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  • 帶通濾波器設計計算

    摘 要:用一種新的思路和方法,先計算低通、再計算高通濾波器的有關參數,然后組合成帶通濾波器.關鍵詞:濾波器;參數;新思路中圖分類號: TN713. 5  文獻識別碼:B  文章編號:1008 - 1666 (1999) 04 - 0089 - 03A New Consideration of the Band Filter’s CalculationGuo Wencheng( S hao Yang B usiness and Technology school , S haoyang , Hunan ,422000 )Abstract :This essay deals with a new method of calculating the band filters - first calculatingthe relevant parameters of low - pass filters ,then calculating the ones of high - pass filters.Key words :filter ; parameters ;new considercation八十年代后,信息產業得到了迅猛發展. 帶通濾波器在微波通信、廣播電視和精密儀器設備中得到了廣泛應用. 帶通濾波器性能的優劣,對提高接收機信噪比,防止鄰近信道干擾,提高設備的技術指標,有著十分重要的意義.我在長期的教學實踐中,用切比雪夫型方法設計、計算出寬帶濾波器集中參數元件的數據. 該濾波器可運用在檢測微波頻率的儀器和其他設備中. 再將其思路和計算方法介紹給大家,供參考.

    標簽: 帶通濾波器設計 計算

    上傳時間: 2014-12-28

    上傳用戶:Yukiseop

  • at89c52 pdf

    The AT89C52 is a low-power, high-performance CMOS 8-bit microcomputer with 8Kbytes of Flash programmable and erasable read only memory (PEROM). The deviceis manufactured using Atmel’s high-density nonvolatile memory technology and iscompatible with the industry-standard 80C51 and 80C52 instruction set and pinout.The on-chip Flash allows the program memory to be reprogrammed in-system or by aconventional nonvolatile memory programmer. By combining a versatile 8-bit CPUwith Flash on a monolithic chip, the Atmel AT89C52 is a powerful microcomputerwhich provides a highly-flexible and cost-effective solution to many embedded controlapplications.

    標簽: 89c c52 at

    上傳時間: 2013-11-10

    上傳用戶:1427796291

  • Xilinx UltraScale:新一代架構滿足您的新一代架構需求(EN)

      中文版詳情瀏覽:http://www.elecfans.com/emb/fpga/20130715324029.html   Xilinx UltraScale:The Next-Generation Architecture for Your Next-Generation Architecture    The Xilinx® UltraScale™ architecture delivers unprecedented levels of integration and capability with ASIC-class system- level performance for the most demanding applications.   The UltraScale architecture is the industr y's f irst application of leading-edge ASIC architectural enhancements in an All Programmable architecture that scales from 20 nm planar through 16 nm FinFET technologies and beyond, in addition to scaling from monolithic through 3D ICs. Through analytical co-optimization with the X ilinx V ivado® Design Suite, the UltraScale architecture provides massive routing capacity while intelligently resolving typical bottlenecks in ways never before possible. This design synergy achieves greater than 90% utilization with no performance degradation.   Some of the UltraScale architecture breakthroughs include:   • Strategic placement (virtually anywhere on the die) of ASIC-like system clocks, reducing clock skew by up to 50%    • Latency-producing pipelining is virtually unnecessary in systems with massively parallel bus architecture, increasing system speed and capability   • Potential timing-closure problems and interconnect bottlenecks are eliminated, even in systems requiring 90% or more resource utilization   • 3D IC integration makes it possible to build larger devices one process generation ahead of the current industr y standard    • Greatly increased system performance, including multi-gigabit serial transceivers, I/O, and memor y bandwidth is available within even smaller system power budgets   • Greatly enhanced DSP and packet handling   The Xilinx UltraScale architecture opens up whole new dimensions for designers of ultra-high-capacity solutions.

