中文版詳情瀏覽：http://www.elecfans.com/emb/fpga/20130715324029.html Xilinx UltraScale:The Next-Generation Architecture for Your Next-Generation Architecture The Xilinx® UltraScale™ architecture delivers unprecedented levels of integration and capability with ASIC-class system- level performance for the most demanding applications. The UltraScale architecture is the industr y's f irst application of leading-edge ASIC architectural enhancements in an All Programmable architecture that scales from 20 nm planar through 16 nm FinFET technologies and beyond, in addition to scaling from monolithic through 3D ICs. Through analytical co-optimization with the X ilinx V ivado® Design Suite, the UltraScale architecture provides massive routing capacity while intelligently resolving typical bottlenecks in ways never before possible. This design synergy achieves greater than 90% utilization with no performance degradation. Some of the UltraScale architecture breakthroughs include: • Strategic placement (virtually anywhere on the die) of ASIC-like system clocks, reducing clock skew by up to 50% • Latency-producing pipelining is virtually unnecessary in systems with massively parallel bus architecture, increasing system speed and capability • Potential timing-closure problems and interconnect bottlenecks are eliminated, even in systems requiring 90% or more resource utilization • 3D IC integration makes it possible to build larger devices one process generation ahead of the current industr y standard • Greatly increased system performance, including multi-gigabit serial transceivers, I/O, and memor y bandwidth is available within even smaller system power budgets • Greatly enhanced DSP and packet handling The Xilinx UltraScale architecture opens up whole new dimensions for designers of ultra-high-capacity solutions.
標簽： UltraScale Xilinx 架構
上傳時間： 2013-11-13
上傳用戶：瓦力瓦力hong
This white paper discusses how market trends, the need for increased productivity, and new legislation have accelerated the use of safety systems in industrial machinery. This TÜV-qualified FPGA design methodology is changing the paradigms of safety designs and will greatly reduce development effort, system complexity, and time to market. This allows FPGA users to design their own customized safety controllers and provides a significant competitive advantage over traditional microcontroller or ASIC-based designs. Introduction The basic motivation of deploying functional safety systems is to ensure safe operation as well as safe behavior in cases of failure. Examples of functional safety systems include train brakes, proximity sensors for hazardous areas around machines such as fast-moving robots, and distributed control systems in process automation equipment such as those used in petrochemical plants. The International Electrotechnical Commission’s standard, IEC 61508: “Functional safety of electrical/electronic/programmable electronic safety-related systems,” is understood as the standard for designing safety systems for electrical, electronic, and programmable electronic (E/E/PE) equipment. This standard was developed in the mid-1980s and has been revised several times to cover the technical advances in various industries. In addition, derivative standards have been developed for specific markets and applications that prescribe the particular requirements on functional safety systems in these industry applications. Example applications include process automation (IEC 61511), machine automation (IEC 62061), transportation (railway EN 50128), medical (IEC 62304), automotive (ISO 26262), power generation, distribution, and transportation. 圖Figure 1. Local Safety System
上傳時間： 2013-11-05
上傳用戶：維子哥哥
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
上傳時間： 2013-10-22
上傳用戶：ztj182002
Design techniques for electronic systems areconstantly changing. In industries at the heart of thedigital revolution, this change is especially acute.Functional integration, dramatic increases incomplexity, new standards and protocols, costconstraints, and increased time-to-market pressureshave bolstered both the design challenges and theopportunities to develop modern electronic systems.One trend driving these changes is the increasedintegration of core logic with previously discretefunctions to achieve higher performance and morecompact board designs.
上傳時間： 2014-12-28
上傳用戶：康郎
Prakash Rashinkar has over 15 years experience in system design and verificationof embedded systems for communication satellites, launch vehicles and spacecraftground systems, high-performance computing, switching, multimedia, and wirelessapplications. Prakash graduated with an MSEE from Regional Engineering College,Warangal, in India. He lead the team that was responsible for delivering themethodologies for SOC verification at Cadence Design Systems. Prakash is anactive member of the VSIA Functional Verification DWG. He is currently Architectin the Vertical Markets and Design Environments Group at Cadence.
