第一部分 信號完整性知識基礎.................................................................................5第一章 高速數(shù)字電路概述.....................................................................................51.1 何為高速電路...............................................................................................51.2 高速帶來的問題及設計流程剖析...............................................................61.3 相關的一些基本概念...................................................................................8第二章 傳輸線理論...............................................................................................122.1 分布式系統(tǒng)和集總電路.............................................................................122.2 傳輸線的RLCG 模型和電報方程...............................................................132.3 傳輸線的特征阻抗.....................................................................................142.3.1 特性阻抗的本質.................................................................................142.3.2 特征阻抗相關計算.............................................................................152.3.3 特性阻抗對信號完整性的影響.........................................................172.4 傳輸線電報方程及推導.............................................................................182.5 趨膚效應和集束效應.................................................................................232.6 信號的反射.................................................................................................252.6.1 反射機理和電報方程.........................................................................252.6.2 反射導致信號的失真問題.................................................................302.6.2.1 過沖和下沖.....................................................................................302.6.2.2 振蕩:.............................................................................................312.6.3 反射的抑制和匹配.............................................................................342.6.3.1 串行匹配.........................................................................................352.6.3.1 并行匹配.........................................................................................362.6.3.3 差分線的匹配.................................................................................392.6.3.4 多負載的匹配.................................................................................41第三章 串擾的分析...............................................................................................423.1 串擾的基本概念.........................................................................................423.2 前向串擾和后向串擾.................................................................................433.3 后向串擾的反射.........................................................................................463.4 后向串擾的飽和.........................................................................................463.5 共模和差模電流對串擾的影響.................................................................483.6 連接器的串擾問題.....................................................................................513.7 串擾的具體計算.........................................................................................543.8 避免串擾的措施.........................................................................................57第四章 EMI 抑制....................................................................................................604.1 EMI/EMC 的基本概念..................................................................................604.2 EMI 的產生..................................................................................................614.2.1 電壓瞬變.............................................................................................614.2.2 信號的回流.........................................................................................624.2.3 共模和差摸EMI ..................................................................................634.3 EMI 的控制..................................................................................................654.3.1 屏蔽.....................................................................................................654.3.1.1 電場屏蔽.........................................................................................654.3.1.2 磁場屏蔽.........................................................................................674.3.1.3 電磁場屏蔽.....................................................................................674.3.1.4 電磁屏蔽體和屏蔽效率.................................................................684.3.2 濾波.....................................................................................................714.3.2.1 去耦電容.........................................................................................714.3.2.3 磁性元件.........................................................................................734.3.3 接地.....................................................................................................744.4 PCB 設計中的EMI.......................................................................................754.4.1 傳輸線RLC 參數(shù)和EMI ........................................................................764.4.2 疊層設計抑制EMI ..............................................................................774.4.3 電容和接地過孔對回流的作用.........................................................784.4.4 布局和走線規(guī)則.................................................................................79第五章 電源完整性理論基礎...............................................................................825.1 電源噪聲的起因及危害.............................................................................825.2 電源阻抗設計.............................................................................................855.3 同步開關噪聲分析.....................................................................................875.3.1 芯片內部開關噪聲.............................................................................885.3.2 芯片外部開關噪聲.............................................................................895.3.3 等效電感衡量SSN ..............................................................................905.4 