12864的 資料 功能強大 里面有詳細的 新片介紹 和功能描述-12864 inside information on a powerful new film presentations and f
標簽： 12864
上傳時間： 2013-06-12
上傳用戶：nanxia
這個是GPRS PC端軟件，用于GPRS串口模塊測試用。-This is a GPRS PC side software for GPRS serial module test.
標簽： VC_DEMO_GPRS
上傳時間： 2013-08-04
上傳用戶：lx9076
Amlogic最新的DPF開發資料，UI開發工具。需要的請下載啊-Amlogic the latest development information DPF
上傳時間： 2013-04-24
上傳用戶：cwyd0822
·MP3編解碼原程序以及設計資料-MP3 Encoder source code and design information 文件列表: mp3 ...\12_31.rar ...\200412292741864.zip ...\200412292833376.zip ...\200412292946201.zip
上傳時間： 2013-04-24
上傳用戶：F0717007
This application note provides a detailed description of themetastable behavior in PLDs from both circuit and statisticalviewpoints. Additionally, the information on the metastablecharacteristics of Cypress PLDs presented here can help youachieve any desired degree of reliability.
上傳時間： 2013-10-23
上傳用戶：gtzj
A tutorial on SAR type A/D converters, this note contains detailed information on several 12-bit circuits. Comparator, clocking, and preamplifier designs are discussed. A final circuit gives a 12-bit conversion in 1.8µs. Appended sections explain the basic SAR technique and explore D/A considerations.
上傳時間： 2014-01-21
上傳用戶：釣鰲牧馬
PCI ExpressTM Architecture Add-in Card Compliance Checklist for the PCI Express Base 1.0a SpecificationThe PCI Special Interest Group disclaims all warranties and liability for the use of this document and the information contained herein and assumes no responsibility for any errors that may appear in this document, nor does the PCI Special Interest Group make a commitment to update the information contained herein.Contact the PCI Special Interest Group office to obtain the latest revision of this checklistQuestions regarding the ths document or membership in the PCI Special Interest Group may be forwarded tPCI Special Interest Group5440 SW Westgate Drive #217Portland, OR 97221Phone: 503-291-2569Fax: 503-297-1090 DISCLAIMERThis document is provided "as is" with no warranties whatsoever, including any warranty of merchantability, noninfringement, fitness for any particular purpose, or any warranty otherwise arising out of any proposal, specification, or sample. The PCI SIG disclaims all liability for infringement of proprietary rights, relating to use of information in this specification. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted herein.
標簽： Architecture ExpressTM PCI
上傳時間： 2013-11-03
上傳用戶：gy592333
高速數字系統設計下載pdf:High-Speed Digital SystemDesign—A Handbook ofInterconnect Theory and DesignPracticesStephen H. HallGarrett W. HallJames A. McCallA Wiley-Interscience Publication JOHN WILEY & SONS, INC.New York • Chichester • Weinheim • Brisbane • Singapore • TorontoCopyright © 2000 by John Wiley & Sons, Inc.speeddigital systems at the platform level. The book walks the reader through everyrequired concept, from basic transmission line theory to digital timing analysis, high-speedmeasurement techniques, as well as many other topics. In doing so, a unique balancebetween theory and practical applications is achieved that will allow the reader not only tounderstand the nature of the problem, but also provide practical guidance to the solution.The level of theoretical understanding is such that the reader will be equipped to see beyondthe immediate practical application and solve problems not contained within these pages.Much of the information in this book has not been needed in past digital designs but isabsolutely necessary today. Most of the information covered here is not covered in standardcollege curricula, at least not in its focus on digital design, which is arguably one of the mostsignificant industries in electrical engineering.The focus of this book is on the design of robust high-volume, high-speed digital productssuch as computer systems, with particular attention paid to computer busses. However, thetheory presented is applicable to any high-speed digital system. All of the techniquescovered in this book have been applied in industry to actual digital products that have beensuccessfully produced and sold in high volume.Practicing engineers and graduate and undergraduate students who have completed basicelectromagnetic or microwave design classes are equipped to fully comprehend the theorypresented in this book. At a practical level, however, basic circuit theory is all thebackground required to apply the formulas in this book.