上傳時間： 2014-01-24
上傳用戶：xinhaoshan2016
This document provides an overview of the MPC8313E PowerQUICC™II Pro processor features, including a block diagram showing the major functional components.
標簽： PowerQUICC 8313E 8313 MPC
上傳時間： 2013-11-20
上傳用戶：myworkpost
在研究傳統家用燃氣報警器的基礎上，以ZigBee協議為平臺，構建mesh網狀網絡實現網絡化的智能語音報警系統。由于傳感器本身的溫度和實際環境溫度的影響，傳感器標定后采用軟件補償方法。為了減少系統費用，前端節點采用半功能節點設備，路由器和協調器采用全功能節點設備，構建mesh網絡所形成的家庭內部報警系統，通過通用的電話接口連接到外部的公用電話網絡，啟動語音模塊進行報警。實驗結果表明，在2.4 GHz頻率下傳輸，有墻等障礙物的情況下，節點的傳輸距離大約為35 m，能夠滿足家庭需要，且系統工作穩定，但在功耗方面仍需進一步改善。 Abstract: On the basis of studying traditional household gas alarm system, this paper proposed the platform for the ZigBee protocol，and constructed mesh network to achieve network-based intelligent voice alarm system. Because of the sensor temperature and the actual environment temperature, this system design used software compensation after calibrating sensor. In order to reduce system cost, semi-functional node devices were used as front-end node, however, full-function devices were used as routers and coordinator，constructed alarm system within the family by building mesh network，connected to the external public telephone network through the common telephone interface, started the voice alarm module. The results indicate that nodes transmit about 35m in the distance in case of walls and other obstacles by 2.4GHz frequency transmission, this is able to meet family needs and work steadily, but still needs further improvement in power consumption.
上傳時間： 2013-10-30
上傳用戶：swaylong
同步技術是跳頻通信系統的關鍵技術之一，尤其是在快速跳頻通信系統中，常規跳頻通信通過同步字頭攜帶相關碼的方法來實現同步，但對于快跳頻來說，由于是一跳或者多跳傳輸一個調制符號，難以攜帶相關碼。對此引入雙跳頻圖案方法，提出了一種適用于快速跳頻通信系統的同步方案。采用短碼攜帶同步信息，克服了快速跳頻難以攜帶相關碼的困難。分析了同步性能，仿真結果表明該方案同步時間短、虛警概率低、捕獲概率高，同步性能可靠。 Abstract: Synchronization is one of the key techniques to frequency-hopping communication system， especially in the fast frequency hopping communication system. In conventional frequency hopping communication systems， synchronization can be achieved by synchronization-head which can be used to carry the synchronization information， but for the fast frequency hopping， Because modulation symbol is transmitted by per hop or multi-hop， it is difficult to carry the correlation code. For the limitation of fast frequency hopping in carrying correlation code， a fast frequency-hopping synchronization scheme with two hopping patterns is proposed. The synchronization information is carried by short code， which overcomes the difficulty of correlation code transmission in fast frequency-hopping. The performance of the scheme is analyzed， and simulation results show that the scheme has the advantages of shorter synchronization time， lower probability of false alarm， higher probability of capture and more reliable of synchronization.
上傳時間： 2013-11-23
上傳用戶：mpquest
This errata sheet describes both the known functional problems and anydeviations from the electrical specifications known at the release date ofthis document.Each deviation is assigned a number and its history is tracked in a table atthe end of the document.
上傳時間： 2013-11-22
上傳用戶：liangliang123
This errata sheet describes both the known functional problems and anydeviations from the electrical specifications known at the release date ofthis document.Each deviation is assigned a number and its history is tracked in a table atthe end of the document.
上傳時間： 2014-12-31
上傳用戶：thuyenvinh