    標簽: UltraScale Xilinx 架構

    上傳時間: 2013-11-13

    上傳用戶:瓦力瓦力hong

  • 為您的FPGA選擇合適的電源

    Abstract: There are many things to consider when designing a power supply for a field-programmablegate array (FPGA). These include (but are not limited to) the high number of voltage rails, and thediffering requirements for both sequencing/tracking and the voltage ripple limits. This application noteexplains these and other power-supply considerations that an engineer must think through whendesigning a power supply for an FPGA.

    標簽: FPGA 電源

    上傳時間: 2013-11-10

    上傳用戶:iswlkje

  • HDB3編解碼器設計

    HDB3(High Density Bipolar三階高密度雙極性)碼是在AMI碼的基礎上改進的一種雙極性歸零碼,它除具有AMI碼功率譜中無直流分量,可進行差錯自檢等優點外,還克服了AMI碼當信息中出現連“0”碼時定時提取困難的缺點,而且HDB3碼頻譜能量主要集中在基波頻率以下,占用頻帶較窄,是ITU-TG.703推薦的PCM基群、二次群和三次群的數字傳輸接口碼型,因此HDB3碼的編解碼就顯得極為重要了[1]。目前,HDB3碼主要由專用集成電路及相應匹配的外圍中小規模集成芯片來實現,但集成程度不高,特別是位同步提取非常復雜,不易實現。隨著可編程器件的發展,這一難題得到了很好地解決。

    標簽: HDB3 編解碼器

    上傳時間: 2013-11-21

    上傳用戶:sy_jiadeyi

  • Create a 1-Wire Master with Xilinx PicoBlaze

    Abstract: Designers who must interface 1-Wire temperature sensors with Xilinx field-programmable gate arrays(FPGAs) can use this reference design to drive a DS28EA00 1-Wire slave device. The downloadable softwarementioned in this document can also be used as a starting point to connect other 1-Wire slave devices. The systemimplements a 1-Wire master connected to a UART and outputs temperature to a PC from the DS28EA00 temperaturesensor. In addition, high/low alarm outputs are displayed from the DS28EA00 PIO pins using LEDs.

    標簽: PicoBlaze Create Master Xilinx

    上傳時間: 2013-11-05

    上傳用戶:a6697238

  • 《器件封裝用戶向導》賽靈思產品封裝資料

    Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.

    標簽: 封裝 器件 用戶 賽靈思

    上傳時間: 2013-10-22

    上傳用戶:ztj182002

  • AN522: Implementing Bus LVDS

    This application note describes how to implement the Bus LVDS (BLVDS) interface in the supported Altera ® device families for high-performance multipoint applications. This application note also shows the performance analysis of a multipoint application with the Cyclone III BLVDS example.

    標簽: Implementing LVDS 522 Bus

    上傳時間: 2013-11-10

    上傳用戶:frank1234

  • Analog Solutions for Xilinx FPGAs

    Designing withProgrammable Logicin an Analog WorldProgrammable logic devicesrevolutionized digital design over 25years ago, promising designers a blankchip to design literally any functionand program it in the field. PLDs canbe low-logic density devices that usenonvolatile sea-of-gates cells calledcomplex programmable logic devices(CPLDs) or they can be high-densitydevices based on SRAM look-up tables

    標簽: Solutions Analog Xilinx FPGAs

    上傳時間: 2013-11-01

    上傳用戶:a67818601

  • Analog Solutions for Altera FPGAs

    Designing withProgrammable Logicin an Analog WorldProgrammable logic devices revolutionizeddigital design over 25 years ago,promising designers a blank chip todesign literally any function and programit in the field. PLDs can be low-logicdensity devices that use nonvolatilesea-of-gates cells called complexprogrammable logic devices (CPLDs)or they can be high-density devicesbased on SRAM look-up tables (LUTs)

    標簽: Solutions Analog Altera FPGAs

    上傳時間: 2013-11-08

    上傳用戶:蟲蟲蟲蟲蟲蟲

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