This application note provides a detailed description of the Spartan™-3 configurationarchitecture. It explains the composition of the bitstream file and how this bitstream isinterpreted by the configuration LogIC to program the part. Additionally, a methodology ispresented that will guide the user through the readback process. This information can be usedfor partial reconfiguration or partial readback.
上傳時間： 2013-11-05
上傳用戶：透明的心情
Design techniques for electronic systems areconstantly changing. In industries at the heart of thedigital revolution, this change is especially acute.Functional integration, dramatic increases incomplexity, new standards and protocols, costconstraints, and increased time-to-market pressureshave bolstered both the design challenges and theopportunities to develop modern electronic systems.One trend driving these changes is the increasedintegration of core LogIC with previously discretefunctions to achieve higher performance and morecompact board designs.
上傳時間： 2014-12-28
上傳用戶：康郎
WP369可擴展式處理平臺-各種嵌入式系統的理想解決方案 ：Delivering unrivaled levels of system performance,flexibility, scalability, and integration to developers,Xilinx's architecture for a new Extensible Processing Platform is optimized for system power, cost, and size. Based on ARM's dual-core Cortex™-A9 MPCore processors and Xilinx’s 28 nm programmable LogIC,the Extensible Processing Platform takes a processor-centric approach by defining a comprehensive processor system implemented with standard design methods. This approach provides Software Developers a familiar programming environment within an optimized, full featured,powerful, yet low-cost, low-power processing platform.
上傳時間： 2013-10-22
上傳用戶：685
The Xilinx Zynq-7000 Extensible Processing Platform (EPP) redefines the possibilities for embedded systems, giving system and software architects and developers a flexible platform to launch their new solutions and traditional ASIC and ASSP users an alternative that aligns with today’s programmable imperative. The new class of product elegantly combines an industrystandard ARMprocessor-based system with Xilinx 28nm programmable LogIC—in a single device. The processor boots first, prior to configuration of the programmable LogIC. This, along with a streamlined workflow, saves time and effort and lets software developers and hardware designers start development simultaneously.
上傳時間： 2013-11-01
上傳用戶：dingdingcandy
XAPP520將符合2.5V和3.3V I/O標準的7系列FPGA高性能I/O Bank進行連接 The I/Os in Xilinx® 7 series FPGAs are classified as either high range (HR) or high performance (HP) banks. HR I/O banks can be operated from 1.2V to 3.3V, whereas HP I/O banks are optimized for operation between 1.2V and 1.8V. In circumstances that require an HP 1.8V I/O bank to interface with 2.5V or 3.3V LogIC, a range of options can be deployed. This application note describes methodologies for interfacing 7 series HP I/O banks with 2.5V and 3.3V systems
上傳時間： 2013-11-19
上傳用戶：yyyyyyyyyy
多遠程二極管溫度傳感器-Design Considerations for pc thermal management Multiple RDTS (remote diode temperature sensing) provides the most accurate method of sensing an IC’s junction temperature. It overcomes thermal gradient and placement issues encountered when trying to place external sensors. PCB component count decreases when using a device that provides multiple inputs.Better temperature sensing improves product performance and reliability. Disk drive data integrity suffers at elevated temperatures. IBM published an article stating that a 5°C rise in operating temperature causes a 15% increase in the drive’s failure rate. The overall performance of a system can be improved by providing a more accurate temperature measurement of the most critical devices allowing them to run just a few degrees hotter.The LM83 directly senses its own temperature and the temperature of three external PN junctions. One is dedicated to the CPU of choice, the other two go to other parts of your system that need thermal monitoring such as the disk drive or graphics chip. The SMBus-compatible LM83 supports SMBus timeout and LogIC levels. The LM83 has two interrupt outputs; one for user-programmable limits and WATCHDOG capability (INT), the other is a Critical Temperature Alarm output (T_CRIT_A) for system power supply shutdown.
標簽： Considerat Design 遠程 二極管
上傳時間： 2014-12-21
上傳用戶：ljd123456
This book is for students and Linux System Administrators. It provides the skills to read, write, and debug Linux shell scripts using bash shell. The book begins by describing Linux and simple scripts to automate frequently executed commands and continues by describing conditional LogIC, user interaction, loops, menus, traps, and functions.
上傳時間： 2014-12-30
上傳用戶：黃蛋的蛋黃
The NCV7356 is a physical layer device for a single wire data linkcapable of operating with various Carrier Sense Multiple Accesswith Collision Resolution (CSMA/CR) protocols such as the BoschController Area Network (CAN) version 2.0. This serial data linknetwork is intended for use in applications where high data rate is notrequired and a lower data rate can achieve cost reductions in both thephysical media components and in the microprocessor and/ordedicated LogIC devices which use the network.The network shall be able to operate in either the normal data ratemode or a high-speed data download mode for assembly line andservice data transfer operations. The high-speed mode is onlyintended to be operational when the bus is attached to an off-boardservice node. This node shall provide temporary bus electrical loadswhich facilitate higher speed operation. Such temporary loads shouldbe removed when not performing download operations.The bit rate for normal communications is typically 33 kbit/s, forhigh-speed transmissions like described above a typical bit rate of83 kbit/s is recommended. The NCV7356 features undervoltagelockout, timeout for faulty blocked input signals, output blankingtime in case of bus ringing and a very low sleep mode current.
