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Convection

  • % A 2D homogeneous Convection-diffusion case (u=exp(-ex*deta*x-ex*deta*y) with a square with % all

    % A 2D homogeneous Convection-diffusion case (u=exp(-ex*deta*x-ex*deta*y) with a square with % all Dirichlet boundary, note that reaction coefficient is not zero % by indirect BKM

    標(biāo)簽: Convection-diffusion deta with homogeneous

    上傳時間: 2016-01-03

    上傳用戶:CHINA526

  • Computtional Fluid Dynamics (CFD) steady 1-Dimensional Convection and diffusion using central diff

    Computtional Fluid Dynamics (CFD) steady 1-Dimensional Convection and diffusion using central differencing, upwind differencing, hybrid differencing and power law schemes, programmed in MATLAB

    標(biāo)簽: Computtional Dimensional Convection diffusion

    上傳時間: 2014-01-09

    上傳用戶:changeboy

  • Free Convection Past a Vertical Flat Plate

    Free Convection Past a Vertical Flat Plate

    標(biāo)簽: Convection Vertical Plate Free

    上傳時間: 2013-12-15

    上傳用戶:大三三

  • 開關(guān)電源EMI設(shè)計(英文版)

    Integrated EMI/Thermal Design forSwitching Power SuppliesWei ZhangThesis submitted to the Faculty of theVirginia Polytechnic Institute and State Universityin partial fulfillment of the requirements for the degree of Integrated EMI/Thermal Design forSwitching Power SuppliesWei Zhang(ABSTRACT)This work presents the modeling and analysis of EMI and thermal performancefor switch power supply by using the CAD tools. The methodology and design guidelinesare developed.By using a boost PFC circuit as an example, an equivalent circuit model is builtfor EMI noise prediction and analysis. The parasitic elements of circuit layout andcomponents are extracted analytically or by using CAD tools. Based on the model, circuitlayout and magnetic component design are modified to minimize circuit EMI. EMI filtercan be designed at an early stage without prototype implementation.In the second part, thermal analyses are conducted for the circuit by using thesoftware Flotherm, which includes the mechanism of conduction, Convection andradiation. Thermal models are built for the components. Thermal performance of thecircuit and the temperature profile of components are predicted. Improved thermalmanagement and winding arrangement are investigated to reduce temperature.In the third part, several circuit layouts and inductor design examples are checkedfrom both the EMI and thermal point of view. Insightful information is obtained.

    標(biāo)簽: EMI 開關(guān)電源 英文

    上傳時間: 2013-11-10

    上傳用戶:1595690

  • SKS-100 Single Output Switchin

    Features:   High efficiency, high reliability, low cost  AC input range selected by switch  100% full load burn-in test  Protections: Short circuit / Over load  Fixed switching frequency at 25KHz  Cooling by free air Convection  1 year warranty   Dimensions: 199*98*38mm (L*W*H)    

    標(biāo)簽: Switchin Output Single SKS

    上傳時間: 2013-10-30

    上傳用戶:taa123456

  • 開關(guān)電源EMI設(shè)計(英文版)

    Integrated EMI/Thermal Design forSwitching Power SuppliesWei ZhangThesis submitted to the Faculty of theVirginia Polytechnic Institute and State Universityin partial fulfillment of the requirements for the degree of Integrated EMI/Thermal Design forSwitching Power SuppliesWei Zhang(ABSTRACT)This work presents the modeling and analysis of EMI and thermal performancefor switch power supply by using the CAD tools. The methodology and design guidelinesare developed.By using a boost PFC circuit as an example, an equivalent circuit model is builtfor EMI noise prediction and analysis. The parasitic elements of circuit layout andcomponents are extracted analytically or by using CAD tools. Based on the model, circuitlayout and magnetic component design are modified to minimize circuit EMI. EMI filtercan be designed at an early stage without prototype implementation.In the second part, thermal analyses are conducted for the circuit by using thesoftware Flotherm, which includes the mechanism of conduction, Convection andradiation. Thermal models are built for the components. Thermal performance of thecircuit and the temperature profile of components are predicted. Improved thermalmanagement and winding arrangement are investigated to reduce temperature.In the third part, several circuit layouts and inductor design examples are checkedfrom both the EMI and thermal point of view. Insightful information is obtained.

    標(biāo)簽: EMI 開關(guān)電源 英文

    上傳時間: 2013-11-16

    上傳用戶:萍水相逢

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