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  • 開關電源EMI設計(英文版)

    Integrated EMI/Thermal Design forSwitching Power SuppliesWei ZhangThesis submitted to the Faculty of theVirginia Polytechnic Institute and State Universityin partial fulfillment of the requirements for the degree of Integrated EMI/Thermal Design forSwitching Power SuppliesWei Zhang(ABSTRACT)This work presents the modeling and analysis of EMI and thermal performancefor switch power supply by using the CAD tools. The methodology and design guidelinesare developed.By using a boost PFC circuit as an example, an equivalent circuit model is builtfor EMI noise prediction and analysis. The parasitic elements of circuit layout andcomponents are extracted analytically or by using CAD tools. Based on the model, circuitlayout and magnetic component design are modified to minimize circuit EMI. EMI filtercan be designed at an early stage without prototype implementation.In the second part, thermal analyses are conducted for the circuit by using thesoftware Flotherm, which includes the mechanism of conduction, convection andradiation. Thermal models are built for the components. Thermal performance of thecircuit and the temperature profile of components are predicted. Improved thermalmanagement and winding arrangement are investigated to reduce temperature.In the third part, several circuit layouts and inductor design examples are checkedfrom both the EMI and thermal point of view. Insightful information is obtained.

    標簽: EMI 開關電源 英文

    上傳時間: 2013-11-16

    上傳用戶:萍水相逢

  • pci e PCB設計規范

    This document provides practical, common guidelines for incorporating PCI Express interconnect layouts onto Printed Circuit Boards (PCB) ranging from 4-layer desktop baseboard designs to 10- layer or more server baseboard designs. Guidelines and constraints in this document are intended for use on both baseboard and add-in card PCB designs. This includes interconnects between PCI Express devices located on the same baseboard (chip-to-chip routing) and interconnects between a PCI Express device located “down” on the baseboard and a device located “up” on an add-in card attached through a connector. This document is intended to cover all major components of the physical interconnect including design guidelines for the PCB traces, vias and AC coupling capacitors, as well as add-in card edge-finger and connector considerations. The intent of the guidelines and examples is to help ensure that good high-speed signal design practices are used and that the timing/jitter and loss/attenuation budgets can also be met from end-to-end across the PCI Express interconnect. However, while general physical guidelines and suggestions are given, they may not necessarily guarantee adequate performance of the interconnect for all layouts and implementations. Therefore, designers should consider modeling and simulation of the interconnect in order to ensure compliance to all applicable specifications. The document is composed of two main sections. The first section provides an overview of general topology and interconnect guidelines. The second section concentrates on physical layout constraints where bulleted items at the beginning of a topic highlight important constraints, while the narrative that follows offers additional insight.  

    標簽: pci PCB 設計規范

    上傳時間: 2014-01-24

    上傳用戶:s363994250

  • 8259 VHDL代碼

    a8259 可編程中斷控制 altera提供 The a8259 is designed to simplify the implementation of the interrupt interface  in 8088 and 8086  based microcomputer systems. The device is known as a programmable interrupt controller.  The a8259 receives and prioritizes up to 8 interrupts,  and in the cascade mode, this can be expanded up to  64 interrupts. An asynchronous reset and a clock input have been added to improve operation and reliability.

    標簽: 8259 VHDL 代碼

    上傳時間: 2015-01-02

    上傳用戶:panpanpan

  • 賽靈思電機控制開發套件簡介(英文版)

      The power of programmability gives industrial automation designers a highly efficient, cost-effective alternative to traditional motor control units (MCUs)。 The parallel-processing power, fast computational speeds, and connectivity versatility of Xilinx® FPGAs can accelerate the implementation of advanced motor control algorithms such as Field Oriented Control (FOC)。   Additionally, Xilinx devices lower costs with greater on-chip integration of system components and shorten latencies with high-performance digital signal processing (DSP) that can tackle compute-intensive functions such as PID Controller, Clark/Park transforms, and Space Vector PWM.   The Xilinx Spartan®-6 FPGA Motor Control Development Kit gives designers an ideal starting point for evaluating time-saving, proven, motor-control reference designs. The kit also shortens the process of developing custom control capabilities, with integrated peripheral functions (Ethernet, PowerLink, and PCI® Express), a motor-control FPGA mezzanine card (FMC) with built-in Texas Instruments motor drivers and high-precision Delta-Sigma modulators, and prototyping support for evaluating alternative front-end circuitry.

