Applying power to a standard logic chip, SRAM, or EPROM, usually results in output pinstracking the applied voltage as it rises. Programmable logic attempts to emulate that behavior,but physics forbids perfect emulation, due to the device programmability. It requires care tospecify the pin behavior, because programmable parts encounter unknown variables – yourdesign and your power environment.
標(biāo)簽： Xilinx XAPP CPLD 440
上傳時間： 2013-11-24
上傳用戶：253189838
Today’s digital systems combine a myriad of chips with different voltage configurations.Designers must interface 2.5V processors with 3.3V memories—both RAM and ROM—as wellas 5V buses and multiple peripheral chips. Each chip has specific power supply needs. CPLDsare ideal for handling the multi-voltage interfacing, but do require forethought to ensure correctoperation.
上傳時間： 2013-11-10
上傳用戶：yy_cn
本文利用Verilog HDL 語言自頂向下的設(shè)計(jì)方法設(shè)計(jì)多功能數(shù)字鐘，突出了其作為硬件描述語言的良好的可讀性、可移植性和易理解等優(yōu)點(diǎn)，并通過Altera QuartusⅡ 4.1 和ModelSim SE 6.0 完成綜合、仿真。此程序通過下載到FPGA 芯片后，可應(yīng)用于實(shí)際的數(shù)字鐘顯示中。 關(guān)鍵詞：Verilog HDL；硬件描述語言；FPGA Abstract: In this paper, the process of designing multifunctional digital clock by the Verilog HDL top-down design method is presented, which has shown the readability, portability and easily understanding of Verilog HDL as a hard description language. Circuit synthesis and simulation are performed by Altera QuartusⅡ 4.1 and ModelSim SE 6.0. The program can be used in the truly digital clock display by downloading to the FPGA chip. Keywords: Verilog HDL；hardware description language；FPGA
標(biāo)簽： Verilog HDL 多功能 數(shù)字
上傳時間： 2013-11-10
上傳用戶：hz07104032
解壓密碼：www.elecfans.com 隨著微電子技術(shù)的迅速發(fā)展以及集成電路規(guī)模不斷提高，對電路性能的設(shè)計(jì) 要求越來越嚴(yán)格，這勢必對用于大規(guī)模集成電路設(shè)計(jì)的EDA 工具提出越來越高的 要求。自1972 年美國加利福尼亞大學(xué)柏克萊分校電機(jī)工程和計(jì)算機(jī)科學(xué)系開發(fā) 的用于集成電路性能分析的電路模擬程序SPICE（Simulation Program with IC Emphasis）誕生以來，為適應(yīng)現(xiàn)代微電子工業(yè)的發(fā)展，各種用于集成電路設(shè)計(jì)的 電路模擬分析工具不斷涌現(xiàn)。HSPICE 是Meta-Software 公司為集成電路設(shè)計(jì)中 的穩(wěn)態(tài)分析，瞬態(tài)分析和頻域分析等電路性能的模擬分析而開發(fā)的一個商業(yè)化通 用電路模擬程序，它在柏克萊的SPICE（1972 年推出），MicroSim公司的PSPICE （1984 年推出）以及其它電路分析軟件的基礎(chǔ)上，又加入了一些新的功能，經(jīng) 過不斷的改進(jìn)，目前已被許多公司、大學(xué)和研究開發(fā)機(jī)構(gòu)廣泛應(yīng)用。HSPICE 可 與許多主要的EDA 設(shè)計(jì)工具，諸如Candence,Workview 等兼容，能提供許多重要 的針對集成電路性能的電路仿真和設(shè)計(jì)結(jié)果。采用HSPICE 軟件可以在直流到高 于100MHz 的微波頻率范圍內(nèi)對電路作精確的仿真、分析和優(yōu)化。在實(shí)際應(yīng)用中， HSPICE能提供關(guān)鍵性的電路模擬和設(shè)計(jì)方案，并且應(yīng)用HSPICE進(jìn)行電路模擬時， 其電路規(guī)模僅取決于用戶計(jì)算機(jī)的實(shí)際存儲器容量。 The HSPICE Integrator Program enables qualified EDA vendors to integrate their products with the de facto standard HSPICE simulator, HSPICE RF simulator, and WaveView Analyzer™. In addition, qualified HSPICE Integrator Program members have access to HSPICE integrator application programming interfaces (APIs). Collaboration between HSPICE Integrator Program members will enable customers to achieve more thorough design verification in a shorter period of time from the improvements offered by inter-company EDA design solutions.