上傳時間： 2013-10-24
上傳用戶：s藍莓汁
本書全面介紹基于 32 位ARM 架構嵌入式微處理器的軟、硬件系統的高級應用開發， 以Cirrus LogIC 的EP93XX（ARM920T 核）系列微處理器為基礎，包含EP93XX 的體系結 構特點、片內資源、軟硬件開發平臺、嵌入式操作系統移植及應用程序開發等內容，著重 強調了基于EP93XX 系統微處理器的硬件系統設計，嵌入式實時操作系統eCos 在EP93XX 系列微處理器上的移植及應用開發，嵌入式Linux 操作系統及應用程序開發，設備驅動程 序的開發等內容，最后以一個完整的系統開發說明嵌入式應用系統設計的一般流程。 全書內容以應用為出發點，內容詳盡，可作為 ARM 應用技術開發人員的參考用書， 以及高等院校相關專業的師生閱讀使用。
上傳時間： 2013-11-15
上傳用戶：lanhuaying
1.增加的設備支持： Atmel AT91SAM9Rxx Cirrus LogIC CS7401xx-IQZ Luminary Micro LM3S576x, LM3S5752, LM3S5747, LM3S573x, LM3S5662, LM3S5652, LM3S5632, LM3S3759, LM3S3749, and LM3S3739 NXP LPC32XX and LPC2460 STMicroelectronics STR912FAZ4X, STR912FAW4X, STR911FAW4X, STR911FAM4X, STR910FAW32, and STR910FAZ32 2.修改了NXP LPC23XX/24XX的頭文件庫 3.增加了ST-LINK II的調試支持 4.增加了對Cortex-M3 內核芯片的RTX Event Viewer 的支持 5.增加了MCBSTM32: STM32 FLASH OPTION BYTES PROGRAMMING 6.增加了ULINK2對Cortex-M3的SWV功能的調試 7.增強了使用GNU在MDK下調試M1,M3,ARM7,ARM9的調試功能（ Using μVision with CodeSourcery GNU ARM Toolchain.） 8.增加了大量經典開發板例程 Boards目錄列表： ├─Embest 深圳市英蓓特公司開發板例程 │ ├─AT91EB40X-40008 │ ├─S3CEB2410 │ ├─ATEBSAM7S │ ├─LPC22EB06-I │ ├─LPCEB2000-A │ ├─LPCEB2000-B │ ├─LPCEB2000-S │ ├─str710 │ ├─str711 │ ├─str730 │ ├─str750 │ ├─STR912 │ ├─STM32V100 │ ├─STM32R100 │ ├─ATEB9200 ├─ADI ADI半導體的芯片例程 │ ├─ADuC702X │ └─ADuC712x ├─Atmel Atmel半導體的芯片例程 │ ├─AT91RM9200-EK │ ├─AT91SAM7A3-EK │ ├─AT91SAM7S-EK │ ├─AT91SAM7SE-EK │ ├─AT91SAM7X-EK │ ├─AT91SAM9260-EK │ ├─AT91SAM9261-EK │ ├─AT91SAM9263-EK ├─Keil Keil公司的開發板例程 │ ├─MCB2100 │ ├─MCB2103 │ ├─MCB2130 │ ├─MCB2140 │ ├─MCB2300 │ ├─MCB2400 │ ├─MCB2900 │ ├─MCBLM3S │ ├─MCBSTM32 │ ├─MCBSTR7 │ ├─MCBSTR730 │ ├─MCBSTR750 │ └─MCBSTR9 ├─Luminary Luminary半導體公司的芯片例程 │ ├─ek-lm3s1968 │ ├─ek-lm3s3748 │ ├─ek-lm3s3768 │ ├─dk-lm3s101 │ ├─dk-lm3s102 │ ├─dk-lm3s301 │ ├─dk-lm3s801 │ ├─dk-lm3s811 │ ├─dk-lm3s815 │ ├─dk-lm3s817 │ ├─dk-lm3s818 │ ├─dk-lm3s828 │ ├─ek-lm3s2965 │ ├─ek-lm3s6965 │ ├─ek-lm3s811 │ └─ek-lm3s8962 ├─NXP NXP半導體公司的芯片例程 │ ├─LH79524 │ ├─LH7A404 │ └─SJA2510 ├─OKI OKI半導體公司的芯片例程 │ ├─ML674000 │ ├─ML67Q4003 │ ├─ML67Q4051 │ ├─ML67Q4061 │ ├─ML67Q5003 │ └─ML69Q6203 ├─Samsung Samsung半導體公司的芯片例程 │ ├─S3C2440 │ ├─S3C44001 │ └─S3F4A0K ├─ST ST半導體公司的芯片例程 │ ├─CQ-STARM2 │ ├─EK-STM32F │ ├─STM32F10X_EVAL │ ├─STR710 │ ├─STR730 │ ├─STR750 │ ├─STR910 │ └─STR9_DONGLE ├─TI TI半導體公司的芯片例程 │ ├─TMS470R1A256 │ └─TMS470R1B1M ├─Winbond Winbond半導體公司的芯片例程 │ └─W90P710 └─ ...
上傳時間： 2013-10-13
上傳用戶：zhangliming420
