Ultiboard PCB introduction
標簽： development ultiboard PCB
上傳時間： 2013-11-21
上傳用戶：HGH77P99
第一部分 信號完整性知識基礎.................................................................................5第一章 高速數字電路概述.....................................................................................51.1 何為高速電路...............................................................................................51.2 高速帶來的問題及設計流程剖析...............................................................61.3 相關的一些基本概念...................................................................................8第二章 傳輸線理論...............................................................................................122.1 分布式系統和集總電路.............................................................................122.2 傳輸線的RLCG 模型和電報方程...............................................................132.3 傳輸線的特征阻抗.....................................................................................142.3.1 特性阻抗的本質.................................................................................142.3.2 特征阻抗相關計算.............................................................................152.3.3 特性阻抗對信號完整性的影響.........................................................172.4 傳輸線電報方程及推導.............................................................................182.5 趨膚效應和集束效應.................................................................................232.6 信號的反射.................................................................................................252.6.1 反射機理和電報方程.........................................................................252.6.2 反射導致信號的失真問題.................................................................302.6.2.1 過沖和下沖.....................................................................................302.6.2.2 振蕩：.............................................................................................312.6.3 反射的抑制和匹配.............................................................................342.6.3.1 串行匹配.........................................................................................352.6.3.1 并行匹配.........................................................................................362.6.3.3 差分線的匹配.................................................................................392.6.3.4 多負載的匹配.................................................................................41第三章 串擾的分析...............................................................................................423.1 串擾的基本概念.........................................................................................423.2 前向串擾和后向串擾.................................................................................433.3 后向串擾的反射.........................................................................................463.4 后向串擾的飽和.........................................................................................463.5 共模和差模電流對串擾的影響.................................................................483.6 連接器的串擾問題.....................................................................................513.7 串擾的具體計算.........................................................................................543.8 避免串擾的措施.........................................................................................57第四章 EMI 抑制....................................................................................................604.1 EMI/EMC 的基本概念..................................................................................604.2 EMI 的產生..................................................................................................614.2.1 電壓瞬變.............................................................................................614.2.2 信號的回流.........................................................................................624.2.3 共模和差摸EMI ..................................................................................634.3 EMI 的控制..................................................................................................654.3.1 屏蔽.....................................................................................................654.3.1.1 電場屏蔽.........................................................................................654.3.1.2 磁場屏蔽.........................................................................................674.3.1.3 電磁場屏蔽.....................................................................................674.3.1.4 電磁屏蔽體和屏蔽效率.................................................................684.3.2 濾波.....................................................................................................714.3.2.1 去耦電容.........................................................................................714.3.2.3 磁性元件.........................................................................................734.3.3 接地.....................................................................................................744.4 PCB 設計中的EMI.......................................................................................754.4.1 傳輸線RLC 參數和EMI ........................................................................764.4.2 疊層設計抑制EMI ..............................................................................774.4.3 電容和接地過孔對回流的作用.........................................................784.4.4 布局和走線規則.................................................................................79第五章 電源完整性理論基礎...............................................................................825.1 電源噪聲的起因及危害.............................................................................825.2 電源阻抗設計.............................................................................................855.3 同步開關噪聲分析.....................................................................................875.3.1 芯片內部開關噪聲.............................................................................885.3.2 芯片外部開關噪聲.............................................................................895.3.3 等效電感衡量SSN ..............................................................................905.4 旁路電容的特性和應用.............................................................................925.4.1 電容的頻率特性.................................................................................935.4.3 電容的介質和封裝影響.....................................................................955.4.3 電容并聯特性及反諧振.....................................................................955.4.4 如何選擇電容.....................................................................................975.4.5 電容的擺放及Layout ........................................................................99第六章 系統時序.................................................................................................1006.1 普通時序系統...........................................................................................1006.1.1 時序參數的確定...............................................................................1016.1.2 時序約束條件...................................................................................1063.2 高速設計的問題.......................................................................................2093.3 SPECCTRAQuest SI Expert 的組件.......................................................2103.3.1 SPECCTRAQuest Model Integrity .................................................2103.3.2 SPECCTRAQuest Floorplanner/Editor .........................................2153.3.3 Constraint Manager .......................................................................2163.3.4 SigXplorer Expert Topology Development Environment .......2233.3.5 SigNoise 仿真子系統......................................................................2253.3.6 EMControl .........................................................................................2303.3.7 SPECCTRA Expert 自動布線器.......................................................2303.4 高速設計的大致流程...............................................................................2303.4.1 拓撲結構的探索...............................................................................2313.4.2 空間解決方案的探索.......................................................................2313.4.3 使用拓撲模板驅動設計...................................................................2313.4.4 時序驅動布局...................................................................................2323.4.5 以約束條件驅動設計.......................................................................2323.4.6 設計后分析.......................................................................................233第四章 SPECCTRAQUEST SIGNAL EXPLORER 的進階運用..........................................2344.1 SPECCTRAQuest Signal Explorer 的功能包括：................................2344.2 圖形化的拓撲結構探索...........................................................................2344.3 全面的信號完整性(Signal Integrity)分析.......................................2344.4 完全兼容 IBIS 模型...............................................................................2344.5 PCB 設計前和設計的拓撲結構提取.......................................................2354.6 仿真設置顧問...........................................................................................2354.7 改變設計的管理.......................................................................................2354.8 關鍵技術特點...........................................................................................2364.8.1 拓撲結構探索...................................................................................2364.8.2 SigWave 波形顯示器........................................................................2364.8.3 集成化的在線分析(Integration and In-process Analysis) .236第五章 部分特殊的運用...............................................................................2375.1 Script 指令的使用..................................................................................2375.2 差分信號的仿真.......................................................................................2435.3 眼圖模式的使用.......................................................................................249第四部分：HYPERLYNX 仿真工具使用指南............................................................251第一章 使用LINESIM 進行前仿真.......................................................................2511.1 用LineSim 進行仿真工作的基本方法...................................................2511.2 處理信號完整性原理圖的具體問題.......................................................2591.3 在LineSim 中如何對傳輸線進行設置...................................................2601.4 在LineSim 中模擬IC 元件.....................................................................2631.5 在LineSim 中進行串擾仿真...................................................................268第二章 使用BOARDSIM 進行后仿真......................................................................2732.1 用BOARDSIM 進行后仿真工作的基本方法...................................................2732.2 BoardSim 的進一步介紹..........................................................................2922.3 BoardSim 中的串擾仿真..........................................................................309
上傳時間： 2014-04-18
上傳用戶：wpt
Power over Ethernet (PoE) is a new development thatallows for the delivery of power to Ethernet-based devicesvia standard Ethernet CAT5 cable, precluding the need forwall adapters or other external power sources. The PoEspecification defines a hardware detection protocol wherePower Sourcing Equipment (PSE) is able to identify PoEPowered Devices (PDs), thus allowing full backwardscompatibility with non-PoE-aware (legacy) Ethernetdevices.
