All inputs of the C16x family have Schmitt-Trigger input characteristics. These Schmitt-Triggers are intended to always provide proper internal low and high levels, even if anundefined voltage level (between TTL-VIL and TTL-VIH) is externally applied to the pin.The hysteresis of these inputs, however, is very small, and can not be properly used in anapplication to suppress signal noise, and to shape slow rising/falling input transitions.Thus, it must be taken care that rising/falling input signals pass the undefined area of theTTL-specification between VIL and VIH with a sufficient rise/fall time, as generally usualand specified for TTL components (e.g. 74LS series: gates 1V/us, clock inputs 20V/us).The effect of the implemented Schmitt-Trigger is that even if the input signal remains inthe undefined area, well defined low/high levels are generated internally. Note that allinput signals are evaluated at specific sample points (depending on the input and theperipheral function connected to it), at that signal transitions are detected if twoconsecutive samples show different levels. Thus, only the current level of an input signalat these sample points is relevant, that means, the necessary rise/fall times of the inputsignal is only dependant on the sample rate, that is the distance in time between twoconsecutive evaluation time points. If an input signal, for instance, is sampled throughsoftware every 10us, it is irrelevant, which input level would be seen between thesamples. Thus, it would be allowable for the signal to take 10us to pass through theundefined area. Due to the sample rate of 10us, it is assured that only one sample canoccur while the signal is within the undefined area, and no incorrect transition will bedetected. For inputs which are connected to a peripheral function, e.g. capture inputs, thesample rate is determined by the clock cycle of the peripheral unit. In the case of theCAPCOM unit this means a sample rate of 400ns @ 20MHz CPU clock. This requiresinput signals to pass through the undefined area within these 400ns in order to avoidmultiple capture events.
標(biāo)簽： C16x 微控制器 輸入信號(hào) 時(shí)序圖
上傳時(shí)間： 2014-04-02
上傳用戶：han_zh
中文版詳情瀏覽：http://www.elecfans.com/emb/fpga/20130715324029.html Xilinx UltraScale:The Next-Generation Architecture for Your Next-Generation Architecture The Xilinx® UltraScale™ architecture delivers unprecedented levels of integration and capability with ASIC-class system- level performance for the most demanding applications. The UltraScale architecture is the industr y's f irst application of leading-edge ASIC architectural enhancements in an All Programmable architecture that scales from 20 nm planar through 16 nm FinFET technologies and beyond, in addition to scaling from monolithic through 3D ICs. Through analytical co-optimization with the X ilinx V ivado® Design Suite, the UltraScale architecture provides massive routing capacity while intelligently resolving typical bottlenecks in ways never before possible. This design synergy achieves greater than 90% utilization with no performance degradation. Some of the UltraScale architecture breakthroughs include: • Strategic placement (virtually anywhere on the die) of ASIC-like system clocks, reducing clock skew by up to 50% • Latency-producing pipelining is virtually unnecessary in systems with massively parallel bus architecture, increasing system speed and capability • Potential timing-closure problems and interconnect bottlenecks are eliminated, even in systems requiring 90% or more resource utilization • 3D IC integration makes it possible to build larger devices one process generation ahead of the current industr y standard • Greatly increased system performance, including multi-gigabit serial transceivers, I/O, and memor y bandwidth is available within even smaller system power budgets • Greatly enhanced DSP and packet handling The Xilinx UltraScale architecture opens up whole new dimensions for designers of ultra-high-capacity solutions.
標(biāo)簽： UltraScale Xilinx 架構(gòu)
上傳時(shí)間： 2013-11-13
上傳用戶：瓦力瓦力hong
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
上傳時(shí)間： 2013-10-22
上傳用戶：ztj182002
FPGAs have changed dramatically since Xilinx first introduced them just 15 years ago. In thepast, FPGA were primarily used for prototyping and lower volume applications; custom ASICswere used for high volume, cost sensitive designs. FPGAs had also been too expensive and tooslow for many applications, let alone for System Level Integration (SLI). Plus, the development
標(biāo)簽： Methodology Design Reuse FPGA
上傳時(shí)間： 2013-10-23
上傳用戶：旗魚(yú)旗魚(yú)
Abstract: This reference design provides design ideas for a cost-effective, low-power liquid-level measurement dataacquisition system (DAS) using a compensated silicon pressure sensor and a high-precision delta-sigma ADC. Thisdocument discusses how to select the compensated silicon pressure sensor, suggest system algorithms, and providenoise analyses. It also describes calibration ideas to improve system performance while also reducing complexity andcost.
