Recent advances in low voltage silicon germaniumand BiCMOS processes have allowed the design andproduction of very high speed amplifi ers. Because theprocesses are low voltage, most of the amplifi er designshave incorporated differential inputs and outputs to regainand maximize total output signal swing. Since many lowvoltageapplications are single-ended, the questions arise,“How can I use a differential I/O amplifi er in a single-endedapplication?” and “What are the implications of suchuse?” This Design Note addresses some of the practicalimplications and demonstrates specifi c single-endedapplications using the 3GHz gain-bandwidth LTC6406differential I/O amplifi er.
標(biāo)簽： 單端應(yīng)用 差分 放大器
上傳時(shí)間： 2013-11-23
上傳用戶：rocketrevenge
模擬轉(zhuǎn)換器性能不只依賴分辨率規(guī)格 大量的模數(shù)轉(zhuǎn)換器(ADC)使人們難以選擇最適合某種特定應(yīng)用的ADC器件。工程師們選擇ADC時(shí)，通常只注重位數(shù)、信噪比(SNR)、諧波性能，但是其它規(guī)格也同樣重要。本文將介紹ADC器件最易受到忽視的九項(xiàng)規(guī)格，并說明它們是如何影響ADC性能的。 1. SNR比分辨率更為重要。 ADC規(guī)格中最常見的是所提供的分辨率，其實(shí)該規(guī)格并不能表明ADC器件的任何能力。但可以用位數(shù)n來計(jì)算ADC的理論SNR： 不 過工程師也許并不知道，熱噪聲、時(shí)鐘抖動(dòng)、差分非線性(DNL)誤差以及其它參數(shù)異常都會(huì)限制ADC器件的SNR。對(duì)于高性能高分辨率轉(zhuǎn)換器尤其如此。一 些數(shù)據(jù)表提供有效位數(shù)(ENOB)規(guī)格，它描述了ADC器件所能提供的有效位數(shù)。為了計(jì)算ADC的ENOB值，應(yīng)把測(cè)量的SNR值放入上述公式，并求解 n。
上傳時(shí)間： 2014-12-22
上傳用戶：z240529971
為提高產(chǎn)品的可靠性、設(shè)計(jì)和功能,本文所有信息若有變更,恕不提前通知。本文信息也不作為廠商的任何承諾。 任何情況下,包括已警告了的各種損壞的可能性,廠商均不負(fù)責(zé)直接的、非直接的、特殊的或偶然的因不正當(dāng)使用本產(chǎn)品或文件所造成的損壞。 本文包含受版權(quán)保護(hù)的信息，版權(quán)所有。未經(jīng)廠商書面同意,不得以機(jī)械的、電子的或其它任何方式進(jìn)行復(fù)制。
上傳時(shí)間： 2013-10-14
上傳用戶：壞壞的華仔
設(shè)計(jì)了一種用于高速ADC中的全差分套筒式運(yùn)算放大器.從ADC的應(yīng)用指標(biāo)出發(fā),確定了設(shè)計(jì)目標(biāo),利用開關(guān)電容共模反饋、增益增強(qiáng)等技術(shù)實(shí)現(xiàn)了一個(gè)可用于12 bit精度、100 MHz采樣頻率的高速流水線(Pipelined)ADC中的運(yùn)算放大器.基于SMIC 0.13 μm,3.3 V工藝,Spectre仿真結(jié)果表明,該運(yùn)放可以達(dá)到105.8 dB的增益,單位增益帶寬達(dá)到983.6 MHz,而功耗僅為26.2 mW.運(yùn)放在4 ns的時(shí)間內(nèi)可以達(dá)到0.01%的建立精度,滿足系統(tǒng)設(shè)計(jì)要求.