上傳時間： 2013-11-11
上傳用戶：daoyue
ST8S開發原理圖,和大家分享下,希望能和更多朋友一起學習,進步.
標簽： S-DISCOVERY STM 原理圖
上傳時間： 2013-12-31
上傳用戶：1039312764
Abstract: This application note describes how to build, debug, and run applications on the on-board MAXQ622microcontroller to interface with the DS8005 dual smart card interface. This is demonstrated in both IAREmbedded Workbench and the Rowley CrossWorks IDE, using sample code provided with the kit.
上傳時間： 2013-10-29
上傳用戶：ddddddd
一起學習
上傳時間： 2013-11-10
上傳用戶：rologne
STM8的工程模板教程
上傳時間： 2013-11-14
上傳用戶：love1314
，我說說AVR 的集成開發環境。也就是常說的IDE（Integrated Development Environment）。圖片比較多，雖然用軟件處理過體積，網頁可能還是比較慢，還請見諒。 現今世界上的AVR 開發環境可以說是百花齊放了，互相當然各有長短，我們看看都有哪些： 首當其沖的應該還是IAR，為什么呢，因為當初AVR 還在ATMEL 胎中醞釀的時候，IAR 公司 參與了AVR 的設計，因此可以認為IAR 有更為正統的血液，它最了解AVR，它的編譯器編出來的 代碼應該最優秀。好比你生的孩子還是你最了解——至少相當長一段時間是這樣的。事實上，IAR for AVR 確實展現了這個實力，它的功能確實最為強大，無論是源代碼編寫還是軟件乃至硬件仿 真，編譯出來的代碼也十分優秀。但是事物總是相對存在的，優點有時就意味著缺點。IAR 功能 全面而強悍，代價就是它的軟件界面比較復雜，設置選項多，網上的資料也比較少，最要命的是 這個軟件非常的貴，好吧你說你有破解版，但是破解文件一般并不通用，而且破解方法一般都稍 顯繁瑣。以上幾條，對于新接觸AVR 的人來說，幾乎是邁不過的坎。
標簽： AVR
上傳時間： 2013-10-15
上傳用戶：weiwolkt
以太網和CAN總線應用廣泛，但由于其通信協議不同，兩種總線器件間無法進行數據通信，因此，設計了基于CP2200與C8051F040的以太網總線與CAN總線接口轉換電路，并給出部分相關硬件電路與軟件設計分析。在保證數據完整和協議可靠的前提下，通過握手協議和簡化的以太網協議，不僅實現了以太網數據與CAN數據的轉發，同時還順利的解決了以太網的高速性與CAN的低速率沖突，以及兩者數據包之間的大小不同的矛盾。 Abstract: In the development of actual application， Ethernet and CAN bus are used very extensively. Owing to its various communication protocols， the communicating between two kinds of bus device can’t be carried out. Therefore， in order to solve this problem， the Ethernet-CAN bus interface circuit based on CP2200 and C8051F040 was designed in this paper， and part of the related hardware circuit and software design analysis were given. On the condition of data’s integrity and protocols’reliability， through the handshaking protocols and the simplified the Ethernet protocol， not only the data switching between CAN and Ethernet was realized， but also the differ in velocity and packet size was solved.
上傳時間： 2013-10-15
上傳用戶：Ants
應用德國Micronas公司的CDC3207G微控制器開發了一款汽車儀表板系統。詳細地介紹了該系統的硬件原理，以及步進電機，音頻控制，LCD顯示，LED指示燈和報警燈等幾個模塊的實現方法。應用μC/OS-II實時操作系統開發軟件。著重介紹了啟動代碼的設計和任務的規劃。 Abstract: A dashboard system is developed by using CDC3207G microcontroller made by Micronas.The hardware of the sys-tem and the realization of the step motor module,audio module,LCD display and LED indicator and alarm module are ex-plained in detail.The μC/OS-II real-time operating system is used for the software development and the starting code design and the task planning is explained specifically.
上傳時間： 2013-10-26
上傳用戶：x4587
