......................................................................................2093.3 SPECCTRAQuest SI Expert 的組件.......................................................2103.3.1 SPECCTRAQuest Model Integrity .................................................2103.3.2 SPECCTRAQuest Floorplanner/Editor .........................................2153.3.3 Constraint Manager .......................................................................2163.3.4 SigXplorer Expert Topology Development Environment .......2233.3.5 SigNoise 仿真子系統(tǒng)......................................................................2253.3.6 EMControl .........................................................................................2303.3.7 SPECCTRA Expert 自動(dòng)布線器.......................................................2303.4 高速設(shè)計(jì)的大致流程...............................................................................2303.4.1 拓?fù)浣Y(jié)構(gòu)的探索...............................................................................2313.4.2 空間解決方案的探索.......................................................................2313.4.3 使用拓?fù)淠０弪?qū)動(dòng)設(shè)計(jì)...................................................................2313.4.4 時(shí)序驅(qū)動(dòng)布局...................................................................................2323.4.5 以約束條件驅(qū)動(dòng)設(shè)計(jì).......................................................................2323.4.6 設(shè)計(jì)后分析.......................................................................................233第四章 SPECCTRAQUEST SIGNAL EXPLORER 的進(jìn)階運(yùn)用..........................................2344.1 SPECCTRAQuest Signal Explorer 的功能包括：................................2344.2 圖形化的拓?fù)浣Y(jié)構(gòu)探索...........................................................................2344.3 全面的信號完整性(Signal Integrity)分析.......................................2344.4 完全兼容 IBIS 模型...............................................................................2344.5 PCB 設(shè)計(jì)前和設(shè)計(jì)的拓?fù)浣Y(jié)構(gòu)提取.......................................................2354.6 仿真設(shè)置顧問...........................................................................................2354.7 改變設(shè)計(jì)的管理.......................................................................................2354.8 關(guān)鍵技術(shù)特點(diǎn)...........................................................................................2364.8.1 拓?fù)浣Y(jié)構(gòu)探索...................................................................................2364.8.2 SigWave 波形顯示器........................................................................2364.8.3 集成化的在線分析(Integration and In-process Analysis) .236第五章 部分特殊的運(yùn)用...............................................................................2375.1 Script 指令的使用..................................................................................2375.2 差分信號的仿真.......................................................................................2435.3 眼圖模式的使用.......................................................................................249第四部分：HYPERLYNX 仿真工具使用指南............................................................251第一章 使用LINESIM 進(jìn)行前仿真.......................................................................2511.1 用LineSim 進(jìn)行仿真工作的基本方法...................................................2511.2 處理信號完整性原理圖的具體問題.......................................................2591.3 在LineSim 中如何對傳輸線進(jìn)行設(shè)置...................................................2601.4 在LineSim 中模擬IC 元件.....................................................................2631.5 在LineSim 中進(jìn)行串?dāng)_仿真...................................................................268第二章 使用BOARDSIM 進(jìn)行后仿真......................................................................2732.1 用BOARDSIM 進(jìn)行后仿真工作的基本方法...................................................2732.2 BoardSim 的進(jìn)一步介紹..........................................................................2922.3 BoardSim 中的串?dāng)_仿真..........................................................................309
標(biāo)簽： PCB 內(nèi)存 仿真技術(shù)
上傳時(shí)間： 2013-11-07
上傳用戶：aa7821634
探討了對高頻信號進(jìn)行采集和處理的設(shè)計(jì)難點(diǎn)，提出將LabVIEW的采集數(shù)據(jù)的特性與MATLAB強(qiáng)大的計(jì)算能力相結(jié)合的方法，并以此設(shè)計(jì)了一個(gè)系統(tǒng)。然后通過3種不同的方法，分別是將txt文件引入MATLAB、使用MATLAB script、使用Math Script RT，來結(jié)合LabVIEW和MATLAB，以采集得到的信號和內(nèi)部產(chǎn)生信號的均方差及相關(guān)系數(shù)為標(biāo)度來分析不同方法的可行性及效率，通過對比結(jié)果，最終確定了一種最佳的方案。
標(biāo)簽： LabVIEW MATLAB GHz 高頻信號
上傳時(shí)間： 2013-10-21
上傳用戶：jennyzai
探討了對高頻信號進(jìn)行采集和處理的設(shè)計(jì)難點(diǎn)，提出將LabVIEW的采集數(shù)據(jù)的特性與MATLAB強(qiáng)大的計(jì)算能力相結(jié)合的方法，并以此設(shè)計(jì)了一個(gè)系統(tǒng)。然后通過3種不同的方法，分別是將txt文件引入MATLAB、使用MATLAB script、使用Math Script RT，來結(jié)合LabVIEW和MATLAB，以采集得到的信號和內(nèi)部產(chǎn)生信號的均方差及相關(guān)系數(shù)為標(biāo)度來分析不同方法的可行性及效率，通過對比結(jié)果，最終確定了一種最佳的方案。
標(biāo)簽： LabVIEW MATLAB GHz 高頻信號
上傳時(shí)間： 2015-01-02
上傳用戶：zhaoq123
此軟件支持多文檔打開，支持多種程序語言語法高亮度顯示:Delphi,SQL,Basic,C++, Perl,Java,HTML, TCL/tk,AWK Script,Python CA-Clipper MS-DOS Patch File。多種選擇模式支持,支持程序語言語法高亮度顯示顏色的可視化調(diào)整，支持書簽：十個(gè)書簽，支持多級Undo和Redo操作，層次數(shù)可以自己設(shè)置。 支持最近文件列表，最近文件的數(shù)量可以自己設(shè)置。支持查找、替換：同Delphi: 支持直接編輯Delphi的窗體文件(dfm)。支持直接編輯二進(jìn)制文件。支持直接將源程序文件導(dǎo)出為Word文檔或超文本形式。支持代碼模板和代碼自動(dòng)完成: 支持自動(dòng)文件保存。 支持“編輯”命令鍵的自定義:支持行號顯示:可以用指定顏色顯示當(dāng)前行:支持文件拖放。
上傳時(shí)間： 2013-12-26
上傳用戶：gtf1207
Suite of components to add scripting capabilities to your applications, including Pascal & Basic scripting engines, Pascal & Basic syntax highlighting memo and script debug tools.