標(biāo)簽： 增益 增強(qiáng)型 運(yùn)算放大器
上傳時(shí)間： 2013-10-16
上傳用戶：563686540
低電壓差分信號(hào)(LVDS)是一種高速點(diǎn)到點(diǎn)應(yīng)用通信標(biāo)準(zhǔn)。多點(diǎn)LVDS (M-LVDS)則是一種面向多點(diǎn)應(yīng)用的類似標(biāo)準(zhǔn)。LVDS和M-LVDS均使用差分信號(hào)，通過這種雙線式通信方法，接收器將根據(jù)兩個(gè)互補(bǔ)電信號(hào)之間的電壓差檢測(cè)數(shù)據(jù)。這樣能夠極大地改善噪聲抗擾度，并將噪聲輻射降至最低。
上傳時(shí)間： 2013-11-22
上傳用戶：fhjdliu
當(dāng)設(shè)計(jì)高速信號(hào)PCB或者復(fù)雜的PCB時(shí)，常常需要考慮信號(hào)的干擾和抗干擾的問題，也就是設(shè)計(jì)這樣的PCB時(shí)，需要提高PCB的電磁兼容性。為了實(shí)現(xiàn)這個(gè)目的，除了在原理圖設(shè)計(jì)時(shí)增加抗干擾的元件外，在設(shè)計(jì)PCB時(shí)也必須考慮這個(gè)問題，而最重要的實(shí)現(xiàn)手段之一就是使用高速信號(hào)布線的基本技巧和原則。 高速信號(hào)布線的基本技巧包括控制走線長(zhǎng)度、蛇形布線、差分對(duì)布線和等長(zhǎng)布線，使用這些基本的布線方法，可以大大提高高速信號(hào)的質(zhì)量和電磁兼容性。下面分別介紹這些布線方法的設(shè)置和操作。
上傳時(shí)間： 2013-11-08
上傳用戶：座山雕牛逼
本內(nèi)容匯總了近30個(gè)PCB布線知識(shí)面試題是PCB工程師必備的知識(shí)點(diǎn)總結(jié)，也是面試者需要的知識(shí)。如何處理實(shí)際布線中的一些理論沖突的問題，在高速設(shè)計(jì)中，如何解決信號(hào)的完整性問題?差分布線方式是如何實(shí)現(xiàn)的?對(duì)于只有一個(gè)輸出端的時(shí)鐘信號(hào)線，如何實(shí)現(xiàn)差分布線?等問題
上傳時(shí)間： 2013-12-15
上傳用戶：asdfasdfd
LVDS(低壓差分信號(hào))標(biāo)準(zhǔn)ANSI/TIA /E IA26442A22001廣泛應(yīng)用于許多接口器件和一些ASIC及FPGA中。文中探討了LVDS的特點(diǎn)及其PCB (印制電路板)設(shè)計(jì),糾正了某些錯(cuò)誤認(rèn)識(shí)。應(yīng)用傳輸線理論分析了單線阻抗、雙線阻抗及LVDS差分阻抗計(jì)算方法,給出了計(jì)算單線阻抗和差分阻抗的公式,通過實(shí)際計(jì)算說明了差分阻抗與單線阻抗的區(qū)別,并給出了PCB布線時(shí)的幾點(diǎn)建議。關(guān)鍵詞: LVDS, 阻抗分析, 阻抗計(jì)算, PCB設(shè)計(jì) LVDS (低壓差分信號(hào))是高速、低電壓、低功率、低噪聲通用I/O接口標(biāo)準(zhǔn),其低壓擺幅和差分電流輸出模式使EM I (電磁干擾)大大降低。由于信號(hào)輸出邊緣變化很快,其信號(hào)通路表現(xiàn)為傳輸線特性。因此,在用含有LVDS接口的Xilinx或Altera等公司的FP2GA及其它器件進(jìn)行PCB (印制電路板)設(shè)計(jì)時(shí),超高速PCB設(shè)計(jì)和差分信號(hào)理論就顯得特別重要。
上傳時(shí)間： 2013-11-19
上傳用戶：水中浮云
第一部分 信號(hào)完整性知識(shí)基礎(chǔ).................................................................................5第一章 高速數(shù)字電路概述.....................................................................................51.1 何為高速電路...............................................................................................51.2 高速帶來的問題及設(shè)計(jì)流程剖析...............................................................61.3 相關(guān)的一些基本概念...................................................................................8第二章 傳輸線理論...............................................................................................122.1 分布式系統(tǒng)和集總電路.............................................................................122.2 傳輸線的RLCG 模型和電報(bào)方程...............................................................132.3 傳輸線的特征阻抗.....................................................................................142.3.1 特性阻抗的本質(zhì).................................................................................142.3.2 特征阻抗相關(guān)計(jì)算.............................................................................152.3.3 特性阻抗對(duì)信號(hào)完整性的影響.........................................................172.4 傳輸線電報(bào)方程及推導(dǎo).............................................................................182.5 趨膚效應(yīng)和集束效應(yīng).................................................................................232.6 信號(hào)的反射.................................................................................................252.6.1 反射機(jī)理和電報(bào)方程.........................................................................252.6.2 反射導(dǎo)致信號(hào)的失真問題.................................................................302.6.2.1 過沖和下沖.....................................................................................302.6.2.2 振蕩：.............................................................................................312.6.3 反射的抑制和匹配.............................................................................342.6.3.1 串行匹配.........................................................................................352.6.3.1 并行匹配.........................................................................................362.6.3.3 差分線的匹配.................................................................................392.6.3.4 多負(fù)載的匹配.................................................................................41第三章 串?dāng)_的分析...............................................................................................423.1 串?dāng)_的基本概念.........................................................................................423.2 前向串?dāng)_和后向串?dāng)_.................................................................................433.3 后向串?dāng)_的反射.........................................................................................463.4 后向串?dāng)_的飽和.........................................................................................463.5 共模和差模電流對(duì)串?dāng)_的影響.................................................................483.6 