The rapid growth in mobile communications has led to an increasing demand for wide- band high data rate communications services. In recent years, Distributed Antenna Systems (DAS) has emerged as a promising candidate for future (beyond 3G or 4G) mobile communications, as illustrated by projects such as FRAMES and FuTURE. The architecture of DAS inherits and develops the concepts of pico- or MICRO-cell systems, where multiple distributed antennas or access points (AP) are connected to and con- trolled by a central unit.
標簽： Distributed Antenna Systems
上傳時間： 2020-05-27
上傳用戶：shancjb
Applications of MICROelectromechanical systems (MEMS) and MICROfabrica- tion have spread to different fields of engineering and science in recent years. Perhaps the most exciting development in the application of MEMS technol- ogy has occurred in the biological and biomedical areas. In addition to key fluidic components, such as MICROvalves, pumps, and all kinds of novel sensors that can be used for biological and biomedical analysis and mea- surements, many other types of so-called MICRO total analysis systems (TAS) have been developed.
標簽： Applications Technologies Bio-MEMS and
上傳時間： 2020-06-06
上傳用戶：shancjb
The mature CMOS fabrication processes are available in many IC foundries. It is cost-effective to leverage the existing CMOS fabrication technologies to implement MEMS devices. On the other hand, the MEMS devices could also add values to the IC industry as the Moore’s law reaching its limit. The CMOS MEMS could play a key role to bridge the gap between the CMOS and MEMS technologies. The CMOS MEMS also offers the advantage of monolithic integration of ICs and MICRO mechanical components.
標簽： TECHNOLOGY CMOS MEMS KEY
上傳時間： 2020-06-06
上傳用戶：shancjb
For more than three decades, MICRO Electro Mechanical Systems (MEMS) have steadily transitioned out of research labs and into production forming a more than $10 billion market [1]. MEMS devices such as accelerometers, pressure sensors and MICROphones, to name a few, have seen immense utilization, particularly in the consumer electronics market, because of their compact sizes and minute power consumptions. In addition, these devices benefit from batch fabrication, which has enabled year-over-year reductions in cost [2]. In recent years,
上傳時間： 2020-06-06
上傳用戶：shancjb
MICRO-Electro-Mechanical Systems (MEMS) are miniature systems composed ofintegratedelectricalandmechanicalpartstosenseand/orcontrolthingsonaμmscale. The concept of MEMS is attributed to Richard Feynman’s famous talk on December 29th, 1959 [2,3]. Dr. Feynman foresaw many aspects of future MEMS development with his insight in MICROphysics. In particular, material properties in the μm scale are differentfrombulkpropertiesandthescalingdownofintegratedcircuits(IC)fabrication technology has been a major driving force of MEMS development.
標簽： Performance High MEMS RF
上傳時間： 2020-06-06
上傳用戶：shancjb
Recent advancements in nanotechnology (NT) materials and growth of MICRO/ nanotechnology have opened the door for potential applications of MICROelectro- mechanical systems (MEMS)- and NT-based sensors and devices. Such sensors and devices are best suited for communications, medical diagnosis, commercial, military, aerospace, and satellite applications. This book comes at a time when the future and well-being of Western industrial nations in the twenty-first century’s global eco- nomy increasingly depend on the quality and depth of the technological innovations they can commercialize at a rapid pace.
標簽： MEMS
上傳時間： 2020-06-06
上傳用戶：shancjb
The solid high-polymer-film-type fuel cell (PEM-FC) system is used as the power supply equipment for transportation and replaces an internal combustion engine. A reduction of the environmental load is expected through the cogeneration system’s (CGS) use of the PEM-FC system as a distributed power supply to individual houses, apartments, and so forth [1–3]. The growing use of distributed power systems, such as fuel cells, the reduction of power-transmission losses, and an increase of waste heat recovery are expected. Therefore, the reduction of carbon- dioxide emission is also expected as compared to conventional energy supply methods using commercial electric power.