上傳時(shí)間： 2013-10-08
上傳用戶：sjy1991
針對(duì)UHF讀寫(xiě)器設(shè)計(jì)中，在符合EPC Gen2標(biāo)準(zhǔn)的情況下，對(duì)標(biāo)簽返回的高速數(shù)據(jù)進(jìn)行正確解碼以達(dá)到正確讀取標(biāo)簽的要求，提出了一種新的在ARM平臺(tái)下采用邊沿捕獲統(tǒng)計(jì)定時(shí)器數(shù)判斷數(shù)據(jù)的方法，并對(duì)FM0編碼進(jìn)行解碼。與傳統(tǒng)的使用定時(shí)器定時(shí)采樣高低電平的FM0解碼方法相比，該解碼方法可以減少定時(shí)器定時(shí)誤差累積的影響；可以將捕獲定時(shí)器數(shù)中斷與數(shù)據(jù)判斷解碼相對(duì)分隔開(kāi)，使得中斷對(duì)解碼影響很小，實(shí)現(xiàn)捕獲與解碼的同步。通過(guò)實(shí)驗(yàn)表明，這種方法提高了解碼的效率，在160 Kb/s的接收速度下，讀取一張標(biāo)簽的時(shí)間約為30次/s。 Abstract: Aiming at the requirement of receiving correctly decoded data from the tag under high-speed communication which complied with EPC Gen2 standard in the design of UHF interrogator， the article introduced a new technology for FM0 decoding which counted the timer counter to judge data by using the edge interval of signal capture based on the ARM7 platform. Compared with the traditional FM0 decoding method which used the timer timed to sample the high and low level， the method could reduce the accumulation of timing error and could relatively separate capture timer interrupt and the data judgment for decoding， so that the disruption effect on the decoding was small and realizd synchronization of capture and decoding. Testing result shows that the method improves the efficiency of decoding， at 160 Kb/s receiving speed， the time of the interrogator to read a tag is about 30 times/s.
標(biāo)簽： UHF FM0 讀寫(xiě)器 解碼技術(shù)
上傳時(shí)間： 2013-11-10
上傳用戶：liufei
中文版詳情瀏覽：http://www.elecfans.com/emb/fpga/20130715324029.html Xilinx UltraScale:The Next-Generation Architecture for Your Next-Generation Architecture The Xilinx® UltraScale™ architecture delivers unprecedented levels of integration and capability with ASIC-class system- level performance for the most demanding applications. The UltraScale architecture is the industr y's f irst application of leading-edge ASIC architectural enhancements in an All Programmable architecture that scales from 20 nm planar through 16 nm FinFET technologies and beyond, in addition to scaling from monolithic through 3D ICs. Through analytical co-optimization with the X ilinx V ivado® Design Suite, the UltraScale architecture provides massive routing capacity while intelligently resolving typical bottlenecks in ways never before possible. This design synergy achieves greater than 90% utilization with no performance degradation. Some of the UltraScale architecture breakthroughs include: • Strategic placement (virtually anywhere on the die) of ASIC-like system clocks, reducing clock skew by up to 50% • Latency-producing pipelining is virtually unnecessary in systems with massively parallel bus architecture, increasing system speed and capability • Potential timing-closure problems and interconnect bottlenecks are eliminated, even in systems requiring 90% or more resource utilization • 3D IC integration makes it possible to build larger devices one process generation ahead of the current industr y standard • Greatly increased system performance, including multi-gigabit serial transceivers, I/O, and memor y bandwidth is available within even smaller system power budgets • Greatly enhanced DSP and packet handling The Xilinx UltraScale architecture opens up whole new dimensions for designers of ultra-high-capacity solutions.
標(biāo)簽： UltraScale Xilinx 架構(gòu)
上傳時(shí)間： 2013-11-21
上傳用戶：wxqman
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
上傳時(shí)間： 2013-11-21
上傳用戶：不懂夜的黑
FPGAs have changed dramatically since Xilinx first introduced them just 15 years ago. In thepast, FPGA were primarily used for prototyping and lower volume applications; custom ASICswere used for high volume, cost sensitive designs. FPGAs had also been too expensive and tooslow for many applications, let alone for System Level Integration (SLI). Plus, the development
標(biāo)簽： Methodology Design Reuse FPGA
上傳時(shí)間： 2013-11-01
上傳用戶：shawvi
The revolution of automation on factory floors is a key driver for the seemingly insatiable demand for higher productivity， lower total cost of ownership，and high safety. As a result， industrial applications drive an insatiable demand of higher data bandwidth and higher system-level performance. This white paper describes the trends and challenges seen by designers and how FPGAs enable solutions to meet their stringent design goals.
標(biāo)簽： xilinx FPGAs 工業(yè) 中的應(yīng)用
上傳時(shí)間： 2013-11-08
上傳用戶：yan2267246
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