標(biāo)簽： download hspice 2007
上傳時間： 2013-10-18
上傳用戶：s363994250
This document provides practical, common guidelines for incorporating PCI Express interconnect layouts onto Printed Circuit Boards (PCB) ranging from 4-layer desktop baseboard designs to 10- layer or more server baseboard designs. Guidelines and constraints in this document are intended for use on both baseboard and add-in card PCB designs. This includes interconnects between PCI Express devices located on the same baseboard (chip-to-chip routing) and interconnects between a PCI Express device located “down” on the baseboard and a device located “up” on an add-in card attached through a connector. This document is intended to cover all major components of the physical interconnect including design guidelines for the PCB traces, vias and AC coupling capacitors, as well as add-in card edge-finger and connector considerations. The intent of the guidelines and examples is to help ensure that good high-speed signal design practices are used and that the timing/jitter and loss/attenuation budgets can also be met from end-to-end across the PCI Express interconnect. However, while general physical guidelines and suggestions are given, they may not necessarily guarantee adequate performance of the interconnect for all layouts and implementations. Therefore, designers should consider modeling and simulation of the interconnect in order to ensure compliance to all applicable specifications. The document is composed of two main sections. The first section provides an overview of general topology and interconnect guidelines. The second section concentrates on physical layout constraints where bulleted items at the beginning of a topic highlight important constraints, while the narrative that follows offers additional insight.
標(biāo)簽： pci PCB 設(shè)計(jì)規(guī)范
上傳時間： 2014-01-24
上傳用戶：s363994250
半導(dǎo)體的產(chǎn)品很多，應(yīng)用的場合非常廣泛，圖一是常見的幾種半導(dǎo)體元件外型。半導(dǎo)體元件一般是以接腳形式或外型來劃分類別，圖一中不同類別的英文縮寫名稱原文為 PDID：Plastic Dual Inline Package SOP：Small Outline Package SOJ：Small Outline J-Lead Package PLCC：Plastic Leaded Chip Carrier QFP：Quad Flat Package PGA：Pin Grid Array BGA：Ball Grid Array 雖然半導(dǎo)體元件的外型種類很多，在電路板上常用的組裝方式有二種，一種是插入電路板的銲孔或腳座，如PDIP、PGA，另一種是貼附在電路板表面的銲墊上，如SOP、SOJ、PLCC、QFP、BGA。 從半導(dǎo)體元件的外觀，只看到從包覆的膠體或陶瓷中伸出的接腳，而半導(dǎo)體元件真正的的核心，是包覆在膠體或陶瓷內(nèi)一片非常小的晶片，透過伸出的接腳與外部做資訊傳輸。圖二是一片EPROM元件，從上方的玻璃窗可看到內(nèi)部的晶片，圖三是以顯微鏡將內(nèi)部的晶片放大，可以看到晶片以多條銲線連接四周的接腳，這些接腳向外延伸並穿出膠體，成為晶片與外界通訊的道路。請注意圖三中有一條銲線從中斷裂，那是使用不當(dāng)引發(fā)過電流而燒毀，致使晶片失去功能，這也是一般晶片遭到損毀而失效的原因之一。 圖四是常見的LED，也就是發(fā)光二極體，其內(nèi)部也是一顆晶片，圖五是以顯微鏡正視LED的頂端，可從透明的膠體中隱約的看到一片方型的晶片及一條金色的銲線，若以LED二支接腳的極性來做分別，晶片是貼附在負(fù)極的腳上，經(jīng)由銲線連接正極的腳。當(dāng)LED通過正向電流時，晶片會發(fā)光而使LED發(fā)亮，如圖六所示。 半導(dǎo)體元件的製作分成兩段的製造程序，前一段是先製造元件的核心─晶片，稱為晶圓製造；後一段是將晶中片加以封裝成最後產(chǎn)品，稱為IC封裝製程，又可細(xì)分成晶圓切割、黏晶、銲線、封膠、印字、剪切成型等加工步驟，在本章節(jié)中將簡介這兩段的製造程序。
上傳時間： 2013-11-04
上傳用戶：372825274
