Ultiboard PCB introduction
標(biāo)簽： development ultiboard PCB
上傳時(shí)間： 2013-11-21
上傳用戶：HGH77P99
第一部分 信號(hào)完整性知識(shí)基礎(chǔ).................................................................................5第一章 高速數(shù)字電路概述.....................................................................................51.1 何為高速電路...............................................................................................51.2 高速帶來(lái)的問(wèn)題及設(shè)計(jì)流程剖析...............................................................61.3 相關(guān)的一些基本概念...................................................................................8第二章 傳輸線理論...............................................................................................122.1 分布式系統(tǒng)和集總電路.............................................................................122.2 傳輸線的RLCG 模型和電報(bào)方程...............................................................132.3 傳輸線的特征阻抗.....................................................................................142.3.1 特性阻抗的本質(zhì).................................................................................142.3.2 特征阻抗相關(guān)計(jì)算.............................................................................152.3.3 特性阻抗對(duì)信號(hào)完整性的影響.........................................................172.4 傳輸線電報(bào)方程及推導(dǎo).............................................................................182.5 趨膚效應(yīng)和集束效應(yīng).................................................................................232.6 信號(hào)的反射.................................................................................................252.6.1 反射機(jī)理和電報(bào)方程.........................................................................252.6.2 反射導(dǎo)致信號(hào)的失真問(wèn)題.................................................................302.6.2.1 過(guò)沖和下沖.....................................................................................302.6.2.2 振蕩：.............................................................................................312.6.3 反射的抑制和匹配.............................................................................342.6.3.1 串行匹配.........................................................................................352.6.3.1 并行匹配.........................................................................................362.6.3.3 差分線的匹配.................................................................................392.6.3.4 多負(fù)載的匹配.................................................................................41第三章 串?dāng)_的分析...............................................................................................423.1 串?dāng)_的基本概念.........................................................................................423.2 前向串?dāng)_和后向串?dāng)_.................................................................................433.3 后向串?dāng)_的反射.........................................................................................463.4 后向串?dāng)_的飽和.........................................................................................463.5 共模和差模電流對(duì)串?dāng)_的影響.................................................................483.6 連接器的串?dāng)_問(wèn)題.....................................................................................513.7 串?dāng)_的具體計(jì)算.........................................................................................543.8 避免串?dāng)_的措施.........................................................................................57第四章 EMI 抑制....................................................................................................604.1 EMI/EMC 的基本概念..................................................................................604.2 EMI 的產(chǎn)生..................................................................................................614.2.1 電壓瞬變.............................................................................................614.2.2 信號(hào)的回流.........................................................................................624.2.3 共模和差摸EMI ..................................................................................634.3 EMI 的控制..................................................................................................654.3.1 屏蔽.....................................................................................................654.3.1.1 電場(chǎng)屏蔽.........................................................................................654.3.1.2 磁場(chǎng)屏蔽.........................................................................................674.3.1.3 電磁場(chǎng)屏蔽.....................................................................................674.3.1.4 電磁屏蔽體和屏蔽效率.................................................................684.3.2 濾波.....................................................................................................714.3.2.1 去耦電容.........................................................................................714.3.2.3 磁性元件.........................................................................................734.3.3 接地.....................................................................................................744.4 PCB 設(shè)計(jì)中的EMI.......................................................................................754.4.1 傳輸線RLC 參數(shù)和EMI ........................................................................764.4.2 疊層設(shè)計(jì)抑制EMI ..............................................................................774.4.3 電容和接地過(guò)孔對(duì)回流的作用.........................................................784.4.4 布局和走線規(guī)則.................................................................................79第五章 電源完整性理論基礎(chǔ)...............................................................................825.1 電源噪聲的起因及危害.............................................................................825.2 電源阻抗設(shè)計(jì).............................................................................................855.3 同步開(kāi)關(guān)噪聲分析.....................................................................................875.3.1 芯片內(nèi)部開(kāi)關(guān)噪聲.............................................................................885.3.2 芯片外部開(kāi)關(guān)噪聲.............................................................................895.3.3 