標(biāo)簽： capabilities applications components including
上傳時(shí)間： 2015-04-04
上傳用戶：chenbhdt
迅捷簡易網(wǎng)頁計(jì)數(shù)器 Ver2.0 一.系統(tǒng)要求: ASP+ACCESS 二.程序主要功能: 簡單的頁面計(jì)數(shù)功能。 三.使用方法 1. 上傳全部文件； 2. 用記事本打開setup.asp更改程序按裝路徑； 3. 將 下面的代碼添加到需要計(jì)數(shù)的網(wǎng)頁， <script language="javascript" src="count.asp"></script> 其中count.asp應(yīng)改為計(jì)數(shù)文件的實(shí)際路徑。 四.文件說明 count.asp 計(jì)數(shù)器主文件. count.mdb ACCESS數(shù)據(jù)庫. index.asp 計(jì)數(shù)器測試文件.
上傳時(shí)間： 2014-01-09
上傳用戶：LIKE
Shell源碼:find查找日期為某一天的文件 A=`find ~ -print` | ls -l --full-time $A 2>/dev/null | grep "Jun 27" | grep 1998 下面這個(gè)script，存成一個(gè)符合規(guī)則名字的文件,置上x屬性就行了。
標(biāo)簽： find full-time Shell print
上傳時(shí)間： 2014-01-01
上傳用戶：維子哥哥
This example program shows how to configure and use the A/D Converter of the following microcontroller: STMicroelectronics ST10F166 After configuring the A/D, the program reads the A/D result and outputs the converted value using the serial port. To run this program... Build the project (Project Menu, Build Target) Start the debugger (Debug Menu, Start/Stop Debug Session) View the Serial Window (View Menu, Serial Window #1) View the A/D converter peripheral (Peripheral Menu, A/D Converter) Run the program (Debug Menu, Go) A debug script (debug.ini) creates buttons that set different analog values in A/D channels. As the program runs, you will see the A/D input and output change. Other buttons create signals that generate sine wave or sawtooth patterns as analog inputs. µ Vision3 users may enable the built-in Logic Analyzer to view, measure and compare these input signals graphically.
標(biāo)簽： microcontroll Converter configure following
上傳時(shí)間： 2014-12-01
上傳用戶：獨(dú)孤求源
The tar file contains the following files: ptfsf.c: heart of the perfect TFSF code ptfsf.h: header file for same ptfsf-demo.c: FDTD code which demonstrates use of perfect TFSF code. Essentially this program used to generate results shown in the paper ptfsf-file-maker.c: code to generate an incident-field file using the "perfect" incident fields ptfsf-demo-file.c: FDTD code which uses the perfect incident fields stored in a file fdtdgen.h: defines macros used in much of my code Makefile: simple make-file to compile programs Also include are some simple script files to run the programs with reasonable values. The code assumes a two-dimensional computational domain with TMz polarization (i.e., non-zero field Ez, Hx, and Hy). The program is currently written so that the incident field always strikes the lower-left corner of the total-field region first. (If you want a different corner, that should be a fairly simple tweak to the code, but for now you ll have to make that tweak yourself.)
標(biāo)簽： ptfsf following the contains
上傳時(shí)間： 2013-11-28
上傳用戶：風(fēng)之驕子
IrCOMM2k - Virtual Infrared COM Port for Windows 2000/XP。 2. FILES IN THIS ARCHIVE: - Setup.exe (setup and uninstall program) - ircomm2k.exe (service program) - ircomm2k.sys (device driver) - ircomm2k.dll (device property page) - ircomm2k.hlp (property page context help) - ircomm2k.inf (setup script for windows) - Readme.txt (this file) - License.txt (terms of license) 3. INSTALLATION 1. unzip IrCOMM2k-1.2.0.zip in a new folder 2. run the setup program 3. disable the image transfer under wireless link
標(biāo)簽： IrCOMM2k Infrared ARCHIVE Virtual
上傳時(shí)間： 2015-09-15
上傳用戶：yyq123456789
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