連接器的串?dāng)_問題.....................................................................................513.7 串?dāng)_的具體計(jì)算.........................................................................................543.8 避免串?dāng)_的措施.........................................................................................57第四章 EMI 抑制....................................................................................................604.1 EMI/EMC 的基本概念..................................................................................604.2 EMI 的產(chǎn)生..................................................................................................614.2.1 電壓瞬變.............................................................................................614.2.2 信號(hào)的回流.........................................................................................624.2.3 共模和差摸EMI ..................................................................................634.3 EMI 的控制..................................................................................................654.3.1 屏蔽.....................................................................................................654.3.1.1 電場(chǎng)屏蔽.........................................................................................654.3.1.2 磁場(chǎng)屏蔽.........................................................................................674.3.1.3 電磁場(chǎng)屏蔽.....................................................................................674.3.1.4 電磁屏蔽體和屏蔽效率.................................................................684.3.2 濾波.....................................................................................................714.3.2.1 去耦電容.........................................................................................714.3.2.3 磁性元件.........................................................................................734.3.3 接地.....................................................................................................744.4 PCB 設(shè)計(jì)中的EMI.......................................................................................754.4.1 傳輸線RLC 參數(shù)和EMI ........................................................................764.4.2 疊層設(shè)計(jì)抑制EMI ..............................................................................774.4.3 電容和接地過孔對(duì)回流的作用.........................................................784.4.4 布局和走線規(guī)則.................................................................................79第五章 電源完整性理論基礎(chǔ)...............................................................................825.1 電源噪聲的起因及危害.............................................................................825.2 電源阻抗設(shè)計(jì).............................................................................................855.3 同步開關(guān)噪聲分析.....................................................................................875.3.1 芯片內(nèi)部開關(guān)噪聲.............................................................................885.3.2 芯片外部開關(guān)噪聲.............................................................................895.3.3 等效電感衡量SSN ..............................................................................905.4 旁路電容的特性和應(yīng)用.............................................................................925.4.1 電容的頻率特性.................................................................................935.4.3 電容的介質(zhì)和封裝影響.....................................................................955.4.3 電容并聯(lián)特性及反諧振.....................................................................955.4.4 如何選擇電容.....................................................................................975.4.5 電容的擺放及Layout ........................................................................99第六章 系統(tǒng)時(shí)序.................................................................................................1006.1 普通時(shí)序系統(tǒng)...........................................................................................1006.1.1 時(shí)序參數(shù)的確定...............................................................................1016.1.2 時(shí)序約束條件...................................................................................1063.2 高速設(shè)計(jì)的問題.......................................................................................2093.3 SPECCTRAQuest SI Expert 的組件.......................................................2103.3.1 SPECCTRAQuest Model Integrity .................................................2103.3.2 SPECCTRAQuest Floorplanner/Editor .........................................2153.3.3 Constraint