    標簽: 賽靈思 電機控制 開發套件 英文

    上傳時間: 2013-10-28

    上傳用戶:wujijunshi

  • xilinx FPGAs在工業中的應用

      The revolution of automation on factory floors is a key driver for the seemingly insatiable demand for higher productivity, lower total cost of ownership,and high safety. As a result, industrial applications drive an insatiable demand of higher data bandwidth and higher system-level performance.   This white paper describes the trends and challenges seen by designers and how FPGAs enable solutions to meet their stringent design goals.

    標簽: xilinx FPGAs 工業 中的應用

    上傳時間: 2013-11-08

    上傳用戶:yan2267246

  • 工業系統安全問題和解決辦法

    Abstract: As industrial control systems (ICSs) have become increasingly connected and use more off-the-shelfcomponents, new vulnerabilities to cyber attacks have emerged. This tutorial looks at three types of ICSs:programmable logic controllers (PLCs), supervisory control and data acquisition (SCADA) systems, anddistributed control systems (DCSs), and then discusses security issues and remedies. This document alsoexplains the benefits and limitations of two cryptographic solutions (digital signatures and encryption) andelaborates on the reasons for using security ICs in an ICS to support cryptography.

    標簽: 工業系統 安全問題

    上傳時間: 2013-10-09

    上傳用戶:woshinimiaoye

  • HDMI一致性測試

      The high defi nition multimedia interface (HDMI) is fastbecoming the de facto standard for passing digitalaudio and video data in home entertainment systems.This standard includes an I2C type bus called a displaydata channel (DDC) that is used to pass extended digitalinterface data (EDID) from the sinkdevice (such as adigital TV) to the source device (such as a digital A/Vreceiver). EDID includes vital information on the digitaldata formats that the sink device can accept. The HDMIspecifi cation requires that devices have less than 50pFof input capacitance on their DDC bus lines, which canbe very diffi cult to meet. The LTC®4300A’s capacitancebuffering feature allows devices to pass the HDMI DDCinput capacitance compliance test with ease.

    標簽: HDMI 測試

    上傳時間: 2013-11-21

    上傳用戶:tian126vip

  • DN427開關控制器故障保護電壓監測

      Have you had the exasperating experience of a laptop orPDA defi antly not responding to your commands? Youfrantically press key after key, but to no avail. As hopeturns to anger (but just before you throw the company’slaptop through the window) you slam your fi nger againstthe on/off power button. Ten seconds later, your laptopfi nally surrenders and the screen goes black in a highpitched whimper.

    標簽: 427 DN 開關控制器 故障保護

    上傳時間: 2013-12-10

    上傳用戶:Vici

  • IPC-9701A表面貼裝錫焊件性能測試與鑒定

    此規范建立了專用的測試方法,用于評估電子組裝件表面貼裝焊接件的性能及可靠性。對應于剛性電路結構、撓性電路結構和半剛性電路結構,表面貼裝焊接件的性能和可靠性被進一步劃分為不同等級。此外,還提供了一種相似方法,可以在電子組裝件的使用環境與條件下將這些性能測試結果與焊接件可靠性關聯起來.

    標簽: 9701 IPC 表面貼裝 性能測試

    上傳時間: 2013-11-10

    上傳用戶:ppeyou

  • LT5514三階互調的精確測量

      Accurate measurement of the third order intercept pointfor low distortion IC products such as the LT5514 requirescertain precautions to be observed in the test setup andtesting procedure. The LT5514 linearity performance ishigh enough to push the test equipment and test set-up totheir limits. A method for accurate measurement of thirdorder intermodulation products, IM3, with standard testequipment is outlined below.It is also important to correctly interpret the LT5514specification with respect to ROUT, and the impact ofdemo-board transmission-line termination loss whenevaluating the linearity performance, as explained in theLT5514 Datasheet and in Note 1 of this document.

    標簽: 5514 LT 三階互調 精確測量

    上傳時間: 2013-11-14

    上傳用戶:l254587896

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