This application note describes how to retrieve user-defined data from Xilinx configurationPROMs (XC18V00 and Platform Flash devices) after the same PROM has configured theFPGA. The method to add user-defined data to the configuration PROM file is also discussed.The reference design described in this application note can be used in any of the followingXilinx FPGA architectures: Spartan™-II, Spartan-IIE, Spartan-3, Virtex™, Virtex-E, Virtex-II,and Virtex-II Pro.
如果用戶現有的是 Protel99SE 。ProtelDXP，Protel2004 版本： 1 在powerpcb 軟件的中打開 PCB 文件，選擇導出 ASCII 文件（export ascii file） ，ascii file 的版本應該選擇 3.5 及以下的版本。 2 a 在 Protel99SE 。ProtelDXP ， 選擇 File->Import->在出現的對話框中,選擇文件類型中的PADS Ascil Files (*.ASC)輸入對應文件即可 1.powerpcb-->export ascii file--->import ascii file with protel99 se sp5(u must install padsimportor that is an add-on for 99sesp5 which can downloan from protel company ). 2.powerpcb-->export ascii file-->import ascii file in orcad layout-->import max file(orcad pcb file)with protel 99 or 99se.
This document provides practical, common guidelines for incorporating PCI Express interconnect
layouts onto Printed Circuit Boards (PCB) ranging from 4-layer desktop baseboard designs to 10-
layer or more server baseboard designs. Guidelines and constraints in this document are intended
for use on both baseboard and add-in card PCB designs. This includes interconnects between PCI
Express devices located on the same baseboard (chip-to-chip routing) and interconnects between
a PCI Express device located “down” on the baseboard and a device located “up” on an add-in
card attached through a connector.
This document is intended to cover all major components of the physical interconnect including
design guidelines for the PCB traces, vias and AC coupling capacitors, as well as add-in card
edge-finger and connector considerations. The intent of the guidelines and examples is to help
ensure that good high-speed signal design practices are used and that the timing/jitter and
loss/attenuation budgets can also be met from end-to-end across the PCI Express interconnect.
However, while general physical guidelines and suggestions are given, they may not necessarily
guarantee adequate performance of the interconnect for all layouts and implementations.
Therefore, designers should consider modeling and simulation of the interconnect in order to
ensure compliance to all applicable specifications.
The document is composed of two main sections. The first section provides an overview of
general topology and interconnect guidelines. The second section concentrates on physical layout
constraints where bulleted items at the beginning of a topic highlight important constraints, while
the narrative that follows offers additional insight.
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