等效電感衡量SSN ..............................................................................905.4 旁路電容的特性和應(yīng)用.............................................................................925.4.1 電容的頻率特性.................................................................................935.4.3 電容的介質(zhì)和封裝影響.....................................................................955.4.3 電容并聯(lián)特性及反諧振.....................................................................955.4.4 如何選擇電容.....................................................................................975.4.5 電容的擺放及Layout ........................................................................99第六章 系統(tǒng)時(shí)序.................................................................................................1006.1 普通時(shí)序系統(tǒng)...........................................................................................1006.1.1 時(shí)序參數(shù)的確定...............................................................................1016.1.2 時(shí)序約束條件...................................................................................1063.2 高速設(shè)計(jì)的問(wèn)題.......................................................................................2093.3 SPECCTRAQuest SI Expert 的組件.......................................................2103.3.1 SPECCTRAQuest Model Integrity .................................................2103.3.2 SPECCTRAQuest Floorplanner/Editor .........................................2153.3.3 Constraint Manager .......................................................................2163.3.4 SigXplorer Expert Topology Development Environment .......2233.3.5 SigNoise 仿真子系統(tǒng)......................................................................2253.3.6 EMControl .........................................................................................2303.3.7 SPECCTRA Expert 自動(dòng)布線器.......................................................2303.4 高速設(shè)計(jì)的大致流程...............................................................................2303.4.1 拓?fù)浣Y(jié)構(gòu)的探索...............................................................................2313.4.2 空間解決方案的探索.......................................................................2313.4.3 使用拓?fù)淠０弪?qū)動(dòng)設(shè)計(jì)...................................................................2313.4.4 時(shí)序驅(qū)動(dòng)布局...................................................................................2323.4.5 以約束條件驅(qū)動(dòng)設(shè)計(jì).......................................................................2323.4.6 設(shè)計(jì)后分析.......................................................................................233第四章 SPECCTRAQUEST SIGNAL EXPLORER 的進(jìn)階運(yùn)用..........................................2344.1 SPECCTRAQuest Signal Explorer 的功能包括：................................2344.2 圖形化的拓?fù)浣Y(jié)構(gòu)探索...........................................................................2344.3 全面的信號(hào)完整性(Signal Integrity)分析.......................................2344.4 完全兼容 IBIS 模型...............................................................................2344.5 PCB 設(shè)計(jì)前和設(shè)計(jì)的拓?fù)浣Y(jié)構(gòu)提取.......................................................2354.6 仿真設(shè)置顧問(wèn)...........................................................................................2354.7 改變?cè)O(shè)計(jì)的管理.......................................................................................2354.8 關(guān)鍵技術(shù)特點(diǎn)...........................................................................................2364.8.1 拓?fù)浣Y(jié)構(gòu)探索...................................................................................2364.8.2 SigWave 波形顯示器........................................................................2364.8.3 集成化的在線分析(Integration and In-process Analysis) .236第五章 部分特殊的運(yùn)用...............................................................................2375.1 Script 指令的使用..................................................................................2375.2 差分信號(hào)的仿真.......................................................................................2435.3 眼圖模式的使用.......................................................................................249第四部分：HYPERLYNX 仿真工具使用指南............................................................251第一章 使用LINESIM 進(jìn)行前仿真.......................................................................2511.1 用LineSim 進(jìn)行仿真工作的基本方法...................................................2511.2 處理信號(hào)完整性原理圖的具體問(wèn)題.......................................................2591.3 在LineSim 中如何對(duì)傳輸線進(jìn)行設(shè)置...................................................2601.4 在LineSim 中模擬IC 元件.....................................................................2631.5 在LineSim 中進(jìn)行串?dāng)_仿真...................................................................268第二章 使用BOARDSIM 進(jìn)行后仿真......................................................................2732.1 用BOARDSIM 進(jìn)行后仿真工作的基本方法...................................................2732.2 BoardSim 的進(jìn)一步介紹..........................................................................2922.3 BoardSim 中的串?dāng)_仿真..........................................................................309
標(biāo)簽： PCB 內(nèi)存 仿真技術(shù)
上傳時(shí)間： 2014-04-18
上傳用戶：wpt
Power over Ethernet (PoE) is a new development thatallows for the delivery of power to Ethernet-based devicesvia standard Ethernet CAT5 cable, precluding the need forwall adapters or other external power sources. The PoEspecification defines a hardware detection protocol wherePower Sourcing Equipment (PSE) is able to identify PoEPowered Devices (PDs), thus allowing full backwardscompatibility with non-PoE-aware (legacy) Ethernetdevices.
標(biāo)簽： PoE 電池電路 擴(kuò)展 以太網(wǎng)供電
上傳時(shí)間： 2013-11-11
上傳用戶：daoyue
ST8S開(kāi)發(fā)原理圖,和大家分享下,希望能和更多朋友一起學(xué)習(xí),進(jìn)步.
標(biāo)簽： S-DISCOVERY STM 原理圖
上傳時(shí)間： 2013-12-31
上傳用戶：1039312764
Abstract: This application note describes how to build, debug, and run applications on the on-board MAXQ622microcontroller to interface with the DS8005 dual smart card interface. This is demonstrated in both IAREmbedded Workbench and the Rowley CrossWorks IDE, using sample code provided with the kit.