標簽： MICRO-grids Fuel Cell
上傳時間： 2020-06-07
上傳用戶：shancjb
常用接插件USB座 SD卡 TF卡 RJ45 AD集成庫ALITUM庫49個合集（原理圖庫+PCB封裝庫），集成封裝庫型號列表：Library Component Count : 49Name Description----------------------------------------------------------------------------------------------------3F07 立體聲耳機插座6.3mm插簧 6.3mm插簧Battery 備份電池CON 2X16 DIN41612 DIN 41612CON 2X32 DIN41612 DIN 41612CON50A D Connector 15 VGAD Connector 9 串口DB25 并口DG141 DIMM-100 接插件EMIF 接插件FIN 散熱片FPC-30P FPC排線連接器FPC-40P FPC排線連接器HR5803 以太網接口HR911103A 網絡接口HR911105A 以太網接口Header 10 接插件Header 10X2 接插件Header 14X2A 接插件Header 15X2 接插件Header 16 接插件Header 16X2 接插件Header 17X2 接插件Header 2 接插件Header 2X2 接插件Header 3 接插件Header 30 接插件Header 32X2 接插件Header 4 接插件Header 40 接插件Header 5X2 接插件Header 6 接插件Header 7X2 接插件Header 8 接插件Header 8X2 接插件Header_AMP50 控制器接插件LCD_CON37 LCD接口Light_Pipe 燈柱PJ-306 立體聲耳機插座PWRCON 直流電源端子RCA RCA Phono JackSDCARD SD卡自彈SDCARD-M TF卡槽SU-25-3 接線叉USB USB接口USB_M MICRO/Mini USBZIF20 接插件
上傳時間： 2021-11-21
上傳用戶：slq1234567890
USB_MICRO USB_MNI USB扁口座 TF卡槽 SOIC8 LQFP32芯片ALTIUM 庫（3D PCB封裝庫）, 3D封裝，已在項目中使用，可以做為你的設計參考。詳細列表如下：Component Count : 94Component Name-----------------------------------------------32165032-8MHZAMS1117ANT2AntennaBATbuzzerCapCAP-0805CAP-3216CD32Crystal Oscillator 3225HC-06KEY-2PINLED-0603LQFP-100LQFP32LQFP44LQFP44 10X10_LLQFP44 10X10_MLQFP44 10X10_NLQFP48LQFP48 7X7_LLQFP48 7X7_MLQFP48 7X7_NLQFP64 10x10_LLQFP64 10x10_MLQFP64 10x10_NMagMOTONRF24L01NRF24L01-modeOLED-0.96-PIN7QFN20_4X4QFN24_4X4QFN32_5X5remoteRES-0603RFX2401CRPSG90SH1.0mm-4PINSH1.0MM-5PINSH1.0mm-6PINSMA-ANTSMA/DO-214SOIC-8SOP16SOT-23-3SOT-23-5SOT-89SOT-223SPL06-001STM32F030C8T6STM32F030F4P6STM32F103C8T6straight-1x2pinstraight-1x2pin - duplicatestraight-1x2pin - duplicate1straight-1x3pinstraight-1x3pin - duplicatestraight-1x3pin - duplicate1straight-1x4pinstraight-1x4pin - duplicatestraight-1x5pinstraight-1x8pinstraight-1x8pin - duplicatestraight-2x2pinstraight-2x3pinstraight-2x4pinstraight-2x5pinSW-NO/OFF-PIN3SW-SMD1SW-SMD2SWITCH-DIP-6*6*7SX1308TF-CARDTO-263-5TP4056USBUSB_MICROUSB_MNI_BUSB-MICRO-1winding_1x2pinwinding_1x3pinwinding_1x4pinwinding_1x5pinwinding_1x8pinwinding_2x2pinwinding_2x3pinwinding_2x4pinwinding_2x5pinXTAL-5070/SMDXTAL-QC49/SMD
標簽： usb
上傳時間： 2021-12-02
上傳用戶：aben
STM32L475開發板PDF原理圖+AD集成3D封裝庫+主要器件技術手冊，集成封裝庫型號列表如下：Library Component Count : 44Name Description----------------------------------------------------------------------------------------------------ANT-2.4G ANT,2.4G,PCB天線ATK-TEST-1*4-2.54mm 測試點ATK_MODULE 單排母,1*6,2.54mmBEEP 3.3V有源蜂鳴器BUTTON_DIP3 撥動開關SS-12F44C-0402-SMD C-0603-SMD C-CAP-SMD-220uF/10V C-CEP-220uF/16V D-1N4148 Header-1*3-2.54mm 單排針-2.54mmHeader-2*10-2.54mm 雙排針-2.54mmHeader-2*2-2.54mm 雙排針-2.54mmHeader-2*3-2.54mm 雙排針-2.54mmHeader-2*4-2.54mm 雙排座-2.54mmIR-LED 1206紅外發射管（側）IR-LF0038GKLL-1 紅外接收管SMDJ-MICRO-USB-5S MICRO USB 5.9有柱腳長1.25加長針L-0420-4.7uH 電感,4.7uH,3ALCD-TFT-H13TS38A LCD,TFT,1.3'240*240,禹龍LED-0603-RED 發光二極管-紅色LED-RGB-1615-0603 RGB,共陽,1615,0603MIC-6022 MICMotor-SMD 電機,SMDPhone-3-M 耳機座,三節R-0402-SMD 貼片電阻R-0805-SMD 貼片電阻RT9193-3.3S-KEY-SMD-324225 KEY,SMD,324225S8050-SMD SD-MICRO-TF SD,MICRO,TFU-AHT10 Sensor,溫濕度傳感器U-AP3216C Sensor.光照/距離U-AP6181 WIFI Module,SDIOU-ES8388 AUDIO,2-ch DAC,2-ch ADCU-ICM-20608 三軸陀螺儀/三軸加速度計,U-L9110S 電機驅動,800mAU-RT9013-3.3 LDO,500mAU-STM32F103C8T6 U-STM32L475VET6 MCU,LQFP100,512K FLASH,128K RAMU-W25Q128 SPI FLASH,16MY-12M-SMD 晶振 - 12M貼片Y-3215-32.768K XTAL,3215,32.768KY-3215-8M XTAL,3215,8MHz
上傳時間： 2021-12-15
上傳用戶：