Manager .......................................................................2163.3.4 SigXplorer Expert Topology Development Environment .......2233.3.5 SigNoise 仿真子系統(tǒng)......................................................................2253.3.6 EMControl .........................................................................................2303.3.7 SPECCTRA Expert 自動(dòng)布線器.......................................................2303.4 高速設(shè)計(jì)的大致流程...............................................................................2303.4.1 拓?fù)浣Y(jié)構(gòu)的探索...............................................................................2313.4.2 空間解決方案的探索.......................................................................2313.4.3 使用拓?fù)淠０弪?qū)動(dòng)設(shè)計(jì)...................................................................2313.4.4 時(shí)序驅(qū)動(dòng)布局...................................................................................2323.4.5 以約束條件驅(qū)動(dòng)設(shè)計(jì).......................................................................2323.4.6 設(shè)計(jì)后分析.......................................................................................233第四章 SPECCTRAQUEST SIGNAL EXPLORER 的進(jìn)階運(yùn)用..........................................2344.1 SPECCTRAQuest Signal Explorer 的功能包括：................................2344.2 圖形化的拓?fù)浣Y(jié)構(gòu)探索...........................................................................2344.3 全面的信號(hào)完整性(Signal Integrity)分析.......................................2344.4 完全兼容 IBIS 模型...............................................................................2344.5 PCB 設(shè)計(jì)前和設(shè)計(jì)的拓?fù)浣Y(jié)構(gòu)提取.......................................................2354.6 仿真設(shè)置顧問...........................................................................................2354.7 改變?cè)O(shè)計(jì)的管理.......................................................................................2354.8 關(guān)鍵技術(shù)特點(diǎn)...........................................................................................2364.8.1 拓?fù)浣Y(jié)構(gòu)探索...................................................................................2364.8.2 SigWave 波形顯示器........................................................................2364.8.3 集成化的在線分析(Integration and In-process Analysis) .236第五章 部分特殊的運(yùn)用...............................................................................2375.1 Script 指令的使用..................................................................................2375.2 差分信號(hào)的仿真.......................................................................................2435.3 眼圖模式的使用.......................................................................................249第四部分：HYPERLYNX 仿真工具使用指南............................................................251第一章 使用LINESIM 進(jìn)行前仿真.......................................................................2511.1 用LineSim 進(jìn)行仿真工作的基本方法...................................................2511.2 處理信號(hào)完整性原理圖的具體問題.......................................................2591.3 在LineSim 中如何對(duì)傳輸線進(jìn)行設(shè)置...................................................2601.4 在LineSim 中模擬IC 元件.....................................................................2631.5 在LineSim 中進(jìn)行串?dāng)_仿真...................................................................268第二章 使用BOARDSIM 進(jìn)行后仿真......................................................................2732.1 用BOARDSIM 進(jìn)行后仿真工作的基本方法...................................................2732.2 BoardSim 的進(jìn)一步介紹..........................................................................2922.3 BoardSim 中的串?dāng)_仿真..........................................................................309
標(biāo)簽： PCB 內(nèi)存 仿真技術(shù)
上傳時(shí)間： 2014-04-18
上傳用戶：wpt
Calculation of the Differential Impedance of Tracks on FR4 substrates There is a discrepancy between calculated and measured values of impedance for differential transmission lineson FR4. This is especially noticeable in the case of surface microstrip configurations. The anomaly is shown tobe due to the nature of the substrate material. This needs to be considered as a layered structure of epoxy resinand glass fibre. Calculations, using Boundary Element field methods, show that the distribution of the electricfield within this layered structure determines the apparent dielectric constant and therefore affects theimpedance. Thus FR4 cannot be considered to be uniform dielectric when calculating differential impedance.
上傳時(shí)間： 2014-12-24
上傳用戶：DE2542
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