標(biāo)簽： 8005 DS 評(píng)估套件
上傳時(shí)間： 2013-10-29
上傳用戶：ddddddd
一起學(xué)習(xí)
上傳時(shí)間： 2013-11-10
上傳用戶：rologne
STM8的工程模板教程
上傳時(shí)間： 2013-11-14
上傳用戶：love1314
，我說(shuō)說(shuō)AVR 的集成開(kāi)發(fā)環(huán)境。也就是常說(shuō)的IDE（Integrated Development Environment）。圖片比較多，雖然用軟件處理過(guò)體積，網(wǎng)頁(yè)可能還是比較慢，還請(qǐng)見(jiàn)諒。 現(xiàn)今世界上的AVR 開(kāi)發(fā)環(huán)境可以說(shuō)是百花齊放了，互相當(dāng)然各有長(zhǎng)短，我們看看都有哪些： 首當(dāng)其沖的應(yīng)該還是IAR，為什么呢，因?yàn)楫?dāng)初AVR 還在ATMEL 胎中醞釀的時(shí)候，IAR 公司 參與了AVR 的設(shè)計(jì)，因此可以認(rèn)為IAR 有更為正統(tǒng)的血液，它最了解AVR，它的編譯器編出來(lái)的 代碼應(yīng)該最優(yōu)秀。好比你生的孩子還是你最了解——至少相當(dāng)長(zhǎng)一段時(shí)間是這樣的。事實(shí)上，IAR for AVR 確實(shí)展現(xiàn)了這個(gè)實(shí)力，它的功能確實(shí)最為強(qiáng)大，無(wú)論是源代碼編寫(xiě)還是軟件乃至硬件仿 真，編譯出來(lái)的代碼也十分優(yōu)秀。但是事物總是相對(duì)存在的，優(yōu)點(diǎn)有時(shí)就意味著缺點(diǎn)。IAR 功能 全面而強(qiáng)悍，代價(jià)就是它的軟件界面比較復(fù)雜，設(shè)置選項(xiàng)多，網(wǎng)上的資料也比較少，最要命的是 這個(gè)軟件非常的貴，好吧你說(shuō)你有破解版，但是破解文件一般并不通用，而且破解方法一般都稍 顯繁瑣。以上幾條，對(duì)于新接觸AVR 的人來(lái)說(shuō)，幾乎是邁不過(guò)的坎。
標(biāo)簽： AVR
上傳時(shí)間： 2013-10-15
上傳用戶：weiwolkt
以太網(wǎng)和CAN總線應(yīng)用廣泛，但由于其通信協(xié)議不同，兩種總線器件間無(wú)法進(jìn)行數(shù)據(jù)通信，因此，設(shè)計(jì)了基于CP2200與C8051F040的以太網(wǎng)總線與CAN總線接口轉(zhuǎn)換電路，并給出部分相關(guān)硬件電路與軟件設(shè)計(jì)分析。在保證數(shù)據(jù)完整和協(xié)議可靠的前提下，通過(guò)握手協(xié)議和簡(jiǎn)化的以太網(wǎng)協(xié)議，不僅實(shí)現(xiàn)了以太網(wǎng)數(shù)據(jù)與CAN數(shù)據(jù)的轉(zhuǎn)發(fā)，同時(shí)還順利的解決了以太網(wǎng)的高速性與CAN的低速率沖突，以及兩者數(shù)據(jù)包之間的大小不同的矛盾。 Abstract: In the development of actual application， Ethernet and CAN bus are used very extensively. Owing to its various communication protocols， the communicating between two kinds of bus device can’t be carried out. Therefore， in order to solve this problem， the Ethernet-CAN bus interface circuit based on CP2200 and C8051F040 was designed in this paper， and part of the related hardware circuit and software design analysis were given. On the condition of data’s integrity and protocols’reliability， through the handshaking protocols and the simplified the Ethernet protocol， not only the data switching between CAN and Ethernet was realized， but also the differ in velocity and packet size was solved.
標(biāo)簽： C8051F040 CAN 以太網(wǎng) 轉(zhuǎn)換
上傳時(shí)間： 2013-10-15
上傳用戶：Ants
應(yīng)用德國(guó)Micronas公司的CDC3207G微控制器開(kāi)發(fā)了一款汽車儀表板系統(tǒng)。詳細(xì)地介紹了該系統(tǒng)的硬件原理，以及步進(jìn)電機(jī)，音頻控制，LCD顯示，LED指示燈和報(bào)警燈等幾個(gè)模塊的實(shí)現(xiàn)方法。應(yīng)用μC/OS-II實(shí)時(shí)操作系統(tǒng)開(kāi)發(fā)軟件。著重介紹了啟動(dòng)代碼的設(shè)計(jì)和任務(wù)的規(guī)劃。 Abstract: A dashboard system is developed by using CDC3207G microcontroller made by Micronas.The hardware of the sys-tem and the realization of the step motor module,audio module,LCD display and LED indicator and alarm module are ex-plained in detail.The μC/OS-II real-time operating system is used for the software development and the starting code design and the task planning is explained specifically.
標(biāo)簽： 3207G 3207 CDC 汽車儀表板
上傳時(shí)間： 2013-10-26
上傳用戶：x4587
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