2007 Release Highlight CN高速電路設計。
上傳時間： 2013-11-22
上傳用戶：467368609
2005SP2 Release Highlight CN，高速電路設計
標簽： Highlight Release 2005 SP2
上傳時間： 2013-11-23
上傳用戶：r5100
2007 Release Highlight CN高速電路設計。
上傳時間： 2013-11-22
上傳用戶：fanboynet
2005SP2 Release Highlight CN，高速電路設計
標簽： Highlight Release 2005 SP2
上傳時間： 2013-11-05
上傳用戶：caoyuanyuan1818
Highlight TRUE #define NOHighlight FALSE #define UPDATE TRUE #define NOUPDATE FALSE #define FORMAT TRUE #define NOFORMAT FALSE #define LEFT 0
標簽： define FALSE TRUE NOHighlight
上傳時間： 2013-12-15
上傳用戶：xwd2010
Highlight TRUE #define NOHighlight FALSE #define UPDATE TRUE #define NOUPDATE FALSE #define FORMAT TRUE #define NOFORMAT FALSE #define LEFT 0
標簽： define FALSE TRUE NOHighlight
上傳時間： 2013-12-10
上傳用戶：alan-ee
Highlight TRUE #define NOHighlight FALSE #define UPDATE TRUE #define NOUPDATE FALSE #define FORMAT TRUE #define NOFORMAT FALSE #define LEFT 0
標簽： define FALSE TRUE NOHighlight
上傳時間： 2015-07-22
上傳用戶：hopy
</div> <br> <input type="button" value="閃爍" onclick="Highlight($( demo ))" /> <input type="button" value="停止" onclick="stopTwinkle($( demo ))" /> <br> <br> <div id="demo2" class="box"> Box II </div> <br> <input type="button" value="閃爍" onclick="Highlight($( demo2 ))" /> <input type="button" value="停止" onclick="stopTwinkle($( demo2 ))" />
上傳時間： 2013-12-07
上傳用戶：蟲蟲蟲蟲蟲蟲
This document provides practical, common guidelines for incorporating PCI Express interconnect layouts onto Printed Circuit Boards (PCB) ranging from 4-layer desktop baseboard designs to 10- layer or more server baseboard designs. Guidelines and constraints in this document are intended for use on both baseboard and add-in card PCB designs. This includes interconnects between PCI Express devices located on the same baseboard (chip-to-chip routing) and interconnects between a PCI Express device located “down” on the baseboard and a device located “up” on an add-in card attached through a connector. This document is intended to cover all major components of the physical interconnect including design guidelines for the PCB traces, vias and AC coupling capacitors, as well as add-in card edge-finger and connector considerations. The intent of the guidelines and examples is to help ensure that good high-speed signal design practices are used and that the timing/jitter and loss/attenuation budgets can also be met from end-to-end across the PCI Express interconnect. However, while general physical guidelines and suggestions are given, they may not necessarily guarantee adequate performance of the interconnect for all layouts and implementations. Therefore, designers should consider modeling and simulation of the interconnect in order to ensure compliance to all applicable specifications. The document is composed of two main sections. The first section provides an overview of general topology and interconnect guidelines. The second section concentrates on physical layout constraints where bulleted items at the beginning of a topic Highlight important constraints, while the narrative that follows offers additional insight.
上傳時間： 2013-10-15
上傳用戶：busterman
This document provides practical, common guidelines for incorporating PCI Express interconnect layouts onto Printed Circuit Boards (PCB) ranging from 4-layer desktop baseboard designs to 10- layer or more server baseboard designs. Guidelines and constraints in this document are intended for use on both baseboard and add-in card PCB designs. This includes interconnects between PCI Express devices located on the same baseboard (chip-to-chip routing) and interconnects between a PCI Express device located “down” on the baseboard and a device located “up” on an add-in card attached through a connector. This document is intended to cover all major components of the physical interconnect including design guidelines for the PCB traces, vias and AC coupling capacitors, as well as add-in card edge-finger and connector considerations. The intent of the guidelines and examples is to help ensure that good high-speed signal design practices are used and that the timing/jitter and loss/attenuation budgets can also be met from end-to-end across the PCI Express interconnect. However, while general physical guidelines and suggestions are given, they may not necessarily guarantee adequate performance of the interconnect for all layouts and implementations. Therefore, designers should consider modeling and simulation of the interconnect in order to ensure compliance to all applicable specifications. The document is composed of two main sections. The first section provides an overview of general topology and interconnect guidelines. The second section concentrates on physical layout constraints where bulleted items at the beginning of a topic Highlight important constraints, while the narrative that follows offers additional insight.
上傳時間： 2014-01-24
上傳用戶：s363994250