旁路電容的特性和應用.............................................................................925.4.1 電容的頻率特性.................................................................................935.4.3 電容的介質和封裝影響.....................................................................955.4.3 電容并聯(lián)特性及反諧振.....................................................................955.4.4 如何選擇電容.....................................................................................975.4.5 電容的擺放及Layout ........................................................................99第六章 系統(tǒng)時序.................................................................................................1006.1 普通時序系統(tǒng)...........................................................................................1006.1.1 時序參數(shù)的確定...............................................................................1016.1.2 時序約束條件...................................................................................1063.2 高速設計的問題.......................................................................................2093.3 SPECCTRAQuest SI Expert 的組件.......................................................2103.3.1 SPECCTRAQuest Model Integrity .................................................2103.3.2 SPECCTRAQuest Floorplanner/Editor .........................................2153.3.3 Constraint Manager .......................................................................2163.3.4 SigXplorer Expert Topology Development Environment .......2233.3.5 SigNoise 仿真子系統(tǒng)......................................................................2253.3.6 EMControl .........................................................................................2303.3.7 SPECCTRA Expert 自動布線器.......................................................2303.4 高速設計的大致流程...............................................................................2303.4.1 拓撲結構的探索...............................................................................2313.4.2 空間解決方案的探索.......................................................................2313.4.3 使用拓撲模板驅動設計...................................................................2313.4.4 時序驅動布局...................................................................................2323.4.5 以約束條件驅動設計.......................................................................2323.4.6 設計后分析.......................................................................................233第四章 SPECCTRAQUEST SIGNAL EXPLORER 的進階運用..........................................2344.1 SPECCTRAQuest Signal Explorer 的功能包括:................................2344.2 圖形化的拓撲結構探索...........................................................................2344.3 全面的信號完整性(Signal Integrity)分析.......................................2344.4 完全兼容 IBIS 模型...............................................................................2344.5 PCB 設計前和設計的拓撲結構提取.......................................................2354.6 仿真設置顧問...........................................................................................2354.7 改變設計的管理.......................................................................................2354.8 關鍵技術特點...........................................................................................2364.8.1 拓撲結構探索...................................................................................2364.8.2 SigWave 波形顯示器........................................................................2364.8.3 集成化的在線分析(Integration and In-process Analysis) .236第五章 部分特殊的運用...............................................................................2375.1 Script 指令的使用..................................................................................2375.2 差分信號的仿真.......................................................................................2435.3 眼圖模式的使用.......................................................................................249第四部分:HYPERLYNX 仿真工具使用指南............................................................251第一章 使用LINESIM 進行前仿真.......................................................................2511.1 用LineSim 進行仿真工作的基本方法...................................................2511.2 處理信號完整性原理圖的具體問題.......................................................2591.3 在LineSim 中如何對傳輸線進行設置...................................................2601.4 在LineSim 中模擬IC 元件.....................................................................2631.5 在LineSim 中進行串擾仿真...................................................................268第二章 使用BOARDSIM 進行后仿真......................................................................2732.1 用BOARDSIM 進行后仿真工作的基本方法...................................................2732.2 BoardSim 的進一步介紹..........................................................................2922.3 BoardSim 中的串擾仿真..........................................................................309
上傳時間: 2013-11-07
上傳用戶:aa7821634
根據(jù)半實物仿真的特點和優(yōu)點,本文提出了基于半實物仿真系統(tǒng)的多假目標航跡欺騙研究的優(yōu)勢和價值。然后從實現(xiàn)多假目標航跡欺騙的必要條件、航跡欺騙產生的原理、多假目標欺騙的參數(shù)匹配、多目標欺騙航跡的數(shù)據(jù)預算4個方面詳細闡述了多假目標航跡欺騙原理,以及對半實物仿真系統(tǒng)的組成、軟硬件設計特點進行了介紹,最后通過半實物仿真系統(tǒng)驗證了兩批假目標預定航跡的真實性和置信度,結果證明這種方式對研究多假目標航跡欺騙技術和戰(zhàn)術應用的可行性和有效性。
標簽: 半實物仿真
上傳時間: 2013-11-11
上傳用戶:攏共湖塘
摘要: 設計并實現(xiàn)了一種激光半主動制導實物仿真系統(tǒng),系統(tǒng)主要包括光電探測、信號處理和伺服部分。介紹了系統(tǒng)的工作原理以及主要電路的設計。該系統(tǒng)體積小,操作方便,控制靈活等優(yōu)點。實際應用結果表明,該仿真系統(tǒng)對模擬激光目標的跟蹤穩(wěn)定,具有良好的實時性和較強的實用性。
標簽: 激光制導 實物 仿真系統(tǒng)設計
上傳時間: 2014-01-08
上傳用戶:taox
電子技術課程設計---多路溫度采集監(jiān)控系統(tǒng)的硬件設計
標簽: 多路 溫度采集監(jiān)控系統(tǒng) 硬件設計
上傳時間: 2013-11-22
上傳用戶:氣溫達上千萬的
采用dsPIC30F6010A高性能數(shù)字信號控制器,提出并實現(xiàn)了一種新型的集成CAN總線接口的步進電機驅動裝置。根據(jù)dsPIC30F6010A芯片外設模塊的參數(shù)特點,設計了PWM驅動電路、電機相電流測量電路和CAN總線收發(fā)器電路,開發(fā)了基于C語言的模塊化應用程序。實際測試表明,該集成CAN總線的步進電機驅動裝置可以直接接入CAN總線網絡,實現(xiàn)了對電機運行參數(shù)和運行狀態(tài)的遠程控制功能。
上傳時間: 2013-11-22
上傳用戶:giraffe
四路互鎖開關,在電路常用到。
標簽: 互鎖開關
上傳時間: 2013-10-14
上傳用戶:gaome
三相半波整流原理
上傳時間: 2013-10-12
上傳用戶:ch3ch2oh
集成化音頻放大電路的設計
上傳時間: 2013-10-09
上傳用戶:行者Xin
六路繼電器控制板
上傳時間: 2013-11-23
上傳用戶:Sophie
四路固態(tài)繼電器控制模塊
標簽: 固態(tài)繼電器 控制模塊
上傳時間: 2013-11-23
上傳用戶:wfeel