The power of programmability gives industrial automation designers a highly efficient， cost-effective alternative to traditional motor control units （MCUs）。 The parallel-processing power， fast computational speeds， and connectivity versatility of Xilinx® FPGAs can accelerate the implementation of advanced motor control algorithms such as Field Oriented Control （FOC）。 Additionally， Xilinx devices lower costs with greater on-chip integration of system components and shorten latencies with high-performance digital signal processing （DSP） that can tackle compute-intensive functions such as PID Controller， Clark/Park transforms， and Space Vector PWM. The Xilinx Spartan®-6 FPGA Motor Control Development Kit gives designers an ideal starting point for evaluating time-saving， proven， motor-control reference designs. The kit also shortens the process of developing custom control capabilities， with integrated peripheral functions （Ethernet， PowerLink， and PCI® Express）， a motor-control FPGA mezzanine card （FMC） with built-in Texas Instruments motor drivers and high-precision Delta-Sigma modulators， and prototyping support for evaluating alternative front-end circuitry.
標(biāo)簽： 賽靈思 電機(jī)控制 開發(fā)套件 英文
上傳時間： 2013-10-28
上傳用戶：wujijunshi
利用EZ-USB接口芯片AN2131Q實(shí)現(xiàn)了基于TMS320C5409的水聲信號采集及混沌特性研究系統(tǒng)中的高速數(shù)據(jù)通信，提出了一種采用FIFO緩存芯片實(shí)現(xiàn)AN2131Q與TMS320C5409的連接方法，深入研究了EZ-USB序列接口芯片的固件、設(shè)備驅(qū)動和用戶程序開發(fā)過程。關(guān)鍵詞：AN2131Q; TMS320C5409; IDT72V02；數(shù)據(jù)通信ABSTRACT: Using AN2131Q as the control chip, the communication between DSP and PC in the underwater acoustic signal acquisition and chaotic characteristics study system is realized. The method is proposed that using FIFO to realize the connectivity between AN2131Q and TMS320C5409. The development of programming Firmware、device driver and user application are thoroughly researched.Key words: AN2131Q; TMS320C5409; IDT72V02; data communication
標(biāo)簽： EZ-USB 數(shù)據(jù)傳輸 接口設(shè)計(jì)
上傳時間： 2014-04-03
上傳用戶：hahayou
This book introduces embedded systems to C and C++ programmers. Topics include testing memory devices, writing and erasing Flash memory, verifying nonvolatile memory contents, controlling on-chip peripherals, device driver design and implementation, optimizing embedded code for size and speed, and making the most of C++ without a performance penalty. Pages : 336 Slots : 1
標(biāo)簽： programmers introduces embedded include
上傳時間： 2013-12-10
上傳用戶：shizhanincc
yright 2002 Cygnal Integrated Products, Inc. // // Filename: LIION_BC_MAIN.c // Target Device: 8051F300 // Created: 11 SEP 2002 // Created By: DKC // Tool chain: KEIL Eval C51 // // This is a stand alone battery charger for a Lithium ION battery. // It utilizes a buck converter, controlled by the on-chip 8-bit PWM, // to provide constant current followed by constant voltage battery charge.
標(biāo)簽： LIION_BC_MAIN Integrated Filename Products
上傳時間： 2013-12-23
上傳用戶：牧羊人8920
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