上傳時間： 2013-10-26
上傳用戶：縹緲
Radio Frequency Integrated Circuit Design I enjoyed reading this book for a number of reasons. One reason is that itaddresses high-speed analog design in the context of microwave issues. This isan advanced-level book, which should follow courses in basic circuits andtransmission lines. Most analog integrated circuit designers in the past workedon applications at low enough frequency that microwave issues did not arise.As a consequence, they were adept at lumped parameter circuits and often notcomfortable with circuits where waves travel in space. However, in order todesign radio frequency (RF) communications integrated circuits (IC) in thegigahertz range, one must deal with transmission lines at chip interfaces andwhere interconnections on chip are far apart. Also, impedance matching isaddressed, which is a topic that arises most often in microwave circuits. In mycareer, there has been a gap in comprehension between analog low-frequencydesigners and microwave designers. Often, similar issues were dealt with in twodifferent languages. Although this book is more firmly based in lumped-elementanalog circuit design, it is nice to see that microwave knowledge is brought inwhere necessary.Too many analog circuit books in the past have concentrated first on thecircuit side rather than on basic theory behind their application in communications.The circuits usually used have evolved through experience, without asatisfying intellectual theme in describing them. Why a given circuit works bestcan be subtle, and often these circuits are chosen only through experience. Forthis reason, I am happy that the book begins first with topics that require anintellectual approach—noise, linearity and filtering, and technology issues. Iam particularly happy with how linearity is introduced (power series). In therest of the book it is then shown, with specific circuits and numerical examples,how linearity and noise issues arise.
上傳時間： 2014-12-23
上傳用戶：han_zh
PCB LAYOUT 術語解釋(TERMS)1. COMPONENT SIDE(零件面、正面)︰大多數零件放置之面。2. SOLDER SIDE(焊錫面、反面)。3. SOLDER MASK(止焊膜面)︰通常指Solder Mask Open 之意。4. TOP PAD︰在零件面上所設計之零件腳PAD，不管是否鑽孔、電鍍。5. BOTTOM PAD：在銲錫面上所設計之零件腳PAD，不管是否鑽孔、電鍍。6. POSITIVE LAYER：單、雙層板之各層線路；多層板之上、下兩層線路及內層走線皆屬之。7. NEGATIVE LAYER：通常指多層板之電源層。8. INNER PAD：多層板之POSITIVE LAYER 內層PAD。9. ANTI-PAD：多層板之NEGATIVE LAYER 上所使用之絕緣範圍，不與零件腳相接。10. THERMAL PAD：多層板內NEGATIVE LAYER 上必須零件腳時所使用之PAD，一般稱為散熱孔或導通孔。11. PAD (銲墊)：除了SMD PAD 外，其他PAD 之TOP PAD、BOTTOM PAD 及INNER PAD 之形狀大小皆應相同。12. Moat : 不同信號的 Power& GND plane 之間的分隔線13. Grid : 佈線時的走線格點2. Test Point : ATE 測試點供工廠ICT 測試治具使用ICT 測試點 LAYOUT 注意事項:PCB 的每條TRACE 都要有一個作為測試用之TEST PAD(測試點)，其原則如下：1. 一般測試點大小均為30-35mil，元件分布較密時，測試點最小可至30mil.測試點與元件PAD 的距離最小為40mil。2. 測試點與測試點間的間距最小為50-75mil，一般使用75mil。密度高時可使用50mil,3. 測試點必須均勻分佈於PCB 上，避免測試時造成板面受力不均。4. 多層板必須透過貫穿孔(VIA)將測試點留於錫爐著錫面上(Solder Side)。5. 測試點必需放至於Bottom Layer6. 輸出test point report(.asc 檔案powerpcb v3.5)供廠商分析可測率7. 測試點設置處:Setuppadsstacks
上傳時間： 2013-10-22
上傳用戶：pei5
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